Abstract: The present invention provides a metal-clad white laminate including: a white resin layer which is composed of a resin composition obtained by mixing a polyimide having a repeating unit as represented by a particular chemical structural formula with a white pigment; and at least one metal layer, the white resin layer being an adhesive layer for the metal layer. The metal-clad white laminate of the present invention uses a white resin composition which has high reflectance and whiteness and excellent light resistance, and is easy to be reduced in thickness and weight.

Abstract: A polyimide resin which is satisfactory in solvent solubility and heat resistance, has a low coefficient of water absorption and is excellent in adhesive properties and a method for manufacturing the same, a film containing the subject polyimide resin and a metal-clad laminate including an adhesive layer composed of the subject polyimide resin are provided. The polyimide resin is a polyimide resin containing a molecule having a repeating unit represented by a structure of any one of the following formulae (1) to (3) in a specified proportion, whose molecular end is capped by an end-capping agent.

Abstract: A method for producing a colorless transparent resin film by a solution flow casting method containing: flow-casting an organic solvent solution of a polyamic acid or a polyimide on a support; and drying, the method containing at least the following step (1), step (2) and step (3) in this order, and an apparatus therefor: (1) a step of flow-casting an organic solvent solution of a polyamic acid or polyamide on a support, (2) a step of evaporating the organic solvent while blowing a gas having an oxygen content of from 0.001 to 15% by volume at a temperature of from 100 to 170° C. onto the flow-cast material, and releasing as a self-supporting film from the support, and (3) a step of performing the following step (3-1) and step (3-2) in this order: (3-1) a step of lowering a residual ratio of the organic solvent in the self-supporting film while blowing a gas having an oxygen content of 15% by volume or less at a temperature of from 100 to 250° C.

Abstract: A polyimide resin composed of a repeating unit represented by the following formula (1): or composed of the repeating unit represented by the formula (1) and at least one repeating unit represented by the following formula (2): wherein X is the same as defined in the specification, exhibits a good thermoplastic property, a high solubility in solvents and a good heat resistance as well as a low water absorption and an excellent adhesion property. The polyimide resin is useful as the material for the adhesive layer of a metal-clad laminate which is composed of an insulating substrate, a metal layer and an adhesive layer disposed between the insulating substrate and the metal layer.

Abstract: It relates to a highly heat resistant thermosetting polyimide resin composition that is cured at a temperature of 150° C. or less, and provides a cured product that generates a less amount of decomposed gas even under heating to 250° C., and has flexibility and adhesiveness. A two-component thermosetting polyimide resin composition containing a liquid A containing a polyimide (a) having a main chain constituted by a repeating unit having a polyoxyalkylenediamine structure with amino groups on both ends thereof, and a liquid B containing a bismaleimide compound, and a cured product of a thermosetting polyimide resin composition obtained by mixing these two liquids and curing the mixture under heating.

Abstract: To provide a thermosetting polyimide resin composition that can provide a cured product which generates a small amount of decomposition gas even when exposed to, for example, a high-temperature environment of about 250° C., and which exhibits high heat resistance, high durability, favorable flexibility, and favorable adhesive property; a cured product produced from the thermosetting polyimide resin composition; and an adhesive produced from the thermosetting polyimide resin composition. The thermosetting polyimide resin composition containing (a) a polyimide produced through reaction between a tetracarboxylic acid component containing a tetracarboxylic dianhydride and/or a tetracarboxylic acid, and a diamine; and (b) a maleimide composition containing at least one polymaleimide compound represented by any of formulas (4-1) to (4-3).

Abstract: A polyimide resin which is soluble in an organic solvent and which has a low coefficient of water absorption, thermosetting properties, high heat resistance and excellent adhesive properties, a method for manufacturing the same, an adhesive and a film each containing the subject polyimide resin and a metal-clad laminate including an adhesive layer composed of the subject polyimide resin are provided. The polyimide resin is a polyimide resin containing a repeating unit represented by the following formula (1) and a repeating unit represented by the following formula (2), with a proportion of a group presented by the following formula (3) being 50% by mole or more of the whole of X.

