Abstract: A semiconductor device structure is provided. The semiconductor device structure includes a substrate having a device region and a seal ring region surrounding the device region. The semiconductor device structure includes a seal ring structure over the seal ring region. The seal ring structure surrounds the device region. The semiconductor device structure includes a bonding film over the seal ring structure and the substrate. The semiconductor device structure includes a bonding pad embedded in the bonding film. The bonding pad overlaps the seal ring structure along an axis perpendicular to a first top surface of the substrate, and a second top surface of the bonding pad is substantially level with a third top surface of the bonding film.

Abstract: A semiconductor package and a manufacturing method thereof are provided. The semiconductor package includes at least one semiconductor die, an interposer, an encapsulant, a protection layer and connectors. The interposer has a first surface, a second surface opposite to the first surface and sidewalls connecting the first and second surfaces. The semiconductor die is disposed on the first surface of interposer and electrically connected with the interposer. The encapsulant is disposed over the interposer and laterally encapsulating the at least one semiconductor die. The connectors are disposed on the second surface of the interposer and electrically connected with the at least one semiconductor die through the interposer. The protection layer is disposed on the second surface of the interposer and surrounding the connectors. The sidewalls of the interposer include slanted sidewalls connected to the second surface, and the protection layer is in contact with the slant sidewalls of the interposer.

Abstract: The invention introduces an apparatus for detecting errors during data encryption. The apparatus includes a search circuitry and a substitution check circuitry. The key generation circuitry is arranged operably to convert a first value of one byte corresponding to a plaintext, an intermediate encryption result, or a round key into a second value of a K-bit according to an 8-to-K lookup table, where K is an integer ranging from 10 to 15 and the second value comprises (K minus 8) bits of a Hamming parity. The substitution check circuitry is arranged operably to employ check formulae corresponding to the 8-to-K lookup table to determine whether an error is occurred during a conversion of the first value of the one byte into the second value of the K-bit, and output an error signal when finding the error, where a total amount of the formulae is K minus 8.

Abstract: An embodiment is a package including a package substrate and a package component bonded to the package substrate, the package component including an interposer, an optical die bonded to the interposer, the optical die including an optical coupler, an integrated circuit die bonded to the interposer adjacent the optical die, a lens adapter adhered to the optical die with a first optical glue, a mirror adhered to the lens adapter with a second optical glue, the mirror being aligned with the optical coupler of the optical die, and an optical fiber on the lens adapter, a first end of the optical fiber facing the mirror, the optical fiber being configured such that an optical data path extends from the first end of the optical fiber through the mirror, the second optical glue, the lens adapter, and the first optical glue to the optical coupler of the optical die.

Abstract: An antenna device, including a case assembly, a first waveguide assembly, and a second waveguide assembly, is provided. A cavity is defined by an interior of the case assembly, and a first side of the case assembly has a slot penetrating the case assembly. At least part of the first waveguide assembly is located within the cavity and is connected to the first side. A projection of the first waveguide assembly to the first side is symmetrically located on two sides of the slot. The second waveguide assembly is located outside the case assembly, is close to the first side, and is connected to the slot. The second waveguide assembly is suitable for transmitting an antenna signal to the cavity through the slot and the first waveguide assembly. The antenna signal resonates in the cavity and radiates outward from a second side of the cavity opposite to the first side.

Abstract: An antenna device, including a case assembly, a first waveguide assembly, and a second waveguide assembly, is provided. A cavity is defined by an interior of the case assembly, and a first side of the case assembly has a slot penetrating the case assembly. At least part of the first waveguide assembly is located within the cavity and is connected to the first side. A projection of the first waveguide assembly to the first side is symmetrically located on two sides of the slot. The second waveguide assembly is located outside the case assembly, is close to the first side, and is connected to the slot. The second waveguide assembly is suitable for transmitting an antenna signal to the cavity through the slot and the first waveguide assembly. The antenna signal resonates in the cavity and radiates outward from a second side of the cavity opposite to the first side.

Abstract: An antenna device includes a differential antenna and a first balun. The differential antenna includes a first radiator, a first antenna port and a second antenna port connected to a first surface of the first radiator. Orthographic projections of the first antenna port and the second antenna port projected to the first radiator are symmetrical to a midpoint of the first radiator. The first balun is located on one side of the first surface of the first radiator, and its orthographic projection on the first plane where the first surface is located overlaps the first surface. The first balun includes a first port, a first wiring, a first coupling structure electrically connected to the first antenna port, and a second coupling structure electrically connected to the second antenna port. Neither the first coupling structure nor the second coupling structure directly contacts the first wiring.

Abstract: Provided is a rapid over-the-air (OTA) production line test platform, including a device under test (DUT), an antenna array and two reflecting plates. The DUT has a beamforming function. The antenna array is arranged opposite to the DUT, and emits beams with beamforming. Two reflecting plates are disposed opposite to each other, and are arranged between the DUT and the antenna array. The beam OTA test of the DUT is carried out by propagation of the beams between the antenna array, the DUT and the two reflecting plates. Accordingly, the test time can be greatly shortened and the cost of test can be effectively reduced. In addition to the above-mentioned rapid OTA production line test platform, platforms for performing the OTA production line test by using horn antenna arrays together with bending waveguides and using a 3D elliptic curve are also provided.

