Abstract: A device to detect the presence of a living being in a motor vehicle includes a carbon dioxide sensor to measure a concentration value representing the carbon dioxide concentration in the motor vehicle, an analysis unit to compare the concentration value or a change value representing the change in the concentration value over time to a threshold, a transmitting device activated when the concentration value or the change value exceeds the threshold and emitting radiated signals by way of an antenna and a receiving device that activates an indicator device when these radiated signals are received by way of an additional antenna.

Abstract: An apparatus for supplying energy to a sensor co-moved with a wheel of a vehicle, which contains a generator co-moved with the wheel of the vehicle, the generator generating electrical energy from vibrational motions of the vehicle.

Abstract: A device to detect the presence of a living being in a motor vehicle includes a carbon dioxide sensor to measure a concentration value representing the carbon dioxide concentration in the motor vehicle, an analysis unit to compare the concentration value or a change value representing the change in the concentration value over time to a threshold, a transmitting device activated when the concentration value or the change value exceeds the threshold and emitting radiated signals by way of an antenna and a receiving device that activates an indicator device when these radiated signals are received by way of an additional antenna.

Abstract: An apparatus for supplying energy to a sensor co-moved with a wheel of a vehicle, which contains a generator co-moved with the wheel of the vehicle, the generator generating electrical energy from vibrational motions of the vehicle.

Abstract: A mass flow sensor having a thin substrate and a resistor element arranged on the thin substrate. The thin substrate is stretched on a fixed substrate. In a stretched area, at which, in response to mechanical loading of the thin substrate, the mechanical stresses concentrate, a resistor element for detecting ruptures is arranged. As a result of a rupture in the stretched area, this rupture-detection resistor is interrupted, and the rupture can be confirmed due to the sudden increase in the resistance of the resistor, caused thereby.

Abstract: A sensor has a thin film element, the thin film element having a temperature-dependent electrical resistance. The thin film element includes a platinum layer, which is doped with zircon or zircon oxide. The thin film element can be arranged on a membrane to create a mass airflow sensor.

Abstract: An acceleration sensor has a seismic mass having movable electrodes. The movable electrodes are designed as differential capacitors between two fixed electrodes. Also provided are additional electrodes which are arranged opposite movable electrodes or opposite bending elements on which the seismic mass is suspended. Electrical voltages which are evaluated by the evaluation circuit as acceleration can be applied to the additional electrodes.

Abstract: A method for manufacturing sensors from a multilayer plate with upper and lower monocrystalline silicon layers and an etching layer between them. The upper silicon layer is structured by the introduction of troughs therein extending down to the etching layer. Sensor structures, such as a bending beam that is used in an acceleration sensor, are created by etching the etching layer beneath a part of the silicon layer structured in this manner.

Abstract: The pressure sensor for a combustion chamber includes a housing; a membrane closing the housing on its combustion chamber side; a monocrystalline silicon chip inside the housing and including a sensor circuit device provided with a bridge circuit device including a piezoresistor producing an electrical signal in response to applied pressure and a plunger positioned between the membrane and the silicon chip to transmit a pressure in the combustion chamber to the piezoresistor. The bridge circuit device is connected to an amplifier circuit located on the silicon chip. The amplifier circuit includes amplifier resistors having resistance values determinative of the offset of the signal and sensor sensitivity. A network circuit for offset and sensitivity adjustments is provided on the silicon chip and includes four adjusting circuits for offset, sensor sensitivity, temperature compensation of offset and for temperature compensation of sensor sensitivity.

Abstract: A force sensor employing a silicon chip having a force application area on a top surface and attached to a support at a bottom surface. Piezoresistive elements are arranged on the silicon chip in areas of high mechanical tension and produce signals. Circuits, which receive the signals produced by the piezoresistive elements, are arranged on the silicon chip in areas of low mechanical tension. The areas of mechanical tension may be influenced by providing grooves and/or recesses in the bottom surface of the silicon chip and by providing grooves in the top surface of the silicon chip.