Abstract: The invention is directed to a process for producing polyimide film, including stretching, at 150° C. to 380° C. and a stretch ratio of 1.2 to 4.0, an unstretched polyimide film which is formed from a polyimide having a repeating unit represented by formula (1): (wherein R represents a tetravalent group derived from cyclohexane; and ? represents a divalent aliphatic, alicyclic, or aromatic group, or a combination thereof that has a total number of carbon atoms of 2 to 39 and may have at least one connecting group selected from the group consisting of —O—, —SO2—, —CO—, —CH2—, —C(CH3)2—, —OSi(CH3)2—, —C2H4O—, and —S—) and which has an organic solvent content of 0.5 wt. % or more and less than 30 wt. %. The produced polyimide film exhibits transparency, excellent heat resistance, and reduced dimensional changes.

Abstract: A method for producing a colorless transparent resin film by a solution flow casting method containing: flow-casting an organic solvent solution of a polyamic acid or a polyimide on a support; and drying, the method containing at least the following step (1), step (2) and step (3) in this order, and an apparatus therefor: (1) a step of flow-casting an organic solvent solution of a polyamic acid or polyamide on a support, (2) a step of evaporating the organic solvent while blowing a gas having an oxygen content of from 0.001 to 15% by volume at a temperature of from 100 to 170° C. onto the flow-cast material, and releasing as a self-supporting film from the support, and (3) a step of performing the following step (3-1) and step (3-2) in this order: (3-1) a step of lowering a residual ratio of the organic solvent in the self-supporting film while blowing a gas having an oxygen content of 15% by volume or less at a temperature of from 100 to 250° C.

Abstract: It relates to a highly heat resistant thermosetting polyimide resin composition that is cured at a temperature of 150° C. or less, and provides a cured product that generates a less amount of decomposed gas even under heating to 250° C., and has flexibility and adhesiveness. A two-component thermosetting polyimide resin composition containing a liquid A containing a polyimide (a) having a main chain constituted by a repeating unit having a polyoxyalkylenediamine structure with amino groups on both ends thereof, and a liquid B containing a bismaleimide compound, and a cured product of a thermosetting polyimide resin composition obtained by mixing these two liquids and curing the mixture under heating.

Abstract: Disclosed is a highly heat-resistant thermosetting polyimide resin composition having long pot life, which enables to obtain a cured product having flexibility and adhesiveness. The thermosetting polyimide resin composition can be obtained through the following steps (1)-(3). Step (1): A step wherein a polyimide (A) is synthesized by a thermal reaction by blending a tetracarboxylic acid component, which is composed of a tetracarboxylic acid dianhydride represented by the formula (1) and one or more compounds selected from tetracarboxylic acids represented by the formula (2) and derivatives of such tetracarboxylic acids, with an aliphatic diamine represented by the formula (3) in such a ratio that the mole number of the tetracarboxylic acid component is higher than the mole number of the aliphatic diamine. Step (2): A step wherein a polyimide (B) is synthesized by a thermal reaction by blending the polyimide (A) obtained in the step (1) with an aromatic diamine represented by the formula (4).

Abstract: A thermosetting polyimide resin composition which, when used in an adhesive layer of a metal-clad laminate, is able to be manufactured by only the solvent removal without requiring an imidation step reaching 300° C. or higher and is thermosetting, a cured material of which is excellent in adhesive properties, low in coefficient of water absorption and satisfactory in heat resistance is provided. A thermosetting polyimide resin composition including a polyimide resin having a repeating unit or units having a specified structure and a compound having two or more polymerizable double bonds in one molecule thereof; a film containing the subject thermosetting polyimide resin composition and a metal-clad laminate including an adhesive layer composed of the subject thermosetting polyimide resin composition.

Abstract: A polyimide resin which is satisfactory in solvent solubility and heat resistance, has a low coefficient of water absorption and is excellent in adhesive properties and a method for manufacturing the same, a film containing the subject polyimide resin and a metal-clad laminate including an adhesive layer composed of the subject polyimide resin are provided. The polyimide resin is a polyimide resin containing a molecule having a repeating unit represented by a structure of any one of the following formulae (1) to (3) in a specified proportion, whose molecular end is capped by an end-capping agent.

