Patents by Inventor Jitai Niu

Jitai Niu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 9662729
    Abstract: A laser guided nano-brazing method for a reinforced aluminum composite material having high volume fraction silicon carbide particles, comprising 4 steps: nanocrystallizing the surface of the reinforced aluminum composite material having high volume fraction silicon carbide particles, preparing solder material, assembling pieces to be soldered, and dual-beam laser brazing. The use of nano-technology for the brazing of reinforced aluminum composite material having high volume fraction silicon carbide particles, and the use of dual-beam laser technology for brazing temperature field control enhance the humidity during the brazing process of said material and filling ability of the solder material, and satisfy the strict requirements of electronic packaging.
    Type: Grant
    Filed: April 27, 2013
    Date of Patent: May 30, 2017
    Assignee: Henan Jingtai Aerospace High-Novel Materials Technology Co., Ltd.
    Inventors: Jitai Niu, Dongfeng Cheng, Zeng Gao, Peng Wang, Qiang Li, Baoqing Zhang, Erzhen Mu, Sijie Chen, Hengze Xian, Gang Zeng, Xitao Wang
  • Publication number: 20150196965
    Abstract: A laser guided nano-brazing method for a reinforced aluminum composite material having high volume fraction silicon carbide particles, comprising 4 steps: nanocrystallizing the surface of the reinforced aluminum composite material having high volume fraction silicon carbide particles, preparing solder material, assembling pieces to be soldered, and dual-beam laser brazing. The use of nano-technology for the brazing of reinforced aluminum composite material having high volume fraction silicon carbide particles, and the use of dual-beam laser technology for brazing temperature field control enhance the humidity during the brazing process of said material and filling ability of the solder material, and satisfy the strict requirements of electronic packaging.
    Type: Application
    Filed: April 27, 2013
    Publication date: July 16, 2015
    Inventors: Jitai Niu, Dongfeng Cheng, Zeng Gao, Peng Wang, Qiang Li, Baoqing Zhang, Erzhen Mu, Sijie Chen, Hengze Xian, Gang Zeng, Xitao Wang