Patents by Inventor Jiro TSURUNO
Jiro TSURUNO has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11707849Abstract: A program identification method is for identifying an application program that is stored in a terminal device coupled to a robot system and that is used for teaching work on an operation of a robot provided in the robot system. The method includes: acquiring program information corresponding to the application program from the terminal device; and comparing the program information with first information stored in the robot system and thus identifying whether the application program is a first application program corresponding to the first information or not.Type: GrantFiled: September 1, 2020Date of Patent: July 25, 2023Assignee: SEIKO EPSON CORPORATIONInventors: Kosuke Kaga, Jiro Tsuruno, Naoki Tsukahara
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Patent number: 10945707Abstract: An ultrasonic transducer device includes a first substrate that is provided with a plurality of ultrasonic transducer elements arranged in a matrix, and a plurality of first wires via which the ultrasonic transducer elements are electrically connected to each other as a plurality of serial sets, and a second substrate that is provided to overlap the first substrate, and is provided with a plurality of second wires intersecting the first wires in a plan view from a thickness direction of the first substrate and third wires via which the first wires are electrically connected to the second wires.Type: GrantFiled: November 1, 2017Date of Patent: March 16, 2021Assignee: SEIKO EPSON CORPORATIONInventor: Jiro Tsuruno
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Publication number: 20210060791Abstract: A program identification method is for identifying an application program that is stored in a terminal device coupled to a robot system and that is used for teaching work on an operation of a robot provided in the robot system. The method includes: acquiring program information corresponding to the application program from the terminal device; and comparing the program information with first information stored in the robot system and thus identifying whether the application program is a first application program corresponding to the first information or not.Type: ApplicationFiled: September 1, 2020Publication date: March 4, 2021Inventors: Kosuke KAGA, Jiro TSURUNO, Naoki TSUKAHARA
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Patent number: 10603009Abstract: A piezoelectric device includes a piezoelectric film having a first surface in contact with a vibrating film and a second surface on the opposite side to the first surface, first and second electrodes that are provided on the second surface of the piezoelectric film and that are disposed at positions away from each other and are short-circuited to each other at a position away from the piezoelectric film, and a third electrode that is provided between the first and second electrodes on the second surface of the piezoelectric film and is disposed at a position away from the first and second electrodes. At least parts of the contours of end portions of the first and second electrodes are defined in parallel to side portions of the third electrode.Type: GrantFiled: May 27, 2016Date of Patent: March 31, 2020Assignee: SEIKO EPSON CORPORATIONInventors: Hiromu Miyazawa, Masayoshi Yamada, Hiroshi Ito, Tomoaki Nakamura, Hiroshi Matsuda, Jiro Tsuruno
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Patent number: 10363574Abstract: A piezoelectric element which includes a vibrating film, a piezoelectric body disposed on one surface of the vibrating film, and a horizontal electrode structure in which electrodes are disposed at a predetermined gap therebetween on the piezoelectric body. The vibrating film includes a recess portion in a portion corresponding to the predetermined gap in plan view.Type: GrantFiled: October 1, 2016Date of Patent: July 30, 2019Assignee: SEIKO EPSON CORPORATIONInventors: Hiromu Miyazawa, Hiroshi Ito, Tomoaki Nakamura, Masayoshi Yamada, Jiro Tsuruno, Tsukasa Funasaka
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Patent number: 10307137Abstract: An ultrasonic device includes a first element row in which ultrasonic transducer elements are arranged at line-symmetrical positions along a first straight line, where a second straight line orthogonal to the first straight line is the axis of symmetry, and are connected to a first interconnect, and a second element row in which ultrasonic transducer elements are arranged at line-symmetrical positions adjacent to the first element row, where the second straight line is the axis of symmetry, and are connected to a second interconnect. When the distance between a k-th element included in the first element row and a k-th element included in the second element row is represented by Dk, a relationship Dk<Dk+1 is satisfied with respect to at least one value of “k”.Type: GrantFiled: July 24, 2015Date of Patent: June 4, 2019Assignee: Seiko Epson CorporationInventors: Yusuke Nakazawa, Jiro Tsuruno
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Patent number: 10172590Abstract: An ultrasonic transducer device 100 includes a substrate 130, an ultrasonic transducer element array 110 that is provided on the substrate 130 and in which a plurality of ultrasonic transducer elements 111 are arranged, and an identification ultrasonic transducer element array 120 that is provided on the substrate 130 and in which a plurality of identification ultrasonic transducer elements 121 are arranged. Identification information of the ultrasonic transducer device 100 is set by some of the plurality of identification ultrasonic transducer elements 121 being set to a receivable state and the rest being set to a non-receivable state.Type: GrantFiled: August 20, 2015Date of Patent: January 8, 2019Assignee: Seiko Epson CorporationInventors: Tomoaki Nakamura, Jiro Tsuruno
