Patents by Inventor Jirou SUGIYAMA
Jirou SUGIYAMA has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
-
Patent number: 11306225Abstract: The electrically conductive adhesive agent composition comprises a metal particle (Q) and a prescribed organophosphorus compound (A), and the metal particle (Q) comprises a first metal particle (Q1) made of a single metal selected from the group of copper, nickel, aluminum and tin or an alloy comprising two or more metals selected from said group.Type: GrantFiled: August 7, 2018Date of Patent: April 19, 2022Assignee: Furukawa Electric Co., Ltd.Inventors: Shunichiro Sato, Naoaki Mihara, Jirou Sugiyama
-
Patent number: 11230649Abstract: The electrically conductive adhesive film comprises a metal particle (Q), a resin (M), and at least one of a prescribed organic phosphine (A) and a prescribed sulfide-based compound (B), the resin (M) comprises a thermosetting resin (M1), and has a storage elastic modulus at 1 Hz measured in a state after sintering of 20 GPa or less and a thermal weight loss ratio when heated for 2 hours at 250° C. under a nitrogen atmosphere of less than 1%.Type: GrantFiled: August 7, 2018Date of Patent: January 25, 2022Assignee: Furukawa Electric Co., Ltd.Inventors: Naoaki Mihara, Noriyuki Kirikae, Jirou Sugiyama
-
Patent number: 11193047Abstract: The electrically conductive adhesive film comprises a metal particle (Q), a resin (M), and a prescribed organophosphorus compound (A), the resin (M) comprises a thermosetting resin (M1), and the metal particle (Q) has an average particle size (d50) of 20 ?m or less and comprise 10% by mass or more of a first metal particle (Q1) having a fractal dimension of 1.1 or more when viewed in a projection drawing in a primary particle state.Type: GrantFiled: August 7, 2018Date of Patent: December 7, 2021Assignee: Furukawa Electric Co., Ltd.Inventors: Naoaki Mihara, Noriyuki Kirikae, Jirou Sugiyama
-
Patent number: 11136479Abstract: The electrically conductive adhesive film comprises a metal particle (P), a resin (M) and a prescribed sulfide compound (A), the resin (M) comprises a thermosetting resin (M1), and the metal particle (P) has an average particle size (d50) of 20 ?m or less and comprises 10% by mass or more of a first metal particle (P1) having a fractal dimension of 1.1 or more when viewed in a projection drawing in a primary particle state.Type: GrantFiled: August 7, 2018Date of Patent: October 5, 2021Assignee: Furukawa Electric Co., Ltd.Inventors: Naoaki Mihara, Noriyuki Kirikae, Jirou Sugiyama
-
Patent number: 11098226Abstract: The electrically conductive adhesive film comprises a metal particle (P), a resin (M) and a prescribed sulfide compound (A), the resin (M) comprises a thermosetting resin (M1), and the metal particle (P) has an average particle size (d50) of 20 ?m or less and comprises 10% by mass or more of a first metal particle (P1) having a fractal dimension of 1.1 or more when viewed in a projection drawing in a primary particle state.Type: GrantFiled: August 7, 2018Date of Patent: August 24, 2021Assignee: Furukawa Electric Co., Ltd.Inventors: Naoaki Mihara, Noriyuki Kirikae, Jirou Sugiyama
-
Patent number: 11066577Abstract: The electrically conductive adhesive film comprises a metal particle (P) and a resin (M), the resin (M) comprises a thermosetting resin (M1), and the metal particle (P) has an average particle size (d50) of 20 ?m or less and comprises 10% by mass or more of a first metal particle (P1) having a fractal dimension of 1.1 or more when viewed in a projection drawing in a primary particle state.Type: GrantFiled: August 7, 2018Date of Patent: July 20, 2021Assignee: FURUKAWA ELECTRIC CO., LTD.Inventors: Naoaki Mihara, Noriyuki Kirikae, Jirou Sugiyama
-
Patent number: 10689550Abstract: A composition exhibits excellent heat resistance and mounting reliability when bonding a semiconductor power element to a metal lead frame, which is also free of lead and thereby places little burden on the environment. An electrically conductive composition contains at least a sulfide compound represented by R—S—R? (wherein R is an organic group containing at least carbon; R? is an organic group that is the same as or different from R; and R and R? may be bonded to each other to form a so-called cyclic sulfide) and metal particles containing at least Cu, Sn or Ni as its essential component. Further, a conductive paste and a conductive bonding film each are produced using the electrically conductive composition. A dicing die bonding film is obtained by bonding the conductive bonding film with an adhesive tape.Type: GrantFiled: August 21, 2017Date of Patent: June 23, 2020Assignee: FURUKAWA ELECTRIC CO., LTD.Inventors: Naoaki Mihara, Noriyuki Kirikae, Jirou Sugiyama
