Abstract: The present invention relates to a method for enhancing boiling performance of chip surface comprising steps of mounting a heat pipe directly above the surface of the chip, and forming a porous structure for increasing the vaporization core on an upper surface of the heat pipe. Performing an enhancing treatment in boiling of the upper surface of the heat pipe by mounting the heat pipe directly above the chip makes a temperature field of the boiling surface uniform, increases the boiling area and vaporization core, strengthens the boiling heat transfer, and reduces the core temperature of the chip.

Abstract: The present invention relates to an air-vapor separation device for separating air from refrigerant vapor comprising an air-vapor separation tank, a separation membrane, a mixed gas input passage, a refrigerant vapor output passage, and a control unit, wherein the mixed gas input passage is provided with a compressor and a first control valve, and the refrigerant vapor output passage is provided with a second control valve. The air-vapor separation device of the present invention has the advantages of simple structure, convenient operation, and is reliable and effective in separation of air and refrigerant vapor, with good separation effect.

Abstract: The present invention relates to an air-vapor separation device for separating air from refrigerant vapor comprising an air-vapor separation tank, a separation membrane, a mixed gas input passage, a refrigerant vapor output passage, and a control unit, wherein the mixed gas input passage is provided with a compressor and a first control valve, and the refrigerant vapor output passage is provided with a second control valve. The air-vapor separation device of the present invention has the advantages of simple structure, convenient operation, and is reliable and effective in separation of air and refrigerant vapor, with good separation effect.

Abstract: A cooling device of a heating element for an immersion type liquid cooling server, and a manufacturing method for the cooling device. The cooling device comprises: a metal substrate provided on the heating element and covering same. The metal substrate is adjacent to the surface of the heating element. The surface of the metal substrate distant to the heating element comprises a porous metal covering layer located above the heating element and covering same. The porous metal covering layer is exposed on the surface of the metal substrate remote from the heating element and has a thickness of less than 3 mm. By providing a metal substrate having a porous metal covering layer on the surface of a heating element, vaporization cores are improved, the boiling performance of the heating element is improved, and an efficient heat-dissipating effect on the surface of the heating element is achieved.

Abstract: The present invention relates to an air-vapor separation method for separating air from refrigerant vapor in an immersed liquid-cooling system. The immersed liquid-cooling system comprises an immersed server blade cabinet, a condensing device, an air-vapor separator and a refrigerant storage tank, wherein the refrigerant storage tank supplies a liquid refrigerant to the immersed server blade cabinet, and the liquid refrigerant undergoes a phase change to be vaporized into a refrigerant vapor for cooling of the heating element in the immersed server blade cabinet; the condensing device condenses the refrigerant vapor; the air-vapor separator separates a mixed gas in the immersed liquid-cooling system into the air and the refrigerant vapor. The cooling efficiency of the liquid-cooling system is improved by effectively separating the air from the refrigerant vapor in the liquid-cooling system.

Abstract: The present invention relates to a method for enhancing boiling performance of chip surface comprising steps of mounting a heat pipe directly above the surface of the chip, and forming a porous structure for increasing the vaporization core on an upper surface of the heat pipe. Performing an enhancing treatment in boiling of the upper surface of the heat pipe by mounting the heat pipe directly above the chip makes a temperature field of the boiling surface uniform, increases the boiling area and vaporization core, strengthens the boiling heat transfer, and reduces the core temperature of the chip.

Abstract: The present invention relates to an air-vapor separation method for separating air from refrigerant vapor in an immersed liquid-cooling system. The immersed liquid-cooling system comprises an immersed server blade cabinet, a condensing device, an air-vapor separator and a refrigerant storage tank, wherein the refrigerant storage tank supplies a liquid refrigerant to the immersed server blade cabinet, and the liquid refrigerant undergoes a phase change to be vaporized into a refrigerant vapor for cooling of the heating element in the immersed server blade cabinet; the condensing device condenses the refrigerant vapor; the air-vapor separator separates a mixed gas in the immersed liquid-cooling system into the air and the refrigerant vapor. The cooling efficiency of the liquid-cooling system is improved by effectively separating the air from the refrigerant vapor in the liquid-cooling system.

Abstract: A cooling device of a heating element for an immersion type liquid cooling server, and a manufacturing method for the cooling device. The cooling device comprises: a metal substrate provided on the heating element and covering same. The metal substrate is adjacent to the surface of the heating element. The surface of the metal substrate distant to the heating element comprises a porous metal covering layer located above the heating element and covering same. By providing a metal substrate having a porous metal covering layer on the surface of a heating element, vaporization core is improved, the boiling performance of the heating element is improved, and an efficient heat-dissipating effect on the surface of the heating element is achieved.