Patents by Inventor Jiro TSURUNO

Jiro TSURUNO has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11707849
    Abstract: A program identification method is for identifying an application program that is stored in a terminal device coupled to a robot system and that is used for teaching work on an operation of a robot provided in the robot system. The method includes: acquiring program information corresponding to the application program from the terminal device; and comparing the program information with first information stored in the robot system and thus identifying whether the application program is a first application program corresponding to the first information or not.
    Type: Grant
    Filed: September 1, 2020
    Date of Patent: July 25, 2023
    Assignee: SEIKO EPSON CORPORATION
    Inventors: Kosuke Kaga, Jiro Tsuruno, Naoki Tsukahara
  • Patent number: 10945707
    Abstract: An ultrasonic transducer device includes a first substrate that is provided with a plurality of ultrasonic transducer elements arranged in a matrix, and a plurality of first wires via which the ultrasonic transducer elements are electrically connected to each other as a plurality of serial sets, and a second substrate that is provided to overlap the first substrate, and is provided with a plurality of second wires intersecting the first wires in a plan view from a thickness direction of the first substrate and third wires via which the first wires are electrically connected to the second wires.
    Type: Grant
    Filed: November 1, 2017
    Date of Patent: March 16, 2021
    Assignee: SEIKO EPSON CORPORATION
    Inventor: Jiro Tsuruno
  • Publication number: 20210060791
    Abstract: A program identification method is for identifying an application program that is stored in a terminal device coupled to a robot system and that is used for teaching work on an operation of a robot provided in the robot system. The method includes: acquiring program information corresponding to the application program from the terminal device; and comparing the program information with first information stored in the robot system and thus identifying whether the application program is a first application program corresponding to the first information or not.
    Type: Application
    Filed: September 1, 2020
    Publication date: March 4, 2021
    Inventors: Kosuke KAGA, Jiro TSURUNO, Naoki TSUKAHARA
  • Patent number: 10603009
    Abstract: A piezoelectric device includes a piezoelectric film having a first surface in contact with a vibrating film and a second surface on the opposite side to the first surface, first and second electrodes that are provided on the second surface of the piezoelectric film and that are disposed at positions away from each other and are short-circuited to each other at a position away from the piezoelectric film, and a third electrode that is provided between the first and second electrodes on the second surface of the piezoelectric film and is disposed at a position away from the first and second electrodes. At least parts of the contours of end portions of the first and second electrodes are defined in parallel to side portions of the third electrode.
    Type: Grant
    Filed: May 27, 2016
    Date of Patent: March 31, 2020
    Assignee: SEIKO EPSON CORPORATION
    Inventors: Hiromu Miyazawa, Masayoshi Yamada, Hiroshi Ito, Tomoaki Nakamura, Hiroshi Matsuda, Jiro Tsuruno
  • Patent number: 10363574
    Abstract: A piezoelectric element which includes a vibrating film, a piezoelectric body disposed on one surface of the vibrating film, and a horizontal electrode structure in which electrodes are disposed at a predetermined gap therebetween on the piezoelectric body. The vibrating film includes a recess portion in a portion corresponding to the predetermined gap in plan view.
    Type: Grant
    Filed: October 1, 2016
    Date of Patent: July 30, 2019
    Assignee: SEIKO EPSON CORPORATION
    Inventors: Hiromu Miyazawa, Hiroshi Ito, Tomoaki Nakamura, Masayoshi Yamada, Jiro Tsuruno, Tsukasa Funasaka
  • Patent number: 10307137
    Abstract: An ultrasonic device includes a first element row in which ultrasonic transducer elements are arranged at line-symmetrical positions along a first straight line, where a second straight line orthogonal to the first straight line is the axis of symmetry, and are connected to a first interconnect, and a second element row in which ultrasonic transducer elements are arranged at line-symmetrical positions adjacent to the first element row, where the second straight line is the axis of symmetry, and are connected to a second interconnect. When the distance between a k-th element included in the first element row and a k-th element included in the second element row is represented by Dk, a relationship Dk<Dk+1 is satisfied with respect to at least one value of “k”.
    Type: Grant
    Filed: July 24, 2015
    Date of Patent: June 4, 2019
    Assignee: Seiko Epson Corporation
    Inventors: Yusuke Nakazawa, Jiro Tsuruno
  • Patent number: 10172590
    Abstract: An ultrasonic transducer device 100 includes a substrate 130, an ultrasonic transducer element array 110 that is provided on the substrate 130 and in which a plurality of ultrasonic transducer elements 111 are arranged, and an identification ultrasonic transducer element array 120 that is provided on the substrate 130 and in which a plurality of identification ultrasonic transducer elements 121 are arranged. Identification information of the ultrasonic transducer device 100 is set by some of the plurality of identification ultrasonic transducer elements 121 being set to a receivable state and the rest being set to a non-receivable state.
