Patents by Inventor Jinyan HU

Jinyan HU has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240008167
    Abstract: An example heat dissipation apparatus is connected to a heat sink. The example heat dissipation apparatus includes a first circuit board, a second circuit board, a support post, a main heat generation component, and a thermal conductive assembly. The second circuit board is located on a side of the first circuit board, and is spaced from the first circuit board. The support post is connected between the first circuit board and the second circuit board to form an air layer between the first circuit board and the second circuit board. The main heat generation component is mounted on the second circuit board. The thermal conductive assembly is connected between a second thermal conductive layer of the first circuit board and a third thermal conductive layer of the second circuit board.
    Type: Application
    Filed: November 29, 2021
    Publication date: January 4, 2024
    Inventors: Lan LI, Linfang JIN, Jinyan HU
  • Publication number: 20210255746
    Abstract: An application control method and an electronic device are provided. The method includes: The electronic device displays a first user interface of a first application, where the first user interface has N graphical controls; and the electronic device updates the first user interface if a temperature of the electronic device is less than or equal to a first preset temperature, so that an updated first user interface has less than N graphical controls, where N is a natural number greater than 1. In this manner, when the electronic device has a relatively low temperature, a user may be restricted from using some functions of an application.
    Type: Application
    Filed: July 20, 2018
    Publication date: August 19, 2021
    Inventors: Jinyan HU, Linfang JIN, Siyang LI
  • Publication number: 20210195794
    Abstract: The present invention belongs to the technical field of liquid-cooling heat dissipation, wherein discloses a novel mechanical pump liquid-cooling heat dissipation system, comprising an external radiator, a circulating pipe and a mechanical pump, wherein the circulating pipe communicates the external radiator with the circulating pipe to form a circulation loop, the mechanical pump includes a volute in the form of a hollow cylinder, a fixing surface is formed at one end of the volute, the fixing surface is planar and is part of the outer surface of the volute, a layer of heat-conducting silicone grease is coated on the fixing surface, the fixing surface and a heat source are fixed through pressure lamination, and the heat-conducting silicone grease is attached to the fixing surface and the heat source; and the mechanical pump takes away heat of the heat source and transfers it to a cooling working medium while pumping the cooling working medium to circulate in the circulation loop.
    Type: Application
    Filed: April 24, 2017
    Publication date: June 24, 2021
    Applicant: HUAZHONG UNIVERSITY OF SCIENCE AND TECHNOLOGY
    Inventors: Xiaobing LUO, Falong LIU, Bin DUAN, Han WU, Jinyan HU, Ruikang WU, Xingjian YU
  • Patent number: 10495093
    Abstract: A micro-hydraulic suspension mechanical pump includes a volute, an upper cover, an impeller, a brushless motor, a waterproof sleeve and water lubrication spiral groove thrust bearings, each having stationary and rotating rings. A water inlet and a water outlet channel are provided on the volute, and a middle water inlet hole is formed on the upper cover. The water lubrication spiral groove thrust bearings are provided above and below a magnetic steel rotor. During operation of the micro-hydraulic suspension mechanical pump, a liquid film is formed between the stationary ring and the rotating ring to enable the magnetic steel rotor to be suspended, and a liquid film is formed between the outer wall of the rotor sleeve and the inner wall of the waterproof sleeve. Due to suspension of the rotor, wear caused contact is avoided, and service life of the micromechanical pump is improved.
    Type: Grant
    Filed: January 19, 2017
    Date of Patent: December 3, 2019
    Assignee: HUAZHONG UNIVERSITY OF SCIENCE AND TECHNOLOGY
    Inventors: Xiaobing Luo, Falong Liu, Bin Duan, Han Wu, Jinyan Hu, Xingjian Yu
  • Publication number: 20190226485
    Abstract: A micro hydraulic suspension mechanical pump with a volute, an upper cover, an impeller, a brushless motor, a waterproof sleeve and the water lubrication spiral groove thrust bearings, in which a water inlet channel and a water outlet channel are provided on the volute, and a middle water inlet hole is formed on the upper cover. The brushless motor includes a motor shell, a coil, a magnetic steel rotor, a waterproof sleeve, a rotor sleeve and a rotor rotating shaft; and above and below the magnetic steel rotor are respectively provided one water lubrication spiral groove thrust bearing. A liquid film can be formed between the stationary ring and the rotating ring to enable the magnetic steel rotor to be suspended, and a liquid film can also be formed between the outer wall of the rotor sleeve and the inner wall of the waterproof sleeve.
    Type: Application
    Filed: January 19, 2017
    Publication date: July 25, 2019
    Applicant: HUAZHONG UNIVERSITY OF SCIENCE AND TECHNOLOGY
    Inventors: Xiaobing LUO, Falong LIU, Bin DUAN, Han WU, Jinyan HU, Xingjian YU
  • Patent number: 9023681
    Abstract: The present invention discloses a method of fabricating a heterojunction battery, comprising the steps of: depositing a first amorphous silicon intrinsic layer on the front of an n-type silicon wafer, wherein the n-type silicon wafer may be a monocrystal or polycrystal silicon wafer; depositing an amorphous silicon p layer on the first amorphous silicon intrinsic layer; depositing a first boron doped zinc oxide thin film on the amorphous silicon p layer; forming a back electrode and an Al-back surface field on the back of the n-type silicon wafer; and forming a positive electrode on the front of the silicon wafer. In addition, the present invention further discloses a method of fabricating a double-sided heterojunction battery. In the present invention, the boron doped zinc oxide is used as an anti-reflection film in place of an ITO thin film; due to the special nature, especially the light trapping effect of the boron doped zinc oxide, the boron doped zinc oxide can achieve good anti-reflection.
    Type: Grant
    Filed: September 25, 2013
    Date of Patent: May 5, 2015
    Assignee: Chint Solar (Zhejiang) Co., Ltd.
    Inventors: Xinwei Niu, Cao Yu, Lan Ding, Junmei Rong, Shiyong Liu, Minghua Wang, Jinyan Hu, Weizhi Han, Yongmin Zhu, Hua Zhang, Tao Feng, Jianbo Jin, Zhanwei Qiu, Liyou Yang
  • Publication number: 20140308773
    Abstract: The present invention discloses a method of fabricating a heterojunction battery, comprising the steps of: depositing a first amorphous silicon intrinsic layer on the front of an n-type silicon wafer, wherein the n-type silicon wafer may be a monocrystal or polycrystal silicon wafer; depositing an amorphous silicon p layer on the first amorphous silicon intrinsic layer; depositing a first boron doped zinc oxide thin film on the amorphous silicon p layer; forming a back electrode and an Al-back surface field on the back of the n-type silicon wafer; and forming a positive electrode on the front of the silicon wafer. In addition, the present invention further discloses a method of fabricating a double-sided heterojunction battery. In the present invention, the boron doped zinc oxide is used as an anti-reflection film in place of an ITO thin film; due to the special nature, especially the light trapping effect of the boron doped zinc oxide, the boron doped zinc oxide can achieve good anti-reflection.
    Type: Application
    Filed: September 25, 2013
    Publication date: October 16, 2014
    Applicant: Chint Solar (Zhejiang) Co., Ltd.
    Inventors: Xinwei NIU, Cao YU, Lan DING, Junmei RONG, Shiyong LIU, Minghua WANG, Jinyan HU, Weizhi HAN, Yongmin ZHU, Hua ZHANG, Tao FENG, Jianbo JIN, Zhanwei QIU, Liyou YANG