Abstract: A polyimide resin which is soluble in an organic solvent and which has a low coefficient of water absorption, thermosetting properties, high heat resistance and excellent adhesive properties, a method for manufacturing the same, an adhesive and a film each containing the subject polyimide resin and a metal-clad laminate including an adhesive layer composed of the subject polyimide resin are provided. The polyimide resin is a polyimide resin containing a repeating unit represented by the following formula (1) and a repeating unit represented by the following formula (2), with a proportion of a group presented by the following formula (3) being 50% by mole or more of the whole of X.

Abstract: The invention is directed to a process for producing polyimide film, including stretching, at 150° C. to 380° C. and a stretch ratio of 1.2 to 4.0, an unstretched polyimide film which is formed from a polyimide having a repeating unit represented by formula (1): (wherein R represents a tetravalent group derived from cyclohexane; and ? represents a divalent aliphatic, alicyclic, or aromatic group, or a combination thereof that has a total number of carbon atoms of 2 to 39 and may have at least one connecting group selected from the group consisting of —O—, —SO2—, —CO—, —CH2—, —C(CH3)2—, —OSi(CH3)2—, —C2H4O—, and —S—) and which has an organic solvent content of 0.5 wt. % or more and less than 30 wt. %. The produced polyimide film exhibits transparency, excellent heat resistance, and reduced dimensional changes.

Abstract: A process for producing a high purity aromatic polycarboxylic acid (APA) by purification of a crude APA comprises: (I) aging a slurry of the crude APA in a first dispersion medium at 180 to 300° C. for 10 minutes or longer under stirring; (II) introducing the aged slurry of the APA into a column for substituting dispersion media, bringing the slurry into contact with a second dispersion medium and separating the resultant fluid into a fluid of the first dispersion medium containing impurities and a slurry of the second dispersion medium containing crystals of the high purity APA; and (III) separating the crystals of the high purity APA from the slurry of the second dispersion medium. A high purity APA having excellent hue and particle diameter can be industrially advantageously produced while the construction of the process is simplified and the consumption of energy is decreased.

Abstract: A polyimide resin composed of a repeating unit represented by the following formula (1): or composed of the repeating unit represented by the formula (1) and at least one repeating unit represented by the following formula (2): wherein X is the same as defined in the specification, exhibits a good thermoplastic property, a high solubility in solvents and a good heat resistance as well as a low water absorption and an excellent adhesion property. The polyimide resin is useful as the material for the adhesive layer of a metal-clad laminate which is composed of an insulating substrate, a metal layer and an adhesive layer disposed between the insulating substrate and the metal layer.

Abstract: The present invention provides a metal-clad white laminate including: a white resin layer which is composed of a resin composition obtained by mixing a polyimide having a repeating unit as represented by a particular chemical structural formula with a white pigment; and at least one metal layer, the white resin layer being an adhesive layer for the metal layer. The metal-clad white laminate of the present invention uses a white resin composition which has high reflectance and whiteness and excellent light resistance, and is easy to be reduced in thickness and weight.

Abstract: A process for producing a high purity aromatic polycarboxylic acid (APA) by purification of a crude APA comprises: (I) aging a slurry of the crude APA in a first dispersion medium at 180 to 300° C. for 10 minutes or longer under stirring; (II) introducing the aged slurry of the APA into a column for substituting dispersion media, bringing the slurry into contact with a second dispersion medium and separating the resultant fluid into a fluid of the first dispersion medium containing impurities and a slurry of the second dispersion medium containing crystals of the high purity APA; and (III) separating the crystals of the high purity APA from the slurry of the second dispersion medium. A high purity APA having excellent hue and particle diameter can be industrially advantageously produced while the construction of the process is simplified and the consumption of energy is decreased.

Abstract: A process for producing a high purity aromatic polycarboxylic acid by purifying a crude aromatic polycarboxylic acid in accordance with the steps of (I) forming an amine salt of an aromatic polycarboxylic acid from the crude polycarboxylic acid and an amine, (II) continuously decomposing the salt in a salt decomposition reactor in operations of (i) supplying an aqueous solution of the amine salt of an organic polycarboxylic acid formed in the step of forming a salt, (ii) removing the amine and water by distillation under heating and (iii) taking out a slurry containing crystallized aromatic polycarboxylic acid, and (III) separating and recovering crystals of the aromatic polycarboxylic acid from the slurry which is taken out in the step of decomposing the salt.