Abstract: A method of manufacturing a display device, includes: providing an adhesive tape including: an adhesive conductive layer on a base film, a cutting width corresponding to a width of an adhesive tape attaching area of a substrate and provided in plurality including cutting widths adjacent to each other along the base film, and an interval between the cutting widths adjacent to each other; within the interval, providing a plurality of half-cuts in the adhesive tape, to provide a multi-cut adhesive tape; and pressing the multi-cut adhesive tape to the substrate, at a first portion of the multi-cut adhesive tape which corresponds to the cutting width, to separate the first portion of the multi-cut adhesive tape from the base film and attach the first portion of the multi-cut adhesive tape to the substrate at the adhesive tape attaching area thereof.

Abstract: A method of manufacturing a display device, includes: providing an adhesive tape including: an adhesive conductive layer on a base film, a cutting width corresponding to a width of an adhesive tape attaching area of a substrate and provided in plurality including cutting widths adjacent to each other along the base film, and an interval between the cutting widths adjacent to each other; within the interval, providing a plurality of half-cuts in the adhesive tape, to provide a multi-cut adhesive tape; and pressing the multi-cut adhesive tape to the substrate, at a first portion of the multi-cut adhesive tape which corresponds to the cutting width, to separate the first portion of the multi-cut adhesive tape from the base film and attach the first portion of the multi-cut adhesive tape to the substrate at the adhesive tape attaching area thereof.

Abstract: A flexible display device according to an example embodiment includes: a substrate; a driver integrated circuit (IC) in a non-display portion of the substrate and configured to supply a driving voltage to a display portion of the substrate; a flexible printed circuit board attached to the non-display portion at an outer side of the driver IC; and a printed circuit board attached to the flexible printed circuit board and configured to transfer the driving voltage to the driver IC, wherein the driver IC comprises a base layer, a plurality of bumps at a bottom surface of the base layer, a first layer at an upper surface of the base layer, and second layers at the first layer to correspond to locations of the plurality of bumps.

Abstract: A bonded assembly including: a first electronic component including a first substrate and a plurality of first electrodes disposed in a pressed area at a first height from a surface of the first substrate; a second electronic component including a second substrate and a plurality of second electrodes disposed at a second height from a surface of the second substrate, a second electrode overlapping with a corresponding first electrode to face the first electrode; a conductive bonding layer disposed between the first electrode and the second electrode overlapped with each other to bond the first electrode and the second electrode; and at least one spacer disposed between the first substrate and the second substrate to overlap the pressed area, the at least one spacer having a thickness that is greater than a value obtained by summing the first height and the second height.

Abstract: A bonded assembly including: a first electronic component including a first substrate and a plurality of first electrodes disposed in a pressed area at a first height from a surface of the first substrate; a second electronic component including a second substrate and a plurality of second electrodes disposed at a second height from a surface of the second substrate, a second electrode overlapping with a corresponding first electrode to face the first electrode; a conductive bonding layer disposed between the first electrode and the second electrode overlapped with each other to bond the first electrode and the second electrode; and at least one spacer disposed between the first substrate and the second substrate to overlap the pressed area, the at least one spacer having a thickness that is greater than a value obtained by summing the first height and the second height.

Abstract: A flexible display device according to an example embodiment includes: a substrate; a driver integrated circuit (IC) in a non-display portion of the substrate and configured to supply a driving voltage to a display portion of the substrate; a flexible printed circuit board attached to the non-display portion at an outer side of the driver IC; and a printed circuit board attached to the flexible printed circuit board and configured to transfer the driving voltage to the driver IC, wherein the driver IC comprises a base layer, a plurality of bumps at a bottom surface of the base layer, a first layer at an upper surface of the base layer, and second layers at the first layer to correspond to locations of the plurality of bumps.

Abstract: A display device includes a substrate including a wiring portion, a pad unit provided on the substrate and extended from the wiring portion, an integrated circuit chip electrically connected to the pad unit and mounted on the substrate, and an anisotropic conductive film configured to electrically connect the pad unit and the integrated chip to each other. The anisotropic conductive film includes an adhesive layer provided between the pad unit and the integrated circuit chip and at least one conductive ball scattered in the adhesive layer. A heat generator is also provided on the substrate. The heat generator is configured to come into contact with the anisotropic conductive film to supply heat to the anisotropic conductive film.

Abstract: A display device includes a substrate including a wiring portion, a pad unit provided on the substrate and extended from the wiring portion, an integrated circuit chip electrically connected to the pad unit and mounted on the substrate, and an anisotropic conductive film configured to electrically connect the pad unit and the integrated chip to each other. The anisotropic conductive film includes an adhesive layer provided between the pad unit and the integrated circuit chip and at least one conductive ball scattered in the adhesive layer. A heat generator is also provided on the substrate. The heat generator is configured to come into contact with the anisotropic conductive film to supply heat to the anisotropic conductive film.