Abstract: The present disclosure provides a smart speaker, which comprises a first inner casing, a second inner casing, a first housing, a second housing, and a first director group. The first inner casing comprises at least one first speaking unit. The second inner casing is disposed on the first inner casing and comprises at least one second speaking unit and at least one active antenna module. The first housing surrounds and covers the first inner casing, and the second housing surrounds and covers the second inner casing. The first director group is disposed at one side of the second housing facing the second inner casing, and the position of the first director group corresponds to at least one active antenna module.

Abstract: Disclosed is a wireless earset including a housing, and a first antenna, a second antenna, a switching circuit, and a control circuit disposed in the housing. There is an interval between a first position where the first antenna is disposed in the housing and a second position where the second antenna is disposed in the housing. The first antenna and the second antenna generate different radiation patterns. The control circuit controls the switching circuit to electrically connect the first antenna or the second antenna, so that the first antenna and the second antenna transmit a first radio frequency signal output by the control circuit at different times. The control circuit determines a received signal strength of the first antenna and the second antenna, and controls the switching circuit to connect the first antenna or the second antenna with a greater received signal strength to receive a second radio frequency signal.

Abstract: An example optoelectronic module includes a housing that extends between a first end portion and a second end portion. The optoelectronic module includes a printed circuit board (“PCB”) that includes an electrical connector at the second end portion of the housing, at least one transmitter electrically coupled to the PCB and optically coupled with at least one optical fiber, at least one receiver electrically coupled to the PCB and optically coupled with at least one optical fiber, and at least one electromagnetic interference (“EMI”) attenuating component formed of a plastic material that is configured to attenuate EMI. The EMI attenuating component is configured to attenuate EMI generated by one or more other components of the optoelectronic module.

Abstract: An example optoelectronic module includes a housing that extends between a first end portion and a second end portion. The optoelectronic module includes a printed circuit board (“PCB”) that includes an electrical connector at the second end portion of the housing, at least one transmitter electrically coupled to the PCB and optically coupled with at least one optical fiber, at least one receiver electrically coupled to the PCB and optically coupled with at least one optical fiber, and at least one electromagnetic interference (“EMI”) attenuating component formed of a plastic material that is configured to attenuate EMI. The EMI attenuating component is configured to attenuate EMI generated by one or more other components of the optoelectronic module.

Abstract: An example optoelectronic module includes a housing that extends between a first end portion and a second end portion. The optoelectronic module includes a printed circuit board (“PCB”) that includes an electrical connector at the second end portion of the housing, at least one transmitter electrically coupled to the PCB and optically coupled with at least one optical fiber, at least one receiver electrically coupled to the PCB and optically coupled with at least one optical fiber, and at least one electromagnetic interference (“EMI”) attenuating component formed of a plastic material that is configured to attenuate EMI. The EMI attenuating component is configured to attenuate EMI generated by one or more other components of the optoelectronic module.

Abstract: An example optoelectronic module includes a housing that extends between a first end portion and a second end portion. The optoelectronic module includes a printed circuit board (“PCB”) that includes an electrical connector at the second end portion of the housing, at least one transmitter electrically coupled to the PCB and optically coupled with at least one optical fiber, at least one receiver electrically coupled to the PCB and optically coupled with at least one optical fiber, and at least one electromagnetic interference (“EMI”) attenuating component formed of a plastic material that is configured to attenuate EMI. The EMI attenuating component is configured to attenuate EMI generated by one or more other components of the optoelectronic module.

Abstract: An electromagnetic shielding configuration comprising a first electrically conductive wall having a first surface and a second electrically conductive wall having a second surface. The first surface is oppositely disposed from the second surface, wherein interfacing of the first conductive wall and the second conductive wall forms an enclosure wall. The first surface comprises at least one stepped edge forming a plurality of surfaces of unequal lateral displacement, and a corrugated surface on at least one of the plurality of surfaces, the corrugated surface formed by a series of apices extending radially from the first surface. The second surface is substantially a conjugate of the first surface.

Abstract: An electromagnetic shielding configuration comprising a first electrically conductive wall having a first surface and a second electrically conductive wall having a second surface. The first surface is oppositely disposed from the second surface, wherein interfacing of the first conductive wall and the second conductive wall forms an enclosure wall. The first surface comprises at least one stepped edge forming a plurality of surfaces of unequal lateral displacement, and a corrugated surface on at least one of the plurality of surfaces, the corrugated surface formed by a series of apices extending radially from the first surface. The second surface is substantially a conjugate of the first surface.

Abstract: An electromagnetic shielding configuration comprising a first electrically conductive wall having a first surface and a second electrically conductive wall having a second surface. The first surface is oppositely disposed from the second surface, wherein interfacing of the first conductive wall and the second conductive wall forms an enclosure wall. The first surface comprises at least one stepped edge forming a plurality of surfaces of unequal lateral displacement, and a corrugated surface on at least one of the plurality of surfaces, the corrugated surface formed by a series of apices extending radially from the first surface. The second surface is substantially a conjugate of the first surface.

Abstract: Methods for providing a direct connect RF pin configuration for an ONU transceiver module to connect directly to an external component. The ONU module communicates with an optical network. The ONU module further includes an RF interface and a direct connect RF pin configuration to communicate using RF signals. In one embodiment, the direct connect RF pin configuration includes two ground pins and a data pin which are spaced apart and directly connected to a PCB of the ONU. The opposing ends of the pins are directly connected to a PCB of an external component, such as an ONU host box. The pins are thus spaced apart such that they do not impede each others' function and available for direct connection to the external component.

