Abstract: A resin sheet is provided having low dielectric properties, and a circuit board material using such a sheet. The resin sheet includes a resin layer containing a cyclic polyolefin resin copolymer having a crystal melting peak temperature of less than 100° C., the resin sheet having a dielectric loss tangent at 12 GHz of less than 0.005.

Abstract: The present invention provides a filament for material extrusion 3D printer molding, which affords a molded article having soft texture and excellent heat resistance and among others, exhibits good moldability in molding by a material extrusion 3D printer. The present invention relates to a filament for material extrusion 3D printer molding, including a thermoplastic elastomer which contains at least a specific block copolymer and in which the ratio between storage modulus and loss modulus measured at 200° C. and 100 Hz by dynamic viscoelasticity measurement is in a specific range.

Abstract: A hair treatment composition, comprising, by weight of the total composition:—a) from 60 to 80 wt % isododecane, b) from 0.5 to 10 wt % isononyl isononanoate, and c) from 5 to 30 wt % of hydrogenated polyisobutene.

Abstract: The present invention provides a filament for material extrusion 3D printer molding, which affords a molded article having soft texture and excellent heat resistance and among others, exhibits good moldability in molding by a material extrusion 3D printer. The present invention relates to a filament for material extrusion 3D printer molding, including a thermoplastic elastomer which contains at least a specific block copolymer and in which the ratio between storage modulus and loss modulus measured at 200° C. and 100 Hz by dynamic viscoelasticity measurement is in a specific range.

Abstract: The purpose of the present invention is to provide a process for stably and continuously producing a water-absorbing resin, specifically, a process for stably and continuously producing a water-absorbing resin, the process including a gas absorbing step in which a gas discharged from a step of producing a water-absorbing resin is efficiently and persistently absorbed. A main point of this process for producing a water-absorbing polyacrylic acid (salt) resin further including a step of absorbing a gas discharged from a production step of the water-absorbing polyacrylic acid (salt) resin in water having a pH of 7 to 11 and a polyvalent metal ion content of 100 ppm or less or a step of absorbing the gas in water having a pH of 7 to 11, the pH of the water having been adjusted by mixing a water having an electric conductivity of 500 (?S/cm) or less at 25° C. with an alkali compound.

Abstract: The purpose of the present invention is to provide a process for stably and continuously producing a water-absorbing resin, specifically, a process for stably and continuously producing a water-absorbing resin, the process including a gas absorbing step in which a gas discharged from a step of producing a water-absorbing resin is efficiently and persistently absorbed. A main point of this process for producing a water-absorbing polyacrylic acid (salt) resin further including a step of absorbing a gas discharged from a production step of the water-absorbing polyacrylic acid (salt) resin in water having a pH of 7 to 11 and a polyvalent metal ion content of 100 ppm or less or a step of absorbing the gas in water having a pH of 7 to 11, the pH of the water having been adjusted by mixing a water having an electric conductivity of 500 (?S/cm) or less at 25° C. with an alkali compound.

Abstract: An apparatus for dressing a wafer polishing pad, including a disk-shaped dresser, an arm, and a control unit. The disk-shaped dresser is configured to be pressed against the polishing pad which rotates in a circumferential direction. The dresser is configured to rotate in a same direction as the polishing pad rotates due to frictional force generated between the dresser and the polishing pad. The arm is configured to support the dresser rotatably and to press the dresser against the polishing pad. The control unit is configured to control the arm to position the dresser such that a peripheral edge portion of the dresser is positioned outside a peripheral edge portion of the polishing pad by a predetermined distance.

Abstract: The invention provides a wafer polishing apparatus and a wafer manufacturing method which can improve uniformity in polishing wafer surfaces. A wafer holding head comprises a head body; a diaphragm stretched inside the head body; a carrier fixed to the diaphragm to be displaceable in the direction of a head axis while holding the wafer; a retainer ring disposed around the carrier in concentric relation and fixed to the diaphragm to be displaceable in the direction of the head axis; and a thin plate disposed so as to project from the head body along a surface of the diaphragm. With the provision of the thin plate, an excessive pressing force acting upon the retainer ring from the diaphragm is suppressed, and the wafer surface can be prevented from being excessively polished at an outer peripheral edge.