-
Publication number: 20190016928Abstract: The electrically conductive adhesive film comprises a metal particle (P), a resin (M) and a prescribed sulfide compound (A), the resin (M) comprises a thermosetting resin (M1), and the metal particle (P) has an average particle size (d50) of 20 ?m or less and comprises 10% by mass or more of a first metal particle (P1) having a fractal dimension of 1.1 or more when viewed in a projection drawing in a primary particle state.Type: ApplicationFiled: August 7, 2018Publication date: January 17, 2019Applicant: Furukawa Electric Co., Ltd.Inventors: Naoaki Mihara, Noriyuki Kirikae, Jirou Sugiyama
-
Publication number: 20190016929Abstract: The electrically conductive adhesive film comprises a metal particle (Q), a resin (M), and a prescribed organophosphorus compound (A), the resin (M) comprises a thermosetting resin (M1), and the metal particle (Q) has an average particle size (d50) of 20 ?m or less and comprise 10% by mass or more of a first metal particle (Q1) having a fractal dimension of 1.1 or more when viewed in a projection drawing in a primary particle state.Type: ApplicationFiled: August 7, 2018Publication date: January 17, 2019Applicant: Furukawa Electric Co., Ltd.Inventors: Naoaki Mihara, Noriyuki Kirikae, Jirou Sugiyama
-
Publication number: 20180346766Abstract: The electrically conductive adhesive film comprises a metal particle (P) and a resin (M), the resin (M) comprises a thermosetting resin (M1), and the metal particle (P) has an average particle size (d50) of 20 m or less and comprises 10% by mass or more of a first metal particle (P1) having a fractal dimension of 1.1 or more when viewed in a projection drawing in a primary particle state.Type: ApplicationFiled: August 7, 2018Publication date: December 6, 2018Applicant: Furukawa Electric Co., Ltd,Inventors: Naoaki Mihara, Noriyuki Kirikae, Jirou Sugiyama
-
Publication number: 20180346767Abstract: The electrically conductive adhesive film comprises a metal particle (Q), a resin (M), and at least one of a prescribed organic phosphine (A) and a prescribed sulfide-based compound (B), the resin (M) comprises a thermosetting resin (M1), and has a storage elastic modulus at 1 Hz measured in a state after sintering of 20 GPa or less and a thermal weight loss ratio when heated for 2 hours at 250° C. under a nitrogen atmosphere of less than 1%.Type: ApplicationFiled: August 7, 2018Publication date: December 6, 2018Applicant: Furukawa Electric Co., Ltd.Inventors: Naoaki Mihara, Noriyuki Kirikae, Jirou Sugiyama
-
Publication number: 20180346768Abstract: The electrically conductive adhesive agent composition comprises a metal particle (Q) and a prescribed organophosphorus compound (A), and the metal particle (Q) comprises a first metal particle (Q1) made of a single metal selected from the group of copper, nickel, aluminum and tin or an alloy comprising two or more metals selected from said group.Type: ApplicationFiled: August 7, 2018Publication date: December 6, 2018Applicant: Furukawa Electric Co., Ltd.Inventors: Shunichiro Sato, Naoaki Mihara, Jirou Sugiyama
-
Publication number: 20180294242Abstract: A means that exhibits excellent heat resistance and mounting reliability when bonding a power semiconductor device on to a metal lead frame, which is also lead-free and places little burden on the environment. Specifically, an electrically conductive adhesive film, which includes metal particles, a thermosetting resin, and a compound having Lewis acidity or a thermal acid generator, wherein the compound having Lewis acidity or thermal acid generator is selected from: boron fluoride or a complex thereof, a protonic acid with a pKa value of ?0.4 or lower, or a salt or acid obtained by combining an anion that is the same as the salt thereof with hydrogen ion or any other cation. Further, a dicing die bonding film that is obtained by bonding the electrically conductive adhesive film with a pressure-sensitive adhesive tape.Type: ApplicationFiled: May 25, 2018Publication date: October 11, 2018Applicant: FURUKAWA ELECTRIC CO., LTD.Inventors: Naoaki MIHARA, Noriyuki KIRIKAE, Jirou SUGIYAMA