    Type: Grant
    Filed: August 20, 2015
    Date of Patent: January 8, 2019
    Assignee: Seiko Epson Corporation
    Inventors: Tomoaki Nakamura, Jiro Tsuruno
  • Patent number: 10086405
    Abstract: A piezoelectric element includes a vibrating film, a piezoelectric body, a first electrode, a second electrode, and a groove. The piezoelectric body is arranged upon the vibrating film. The first electrode is arranged upon the piezoelectric body. The second electrode is arranged upon the piezoelectric body and at a position that is separated from the first electrode. The groove is located between the first electrode and the second electrode and splits a surface of the piezoelectric body in two, as seen in plan view from a thickness direction of the vibrating film.
    Type: Grant
    Filed: March 26, 2015
    Date of Patent: October 2, 2018
    Assignee: Seiko Epson Corporation
    Inventors: Jiro Tsuruno, Tsukasa Funasaka, Tomoaki Nakamura, Hiromu Miyazawa, Hiroshi Ito, Masayoshi Yamada
  • Patent number: 10040098
    Abstract: An ultrasonic transducer element chip includes a substrate defining an opening, an ultrasonic transducer element disposed at a position corresponding to the opening in a thickness direction of the substrate, and a reinforcing member connected to the substrate to cover the opening. The reinforcing member defines a ventilation passage from the opening to an outside of the substrate.
    Type: Grant
    Filed: December 19, 2016
    Date of Patent: August 7, 2018
    Assignee: Seiko Epson Corporation
    Inventors: Tomoaki Nakamura, Jiro Tsuruno, Kanechika Kiyose
  • Publication number: 20180132824
    Abstract: An ultrasonic transducer device includes a first substrate that is provided with a plurality of ultrasonic transducer elements arranged in a matrix, and a plurality of first wires via which the ultrasonic transducer elements are electrically connected to each other as a plurality of serial sets, and a second substrate that is provided to overlap the first substrate, and is provided with a plurality of second wires intersecting the first wires in a plan view from a thickness direction of the first substrate and third wires via which the first wires are electrically connected to the second wires.
    Type: Application
    Filed: November 1, 2017
    Publication date: May 17, 2018
    Applicant: SEIKO EPSON CORPORATION
    Inventor: Jiro TSURUNO
  • Patent number: 9968332
    Abstract: An ultrasonic transducer includes “m” first ultrasonic elements including first diaphragms, and “n” second ultrasonic elements including second diaphragms. “m” represents a number of the first ultrasonic elements and is an integer of 1 or more. Each of the first diaphragms has a first area. “n” second ultrasonic elements includes second diaphragms. Each of the “n” second diaphragms has a second area being smaller than the first area. “n” represents a number of the second ultrasonic elements and is an integer larger than “m”. The “m” first ultrasonic elements are electrically connected in series in a case where “m” is an integer of 2 or more. The “n” second ultrasonic elements are electrically connected in series. B/A is within a range of 0.9 to 1.1, when a total sum of the first areas is “A” and a total sum of the second areas is “B”.
    Type: Grant
    Filed: September 19, 2016
    Date of Patent: May 15, 2018
    Assignee: Seiko Epson Corporation
    Inventor: Jiro Tsuruno
  • Patent number: 9867593
    Abstract: An ultrasonic device includes a substrate, first ultrasonic elements having a resonance characteristic of a first frequency, and second ultrasonic elements having a resonance characteristic of a second frequency lower than the first frequency. The first ultrasonic elements are arranged along a first direction to make a first to an n-th high-frequency ultrasonic element lines. The second ultrasonic elements are arranged along the first direction to make a first to an n-th low-frequency ultrasonic element lines. The first to the n-th high-frequency ultrasonic element lines and the first to the n-th low-frequency ultrasonic element lines are arranged along a second direction. The first and second ultrasonic elements have an opening, a vibrating membrane, and a piezo element part. A length in the second direction of the opening of the first ultrasonic element is shorter than a length in the second direction of the opening of the second ultrasonic element.
    Type: Grant
    Filed: December 1, 2016
    Date of Patent: January 16, 2018
    Assignee: Seiko Epson Corporation
    Inventors: Yasunori Onishi, Jiro Tsuruno
  • Publication number: 20170258452
    Abstract: An ultrasonic image processing device includes an image acquisition unit that acquires a plurality of internal tomographic images of a target object in a plane including a first direction, along a second direction intersecting the first direction, an image dividing unit that divides each of the internal tomographic images into a plurality of separate images with a normal line to the first direction, and acquires the separate images, and an image combining unit that extracts separate images corresponding to coordinates on a continuous line which is continued in a plane including the first direction and the second direction, from the plurality of separate images, and arranges and combines the separate images in order of coordinates along the continuous line so as to generate a combined tomographic image.
    Type: Application
    Filed: February 9, 2017
    Publication date: September 14, 2017
    Applicant: SEIKO EPSON CORPORATION
    Inventor: Jiro TSURUNO
  • Publication number: 20170252006
    Abstract: An ultrasonic measurement apparatus includes: an ultrasonic element array for emitting an ultrasonic wave in a first direction; a columnar acoustic lens for changing the traveling direction of the ultrasonic wave emitted from the ultrasonic element array; and a linear guide for restricting a movement direction so that the acoustic lens and the ultrasonic element array move relatively each other in a second direction crossing the first direction and a column axis direction of the acoustic lens.