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Patent number: 10086405Abstract: A piezoelectric element includes a vibrating film, a piezoelectric body, a first electrode, a second electrode, and a groove. The piezoelectric body is arranged upon the vibrating film. The first electrode is arranged upon the piezoelectric body. The second electrode is arranged upon the piezoelectric body and at a position that is separated from the first electrode. The groove is located between the first electrode and the second electrode and splits a surface of the piezoelectric body in two, as seen in plan view from a thickness direction of the vibrating film.Type: GrantFiled: March 26, 2015Date of Patent: October 2, 2018Assignee: Seiko Epson CorporationInventors: Jiro Tsuruno, Tsukasa Funasaka, Tomoaki Nakamura, Hiromu Miyazawa, Hiroshi Ito, Masayoshi Yamada
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Patent number: 10040098Abstract: An ultrasonic transducer element chip includes a substrate defining an opening, an ultrasonic transducer element disposed at a position corresponding to the opening in a thickness direction of the substrate, and a reinforcing member connected to the substrate to cover the opening. The reinforcing member defines a ventilation passage from the opening to an outside of the substrate.Type: GrantFiled: December 19, 2016Date of Patent: August 7, 2018Assignee: Seiko Epson CorporationInventors: Tomoaki Nakamura, Jiro Tsuruno, Kanechika Kiyose
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Publication number: 20180132824Abstract: An ultrasonic transducer device includes a first substrate that is provided with a plurality of ultrasonic transducer elements arranged in a matrix, and a plurality of first wires via which the ultrasonic transducer elements are electrically connected to each other as a plurality of serial sets, and a second substrate that is provided to overlap the first substrate, and is provided with a plurality of second wires intersecting the first wires in a plan view from a thickness direction of the first substrate and third wires via which the first wires are electrically connected to the second wires.Type: ApplicationFiled: November 1, 2017Publication date: May 17, 2018Applicant: SEIKO EPSON CORPORATIONInventor: Jiro TSURUNO
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Patent number: 9968332Abstract: An ultrasonic transducer includes “m” first ultrasonic elements including first diaphragms, and “n” second ultrasonic elements including second diaphragms. “m” represents a number of the first ultrasonic elements and is an integer of 1 or more. Each of the first diaphragms has a first area. “n” second ultrasonic elements includes second diaphragms. Each of the “n” second diaphragms has a second area being smaller than the first area. “n” represents a number of the second ultrasonic elements and is an integer larger than “m”. The “m” first ultrasonic elements are electrically connected in series in a case where “m” is an integer of 2 or more. The “n” second ultrasonic elements are electrically connected in series. B/A is within a range of 0.9 to 1.1, when a total sum of the first areas is “A” and a total sum of the second areas is “B”.Type: GrantFiled: September 19, 2016Date of Patent: May 15, 2018Assignee: Seiko Epson CorporationInventor: Jiro Tsuruno
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Patent number: 9867593Abstract: An ultrasonic device includes a substrate, first ultrasonic elements having a resonance characteristic of a first frequency, and second ultrasonic elements having a resonance characteristic of a second frequency lower than the first frequency. The first ultrasonic elements are arranged along a first direction to make a first to an n-th high-frequency ultrasonic element lines. The second ultrasonic elements are arranged along the first direction to make a first to an n-th low-frequency ultrasonic element lines. The first to the n-th high-frequency ultrasonic element lines and the first to the n-th low-frequency ultrasonic element lines are arranged along a second direction. The first and second ultrasonic elements have an opening, a vibrating membrane, and a piezo element part. A length in the second direction of the opening of the first ultrasonic element is shorter than a length in the second direction of the opening of the second ultrasonic element.Type: GrantFiled: December 1, 2016Date of Patent: January 16, 2018Assignee: Seiko Epson CorporationInventors: Yasunori Onishi, Jiro Tsuruno
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Publication number: 20170258452Abstract: An ultrasonic image processing device includes an image acquisition unit that acquires a plurality of internal tomographic images of a target object in a plane including a first direction, along a second direction intersecting the first direction, an image dividing unit that divides each of the internal tomographic images into a plurality of separate images with a normal line to the first direction, and acquires the separate images, and an image combining unit that extracts separate images corresponding to coordinates on a continuous line which is continued in a plane including the first direction and the second direction, from the plurality of separate images, and arranges and combines the separate images in order of coordinates along the continuous line so as to generate a combined tomographic image.Type: ApplicationFiled: February 9, 2017Publication date: September 14, 2017Applicant: SEIKO EPSON CORPORATIONInventor: Jiro TSURUNO
