Abstract: The purpose of the present invention is to provide a viscous material application apparatus capable of reliably applying an appropriate amount of a viscous material to a shaft-shaped member. A seal application apparatus (1) is provided with a flexible tubular nozzle (2), which is capable of discharging a sealing agent from an opening (6) formed on the tip thereof, and an actuator (3) for moving the nozzle (2). After or during discharge of the sealing agent by the nozzle (2), the tip of the nozzle (2) moves in the circumferential direction along the outer circumferential surface of a fastener (20), and as the nozzle (2) is stopping the discharge of the sealing agent, the tip of the nozzle (2) moves in a direction away from the outer circumferential surface of the fastener (20).

Abstract: The object is to provide an aircraft component positioning device, an aircraft assembly system, and an aircraft assembly method with which it is possible to precisely dispose components on a planar member of an aircraft without using a positioning jig. A positioning device (2) includes a detection unit (5) that detects positions of a plurality of first components installed on a planar member of an aircraft, a virtual position creation unit (6) that creates a virtual position between the plurality of first components on the basis of the positions of the plurality of first components that are detected, and a position determination unit (7) that, on the basis of the virtual position that is created, determines an installation position of a second component, different from the plurality of first components, that is installed on the planar member.

Abstract: The purpose of the present invention is to provide a viscous material application apparatus capable of reliably applying an appropriate amount of a viscous material to a shaft-shaped member. A seal application apparatus (1) is provided with a flexible tubular nozzle (2), which is capable of discharging a sealing agent from an opening (6) formed on the tip thereof, and an actuator (3) for moving the nozzle (2). After or during discharge of the sealing agent by the nozzle (2), the tip of the nozzle (2) moves in the circumferential direction along the outer circumferential surface of a fastener (20), and as the nozzle (2) is stopping the discharge of the sealing agent, the tip of the nozzle (2) moves in a direction away from the outer circumferential surface of the fastener (20).

Abstract: The object is to provide an aircraft component positioning device, an aircraft assembly system, and an aircraft assembly method with which it is possible to precisely dispose components on a planar member of an aircraft without using a positioning jig. A positioning device (2) includes a detection unit (5) that detects positions of a plurality of first components installed on a planar member of an aircraft, a virtual position creation unit (6) that creates a virtual position between the plurality of first components on the basis of the positions of the plurality of first components that are detected, and a position determination unit (7) that, on the basis of the virtual position that is created, determines an installation position of a second component, different from the plurality of first components, that is installed on the planar member.

Abstract: To provide a transistor device, which is composed of a compound semiconductor, having a multilayer structure in which a high electron mobility transistor (HEMT) and a heterojunction bipolar transistor (HBT) are overlapped on the same substrate and epitaxial-grown thereon, wherein a band gap energy of an indium gallium phosphide layer (InGaP) included in an epitaxial layer, is set to 1.91 eV or more.

Abstract: To provide a transistor device, which is composed of a compound semiconductor, having a multilayer structure in which a high electron mobility transistor (HEMT) and a heterojunction bipolar transistor (HBT) are overlapped on the same substrate and epitaxial-grown thereon, wherein a band gap energy of an indium gallium phosphide layer (InGaP) included in an epitaxial layer, is set to 1.91 eV or more.