Abstract: A contacting of a capacitive accelerometer sensor of monocrystalline material is achieved by a capacitive accelerometer sensor having a structure etched out of a monocrystalline layer arranged on a substrate, including a seismic mass that is only joined to the substrate by suspension segments and executing a movement in its longitudinal direction in response to the occurrence of an acceleration of parallel, plate-like first fingers extending out from this mass at right angles to their longitudinal direction and of plate-like second fingers running parallel to the first fingers and anchored to the substrate. The first and second fingers form a capacitor arrangement. The suspension segments, which are anchored with their end region that is distant from the seismic mass to the substrate, and second fingers are electrically isolated, by an isolation strip, from the other remaining layer of monocrystalline material.

Abstract: A method for manufacturing micro-mechanical components in which a structure is produced on a silicon layer, which is to be undercut in a further step. The silicon is selectively anodized for this undercutting operation. Thus, the method enables the manufacturing of micro-mechanical components that can be integrated together with bipolar circuit elements.

Abstract: A mass flow sensor includes a measuring element arranged on a membrane that is clamped in a frame. The sensor is formed by introducing a recess into a silicon wafer. Through the application of a recess having perpendicular walls, the thickness of the frame can be reduced, thus allowing the required surface area of the wafer to also be reduced.

Abstract: An acceleration sensor and a method of making an acceleration sensor is described in which a movable sensor element is located in a hollow space formed in the middle of three silicon plates. During production, air can be removed from the hollow space through a hole in one of the two outer plates. The hole is then closed by an additional plate, which allows for a defined pressure to be set in the hollow space.

Abstract: A mass-flow sensor includes a measuring element on a membrane and a media-temperature measuring element on a separate membrane. By configuring the media-temperature measuring element on a membrane, the mass-flow sensor quickly reacts to changes in the temperature of the flowing medium.

Abstract: A rotation rate sensor has a multi-layer structure including a monocrystalline silicon layer (10) which forms a carrier structure and a polysilicon layer (21), forming a second layer, and which includes a structural element (30) which acts as an oscillatory body. This structural element (30) is supported on the carrier structure (10) by a plurality of support strips (31), and is deflectable (2) perpendicularly to the major surface of the carrier structure (10). Capacitative or piezo-resistive detecting elements are formed from the second layer for detecting Coriolis force deflections (2), perpendicular to the major surface of said carrier (10) of the structural element (30).

Abstract: A microminiature valve in multi-layered structure for switching or controlling fluid flows is proposed, having an inlet and a closing element. The inlet is embodied in a first layer in the form of at least one through-opening. The closing element is structured out of a second layer which is applied on the first layer. This second layer has at least one further through-opening in the area of the closing element. The closing element is displaceable by actuation means, in particular electrical ones, essentially parallel to the first layer and the second layer, so that in at least one first position of the closing element the at least one through-opening of the inlet, together with the at least one further through-opening in the second layer, forms at least one flow-through opening. The cross section of the at least one flow-through opening can be varied by actuating the closing element.

Abstract: An integrated circuit having an adjusting component and an adjustable thyristor allows an especially small chip surface to be used. The integrated circuit has a control unit, by means of which the adjusting component is irreversibly switched. The thyristor is designed as a planar component.

Abstract: A method for producing capacitive sensors which is used in particular for the parallel production of capacitive sensors with exactly defined stray capacitance. For this purpose, troughs (15, 16, 17) are cut along or parallel to the splitting lines (6), so that adjustment errors in the position of the cut, during separation of the sensors, and variations in the cut width have no effect on the stray capacitance.

Abstract: A method for constructing a sensor, in particular an air mass sensor, is proposed, where at least one sensor element is structured from a wafer. The sensor element is separated from the wafer and placed on a substrate. In the course of structuring the sensor element by means of anisotropic etching, the outwardly located edges of the sensor element are simultaneously anisotropically etched, so that the sensor element is only connected with the wafer from which it has been structured by thin bridges, which are cut for separating the sensor element. By means of anisotropic etching an opening is made in a second wafer, which has a size corresponding to the geometric dimensions of the sensor element. To construct the sensor, the sensor element is inserted into the opening of the second wafer.