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Publication number: 20170252006Abstract: An ultrasonic measurement apparatus includes: an ultrasonic element array for emitting an ultrasonic wave in a first direction; a columnar acoustic lens for changing the traveling direction of the ultrasonic wave emitted from the ultrasonic element array; and a linear guide for restricting a movement direction so that the acoustic lens and the ultrasonic element array move relatively each other in a second direction crossing the first direction and a column axis direction of the acoustic lens.Type: ApplicationFiled: February 21, 2017Publication date: September 7, 2017Applicant: SEIKO EPSON CORPORATIONInventor: Jiro TSURUNO
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Publication number: 20170136497Abstract: An ultrasonic transducer element chip includes a substrate, a plurality of ultrasonic transducer elements and a plate-shaped member. The substrate includes a partition wall section defining a plurality of openings arranged in an array pattern. A wall thickness of the partition wall section is smaller than a wall height of partition wall section. Each of the ultrasonic transducer elements is provided in each of the openings. The plate-shaped member is fixed on a surface of the substrate opposite to a surface of the substrate on which the ultrasonic transducer elements are provided. The plate-shaped member covers at least one of the openings in a plan view seen along a thickness direction of the substrate.Type: ApplicationFiled: January 27, 2017Publication date: May 18, 2017Inventors: Tomoaki NAKAMURA, Jiro TSURUNO, Kanechika KIYOSE
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Publication number: 20170119342Abstract: An ultrasonic device has ultrasonic elements to transmit and receive ultrasonic waves. The ultrasonic device includes a first ultrasonic element array in which ultrasonic elements forming one channel among the ultrasonic elements are arranged in a first direction (scan direction) and a second ultrasonic element array in which ultrasonic elements forming one channel are arranged in the first direction. The second ultrasonic element array is disposed so as to be shifted from the first ultrasonic element array in a second direction (slice direction) crossing the first direction.Type: ApplicationFiled: October 19, 2016Publication date: May 4, 2017Applicant: SEIKO EPSON CORPORATIONInventor: Jiro TSURUNO
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Publication number: 20170095838Abstract: An ultrasonic transducer element chip includes a substrate defining an opening, an ultrasonic transducer element disposed at a position corresponding to the opening in a thickness direction of the substrate, and a reinforcing member connected to the substrate to cover the opening. The reinforcing member defines a ventilation passage from the opening to an outside of the substrate.Type: ApplicationFiled: December 19, 2016Publication date: April 6, 2017Inventors: Tomoaki NAKAMURA, Jiro TSURUNO, Kanechika KIYOSE
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Publication number: 20170095837Abstract: A piezoelectric element which includes a vibrating film, a piezoelectric body disposed on one surface of the vibrating film, and a horizontal electrode structure in which electrodes are disposed at a predetermined gap therebetween on the piezoelectric body. The vibrating film includes a recess portion in a portion corresponding to the predetermined gap in plan view.Type: ApplicationFiled: October 1, 2016Publication date: April 6, 2017Applicant: SEIKO EPSON CORPORATIONInventors: Hiromu MIYAZAWA, Hiroshi ITO, Tomoaki NAKAMURA, Masayoshi YAMADA, Jiro TSURUNO, Tsukasa FUNASAKA
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Publication number: 20170079618Abstract: An ultrasonic device includes a substrate, first ultrasonic elements having a resonance characteristic of a first frequency, and second ultrasonic elements having a resonance characteristic of a second frequency lower than the first frequency. The first ultrasonic elements are arranged along a first direction to make a first to an n-th high-frequency ultrasonic element lines. The second ultrasonic elements are arranged along the first direction to make a first to an n-th low-frequency ultrasonic element lines. The first to the n-th high-frequency ultrasonic element lines and the first to the n-th low-frequency ultrasonic element lines are arranged along a second direction. The first and second ultrasonic elements have an opening, a vibrating membrane, and a piezo element part. A length in the second direction of the opening of the first ultrasonic element is shorter than a length in the second direction of the opening of the second ultrasonic element.Type: ApplicationFiled: December 1, 2016Publication date: March 23, 2017Inventors: Yasunori ONISHI, Jiro TSURUNO
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Patent number: 9592534Abstract: An ultrasonic transducer element chip includes a substrate, a plurality of ultrasonic transducer elements and a plate-shaped member. The substrate includes a partition wall section defining a plurality of openings arranged in an array pattern. A wall thickness of the partition wall section is smaller than a wall height of partition wall section. Each of the ultrasonic transducer elements is provided in each of the openings. The plate-shaped member is fixed on a surface of the substrate opposite to a surface of the substrate on which the ultrasonic transducer elements are provided. The plate-shaped member covers at least one of the openings in a plan view seen along a thickness direction of the substrate.Type: GrantFiled: June 29, 2015Date of Patent: March 14, 2017Assignee: Seiko Epson CorporationInventors: Tomoaki Nakamura, Jiro Tsuruno, Kanechika Kiyose