Abstract: Methods and systems for an optical line termination including instructions stored on a computer-readable medium, the instructions including a digital diagnostic table, and a plurality of entries within the diagnostic table, wherein a first entry is associated with a first optical network unit, the first entry including at least one setting for performing burst mode digital diagnostic processes using a first burst mode transmission received from the first optical network unit.

Abstract: Pluggable ONU transceiver modules are disclosed that include an optical connector configured to connect to an optical network. The pluggable ONU transceiver modules further includes a transmit line including a laser driver and a laser. The pluggable ONU transceiver modules further includes a first receive line including a first optical receiver and a first post amplifier. The pluggable ONU transceiver modules further includes a second receive line including a second optical receiver and a second post amplifier. The pluggable ONU transceiver modules further includes a combined input/output (I/O) and video contacts electrically coupled to the laser driver, first post amplifier, and second post amplifier.

Abstract: Systems and method for using a direct connect RF pin configuration for an ONU transceiver module to connect directly to an external component. The ONU module communicates with an optical network. The ONU module further includes an RF interface and a direct connect RF pin configuration to communicate using RF signals. In one embodiment, the direct connect RF pin configuration includes two ground pins and a data pin which are spaced apart and directly connected to a PCB of the ONU. The opposing ends of the pins are directly connected to a PCB of an external component, such as an ONU host box. The pins are thus spaced apart such that they do not impede each others' function and available for direct connection to the external component.

Abstract: In one example embodiment, an electromagnetic radiation (EMR) shield includes a central portion, an opening defined in the central portion, a wing attached to and extending outward from the central portion, and a protrusion defined in the wing. The perimeter of the EMR shield is approximately the same size and shape as that of a portion of an associated optical subassembly (OSA).

Abstract: An electromagnetic shielding configuration comprising a first electrically conductive wall having a first surface and a second electrically conductive wall having a second surface. The first surface is oppositely disposed from the second surface, wherein interfacing of the first conductive wall and the second conductive wall forms an enclosure wall. The first surface comprises at least one stepped edge forming a plurality of surfaces of unequal lateral displacement, and a corrugated surface on at least one of the plurality of surfaces, the corrugated surface formed by a series of apices extending radially from the first surface. The second surface is substantially a conjugate of the first surface.

Abstract: An AC differential connection assembly between a trans-impedance amplifier and a post amplifier for burst mode receiving comprising means for coupling a differential output of the trans-impedance amplifier to a differential input of the post amplifier, the means for coupling comprises a coupling capacitor assembly; and a switching circuit coupled across the differential input of the post amplifier, the switching circuit having an ‘on’ state with low impedance and an ‘off’ state with high impedance; wherein during burst mode receiving, the switching circuit is in the ‘off’ state and the coupling capacitor assembly having a time constant to maintain a stable DC level such that a payload is received accurately by the differential input of the post amplifier; and during an idle period, the switching circuit is in the ‘on’ state and the coupling capacitor assembly having a time constant to recover a DC level of the differential output of the trans-impedance amplifier.

Abstract: An optical subassembly (“OSA”) for use in optical communications modules is disclosed. The OSA solves various issues related to the insertion and removal of an optical fiber connector into and from the OSA receptacle, including hard plug, wiggle performance, and shavings production. In one embodiment, an optical communications module is disclosed and includes a housing and an optical subassembly of the present invention partially contained within the housing. The optical subassembly includes various components, including a body composed of a first material, and a plug receptacle formed with the body. The plug receptacle includes an inner surface on which surface features, such as threads, are formed. A hollow cylindrical sleeve composed of a second material is received in the plug receptacle such that the outer sleeve surface engages the surface features of the plug receptacle inner surface and such that an optical fiber connector can be received by the sleeve.

Abstract: An AC differential connection assembly between a trans-impedance amplifier and a post amplifier for burst mode receiving comprising means for coupling a differential output of the trans-impedance amplifier to a differential input of the post amplifier, the means for coupling comprises a coupling capacitor assembly; and a switching circuit coupled across the differential input of the post amplifier, the switching circuit having an ‘on’ state with low impedance and an ‘off’ state with high impedance; wherein during burst mode receiving, the switching circuit is in the ‘off’ state and the coupling capacitor assembly having a time constant to maintain a stable DC level such that a payload is received accurately by the differential input of the post amplifier; and during an idle period, the switching circuit is in the ‘on’ state and the coupling capacitor assembly having a time constant to recover a DC level of the differential output of the trans-impedance amplifier.

Abstract: Systems and method for using a direct connect RF pin configuration for an ONU transceiver module to connect directly to an external component. The ONU module communicates with an optical network. The ONU module further includes an RF interface and a direct connect RF pin configuration to communicate using RF signals. In one embodiment, the direct connect RF pin configuration includes two ground pins and a data pin which are spaced apart and directly connected to a PCB of the ONU. The opposing ends of the pins are directly connected to a PCB of an external component, such as an ONU host box. The pins are thus spaced apart such that they do not impede each others' function and available for direct connection to the external component.

Abstract: In one example embodiment, an electromagnetic radiation (EMR) shield includes a central portion, an opening defined in the central portion, a wing attached to and extending outward from the central portion, and a protrusion defined in the wing. The perimeter of the EMR shield is approximately the same size and shape as that of a portion of an associated optical subassembly (OSA).