Patents by Inventor Jiri Konicek

Jiri Konicek has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method for removing resin smear in through holes of printed circuit boards
    Patent number: 4162932
    Abstract: A method for the production of through holes in a laminate used for printed wiring and consisting of an insulating base of glass fiber reinforced thermosetting resin provided on at least one side with a thin continuous layer of copper or copper alloy, comprising laminating said layer of copper or copper alloy under heat and pressure to a final base-forming material consisting of at least one sheet of glass fiber reinforced thermosetting resin, subsequently drilling or punching holes in said laminate causing the formation of resin smear in said layer of copper or copper alloy and applying a water-jet stream to said resin smear to remove it from said laminate.
    Type: Grant
    Filed: October 26, 1977
    Date of Patent: July 31, 1979
    Assignee: Perstorp, AB
    Inventor: Jiri Konicek