    Type: Application
    Filed: February 21, 2017
    Publication date: September 7, 2017
    Applicant: SEIKO EPSON CORPORATION
    Inventor: Jiro TSURUNO
  • Publication number: 20170136497
    Abstract: An ultrasonic transducer element chip includes a substrate, a plurality of ultrasonic transducer elements and a plate-shaped member. The substrate includes a partition wall section defining a plurality of openings arranged in an array pattern. A wall thickness of the partition wall section is smaller than a wall height of partition wall section. Each of the ultrasonic transducer elements is provided in each of the openings. The plate-shaped member is fixed on a surface of the substrate opposite to a surface of the substrate on which the ultrasonic transducer elements are provided. The plate-shaped member covers at least one of the openings in a plan view seen along a thickness direction of the substrate.
    Type: Application
    Filed: January 27, 2017
    Publication date: May 18, 2017
    Inventors: Tomoaki NAKAMURA, Jiro TSURUNO, Kanechika KIYOSE
  • Publication number: 20170119342
    Abstract: An ultrasonic device has ultrasonic elements to transmit and receive ultrasonic waves. The ultrasonic device includes a first ultrasonic element array in which ultrasonic elements forming one channel among the ultrasonic elements are arranged in a first direction (scan direction) and a second ultrasonic element array in which ultrasonic elements forming one channel are arranged in the first direction. The second ultrasonic element array is disposed so as to be shifted from the first ultrasonic element array in a second direction (slice direction) crossing the first direction.
    Type: Application
    Filed: October 19, 2016
    Publication date: May 4, 2017
    Applicant: SEIKO EPSON CORPORATION
    Inventor: Jiro TSURUNO
  • Publication number: 20170095838
    Abstract: An ultrasonic transducer element chip includes a substrate defining an opening, an ultrasonic transducer element disposed at a position corresponding to the opening in a thickness direction of the substrate, and a reinforcing member connected to the substrate to cover the opening. The reinforcing member defines a ventilation passage from the opening to an outside of the substrate.
    Type: Application
    Filed: December 19, 2016
    Publication date: April 6, 2017
    Inventors: Tomoaki NAKAMURA, Jiro TSURUNO, Kanechika KIYOSE
  • Publication number: 20170095837
    Abstract: A piezoelectric element which includes a vibrating film, a piezoelectric body disposed on one surface of the vibrating film, and a horizontal electrode structure in which electrodes are disposed at a predetermined gap therebetween on the piezoelectric body. The vibrating film includes a recess portion in a portion corresponding to the predetermined gap in plan view.
    Type: Application
    Filed: October 1, 2016
    Publication date: April 6, 2017
    Applicant: SEIKO EPSON CORPORATION
    Inventors: Hiromu MIYAZAWA, Hiroshi ITO, Tomoaki NAKAMURA, Masayoshi YAMADA, Jiro TSURUNO, Tsukasa FUNASAKA
  • Publication number: 20170079618
    Abstract: An ultrasonic device includes a substrate, first ultrasonic elements having a resonance characteristic of a first frequency, and second ultrasonic elements having a resonance characteristic of a second frequency lower than the first frequency. The first ultrasonic elements are arranged along a first direction to make a first to an n-th high-frequency ultrasonic element lines. The second ultrasonic elements are arranged along the first direction to make a first to an n-th low-frequency ultrasonic element lines. The first to the n-th high-frequency ultrasonic element lines and the first to the n-th low-frequency ultrasonic element lines are arranged along a second direction. The first and second ultrasonic elements have an opening, a vibrating membrane, and a piezo element part. A length in the second direction of the opening of the first ultrasonic element is shorter than a length in the second direction of the opening of the second ultrasonic element.
    Type: Application
    Filed: December 1, 2016
    Publication date: March 23, 2017
    Inventors: Yasunori ONISHI, Jiro TSURUNO
  • Patent number: 9592534
    Abstract: An ultrasonic transducer element chip includes a substrate, a plurality of ultrasonic transducer elements and a plate-shaped member. The substrate includes a partition wall section defining a plurality of openings arranged in an array pattern. A wall thickness of the partition wall section is smaller than a wall height of partition wall section. Each of the ultrasonic transducer elements is provided in each of the openings. The plate-shaped member is fixed on a surface of the substrate opposite to a surface of the substrate on which the ultrasonic transducer elements are provided. The plate-shaped member covers at least one of the openings in a plan view seen along a thickness direction of the substrate.
    Type: Grant
    Filed: June 29, 2015
    Date of Patent: March 14, 2017
    Assignee: Seiko Epson Corporation
    Inventors: Tomoaki Nakamura, Jiro Tsuruno, Kanechika Kiyose