Abstract: The invention relates to a method for metallizing titanate-based ceramics, which is characterized by: (a) etching the ceramics, (b) activating the ceramics etched in step (a), and (c) chemically metallizing the ceramics obtained in step (b). In step (a), a sulfur solution in the concentration range of from 65 to 90% by weight is used for etching at a temperature of from 140 to 170° C.

Abstract: A process is described for the production of metal patterns on insulating substrates, especially of printed circuits, in which the substrates are provided with holes by means of electrical connections and the metal patterns are produced on the surface of the substrate with the aid of a negative mask in accordance with the subtractive process, said process being characterized by the following steps:treatment in gaseous sulfur trioxide;application of a negative mask which corresponds to the conductive pattern to be produced;through-hole-plating and subsequent plating of the conductive pattern, which is effected by the following steps in the process:activation by means of an ionogenic precious metal solution, treatment in a reducing agent solution, chemical or chemical and electrolytic deposit, in which the metal deposit takes place solely on the surface of the metal pattern which is to be produced.In addition, insulating substrates with metal patterns, especially printed circuits, are disclosed.

Abstract: Plastics and articles made therefrom are metal plated by conditioning their surface by a treatment with sulfur trioxide vapor or a sulfur trioxide containing atmosphere. The thus conditioned plastics or plastic articles are then metal plated, if required, after sensibilization, nucleation or activation, and treatment with a reducing solution. Metal plating is effected by chemical deposition of the metal or by electroplating. The resulting metal layer is reenforced, if required, also by chemical plating or electroplating. The resulting metal coating has a surprisingly high adhesive strength.