Abstract: The disclosure provides an ultra-wideband non-metal horn antenna, which includes three combinable non-metal elements such as an impedance matching member, a field adjustment member and an outer cover member. The impedance matching member and the field adjustment member are respectively disposed with a first and second groove structures. The field adjustment member is connected between the impedance matching member and the outer cover member. Therefore, the horn antenna of the disclosure can have a more symmetrical radiation pattern, a smaller antenna size, and ultra-wideband performance.

Abstract: A broadband linear polarization antenna structure, including a reference conductive layer, a first patch antenna, a second patch antenna, and a feeding portion, is provided. The reference conductive layer includes through holes. A first short pin is connected between the reference conductive layer and the first patch antenna, and a second short pin is connected between the first patch antenna and the second patch antenna. Each feeding portion penetrates the reference conductive layer through the through hole and is coupled to the first patch antenna.

Abstract: The disclosure provides an ultra-wideband non-metal horn antenna, which includes three combinable non-metal elements such as an impedance matching member, a field adjustment member and an outer cover member. The impedance matching member and the field adjustment member are respectively disposed with a first and second groove structures. The field adjustment member is connected between the impedance matching member and the outer cover member. Therefore, the horn antenna of the disclosure can have a more symmetrical radiation pattern, a smaller antenna size, and ultra-wideband performance.

Abstract: The disclosure provides a coplanar inductor, which includes a first spiral arm, a second spiral arm and a conductive patch. The first spiral arm has a first end and a second end, wherein the first spiral arm spirally extends from the first end of the first spiral arm toward the second end of the first spiral arm from inside to outside. The second spiral arm has a first end and a second end. The second spiral arm extends spirally from the first end of the second spiral arm toward the second end of the second spiral arm from inside to outside. The first end of the second spiral arm is coupled to the first end of the first spiral arm through the conductive patch, and the first spiral arm and the second spiral arm are coplanar.

Abstract: Provided is a rapid over-the-air (OTA) production line test platform, including a device under test (DUT), an antenna array and two reflecting plates. The DUT has a beamforming function. The antenna array is arranged opposite to the DUT, and emits beams with beamforming. Two reflecting plates are disposed opposite to each other, and are arranged between the DUT and the antenna array. The beam OTA test of the DUT is carried out by propagation of the beams between the antenna array, the DUT and the two reflecting plates. Accordingly, the test time can be greatly shortened and the cost of test can be effectively reduced. In addition to the above-mentioned rapid OTA production line test platform, platforms for performing the OTA production line test by using horn antenna arrays together with bending waveguides and using a 3D elliptic curve are also provided.

Abstract: Provided is a rapid over-the-air (OTA) production line test platform, including a device under test (DUT), an antenna array and two reflecting plates. The DUT has a beamforming function. The antenna array is arranged opposite to the DUT, and emits beams with beamforming. Two reflecting plates are disposed opposite to each other, and are arranged between the DUT and the antenna array. The beam OTA test of the DUT is carried out by propagation of the beams between the antenna array, the DUT and the two reflecting plates. Accordingly, the test time can be greatly shortened and the cost of test can be effectively reduced. In addition to the above-mentioned rapid OTA production line test platform, platforms for performing the OTA production line test by using horn antenna arrays together with bending waveguides and using a 3D elliptic curve are also provided.

Abstract: Provided is a rapid over-the-air (OTA) production line test platform, including a device under test (DUT), an antenna array and two reflecting plates. The DUT has a beamforming function. The antenna array is arranged opposite to the DUT, and emits beams with beamforming. Two reflecting plates are disposed opposite to each other, and are arranged between the DUT and the antenna array. The beam OTA test of the DUT is carried out by propagation of the beams between the antenna array, the DUT and the two reflecting plates. Accordingly, the test time can be greatly shortened and the cost of test can be effectively reduced. In addition to the above-mentioned rapid OTA production line test platform, platforms for performing the OTA production line test by using horn antenna arrays together with bending waveguides and using a 3D elliptic curve are also provided.

Abstract: An antenna structure and an electronic device are provided. The antenna structure includes a connecting part, a grounding part, a first extending part and a second extending part. An angle is larger than zero between a first vector from the connecting point to the first open terminal and a second vector from the connecting point to the second open terminal. Also, a difference between the path length of a first path length and the path length of a second path length would be a quarter of the wave length of the radio frequency signal or a positive integer times thereof, so that the antenna is capable of receiving the radio frequency signal with circular polarizing.

Abstract: An antenna structure and an electronic device are provided. The antenna structure includes a connecting part, a grounding part, a first extending part and a second extending part. An angle is larger than zero between a first vector from the connecting point to the first open terminal and a second vector from the connecting point to the second open terminal. Also, a difference between the path length of a first path length and the path length of a second path length would be a quarter of the wave length of the radio frequency signal or a positive integer times thereof, so that the antenna is capable of receiving the radio frequency signal with circular polarizing.