Patents by Inventor Jiuan Lai

Jiuan Lai has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 6032994
    Abstract: In a semiconductor test equipment, in which test probes are placed into contact with bonding pads of semiconductor chips on a semiconductor wafer, an adjustment tool for adjusting the position of the test probes is disclosed. The adjustment tool comprises a cylindrical base portion, a triangular intermediate portion, and a flat, rectangular tip portion. The tool is preferably formed of used test probes comprised of tungsten. The tool is plated with a titanium nitride layer to increase the life of the tool.
    Type: Grant
    Filed: November 25, 1998
    Date of Patent: March 7, 2000
    Assignees: ProMOS Technologies Inc., Mosvel Vitelic Inc., Siemans AG
    Inventors: Cindy Chen, Liza Chen, Jiuan Lai, Jessie Chang, Kelly Liao