-
Publication number: 20180190532Abstract: Provided is a film for semiconductor protection, which can prevent warpage in a semiconductor wafer or a semiconductor chip and can also prevent the occurrence of chipping or ref low cracking. The film for semiconductor protection of the invention has a metal layer to be stuck to the back surface of a semiconductor chip, and an adhesive layer for adhering the metal layer to the back surface of the semiconductor chip, the surface free energy of the face of the adhesive layer on the side that is adhered to the semiconductor chip and the surface free energy of the face on the side that is adhered to the metal layer are together 35 mJ/m2 or greater, and the peeling force between the adhesive layer in the B-stage state and the metal layer is 0.3 N/25 mm or higher.Type: ApplicationFiled: February 27, 2018Publication date: July 5, 2018Applicant: FURUKAWA ELECTRIC CO., LTD.Inventors: Jirou SUGIYAMA, Masami Aoyama
-
Publication number: 20180026003Abstract: A means that exhibits excellent heat resistance and mounting reliability when bonding a power semiconductor device on to a metal lead frame, which is also lead-free and places little burden on the environment. Specifically, provided is an electrically conductive adhesive film, which includes metal particles, a thermosetting resin, and a compound having Lewis acidity or a thermal acid generator, wherein the compound having Lewis acidity or thermal acid generator is selected from: boron fluoride or a complex thereof, a protonic acid with a pKa value of ?0.4 or lower, or a salt or acid obtained by combining an anion that is the same as the salt thereof with hydrogen ion or any other cation. Further, the present invention provides a dicing die bonding film that is obtained by bonding the electrically conductive adhesive film with a pressure-sensitive adhesive tape.Type: ApplicationFiled: April 12, 2016Publication date: January 25, 2018Applicant: FURUKAWA ELECTRIC CO., LTD.Inventors: Naoaki MIHARA, Noriyuki KIRIKAE, Jirou SUGIYAMA
-
Publication number: 20170369746Abstract: A composition exhibits excellent heat resistance and mounting reliability when bonding a semiconductor power element to a metal lead frame, which is also free of lead and thereby places little burden on the environment. An electrically conductive composition contains at least a sulfide compound represented by R—S—R? (wherein R is an organic group containing at least carbon; R? is an organic group that is the same as or different from R; and R and R? may be bonded to each other to form a so-called cyclic sulfide) and metal particles containing at least Cu, Sn or Ni as its essential component. Further, a conductive paste and a conductive bonding film each are produced using the electrically conductive composition. A dicing die bonding film is obtained by bonding the conductive bonding film with an adhesive tape.Type: ApplicationFiled: August 21, 2017Publication date: December 28, 2017Applicant: FURUKAWA ELECTRIC CO., LTD.Inventors: Naoaki MIHARA, Noriyuki KIRIKAE, Jirou SUGIYAMA
-
Publication number: 20170152411Abstract: An adhesive film that shows excellent heat resistance while showing excellent stress relaxation property, which further shows high conductivity that enables application to rear-side electrodes for power semiconductors without the use of expensive precious metals such as silver, which also shows sufficient adhesive strength without protruding from the device, and a method for processing semiconductors using the same, are provided. In particular, a conductive adhesive film, which includes two or more types of metal particles including at least Cu and a polymer that has a polydimethylsiloxane structure, is provided. Further, a dicing die bonding film, which is obtained by laminating a dicing tape on the conductive adhesive film, as well as a method for processing semiconductor wafers using said adhesive film and the dicing die bonding film, are provided.Type: ApplicationFiled: February 9, 2017Publication date: June 1, 2017Applicant: FURUKAWA ELECTRIC CO., LTD.Inventors: Naoaki MIHARA, Noriyuki KIRIKAE, Jirou SUGIYAMA, Masami AOYAMA