Abstract: A semiconductor package includes a bottom substrate and a top substrate space apart from the bottom substrate such that the bottom substrate and the top substrate define a gap therebetween. A logic die is mounted on a top surface of the bottom substrate. The logic die has a thickness of 125-350 micrometers. A plurality of copper cored solder balls is disposed between the bottom substrate and the top substrate around the logic die to electrically connect the bottom substrate with the top substrate. A sealing resin fills into the gap between the bottom substrate and the top substrate and sealing the logic die and the plurality of copper cored solder balls in the gap.

Abstract: A high-bandwidth package-on-package (HBPoP) structure includes a first package structure and a second package structure disposed over the first package structure. The first package structure includes a first package substrate, a semiconductor die, an interposer, and a molding material. The first package substrate is formed of a silicon and/or ceramic material. The semiconductor die is disposed over the first package substrate. The interposer is disposed over the semiconductor die and is formed of a silicon and/or ceramic material. The molding material is disposed between the first package substrate and the interposer and surrounds the semiconductor die.

Abstract: A semiconductor package structure includes a package substrate, a semiconductor die, an interposer, an adhesive layer, and a molding material. The semiconductor die is disposed over the package substrate. The interposer is disposed over the semiconductor die. The adhesive layer connects the semiconductor die and the interposer. The molding material surrounds the semiconductor die and the adhesive layer.

Abstract: A semiconductor package includes a substrate; a die mounted on a top surface of the substrate in a flip-chip fashion; and a lid mounted on the die and on a perimeter of the substrate. The lid includes a cover plate and four walls formed integral with the cover plate. A liquid-cooling channel is situated between the cover plate of the lid and a rear surface of the die for circulating a coolant relative to the semiconductor package.

Abstract: A semiconductor device includes a substrate, an electronic component, a cover, a heat conduction component and a dam. The electronic component is disposed on the substrate. The cover is disposed on the substrate and covers the electronic component. The heat conduction component is disposed between the electronic component and the cover. The dam is disposed between the electronic component and the cover and surrounds the heat conduction component.

Abstract: An integrated circuit (IC) configurable to perform adaptive thermal ceiling control in a per-functional-block manner, an associated main circuit, an associated electronic device and an associated thermal control method are provided. The IC may include a plurality of hardware circuits arranged to perform operations of a first functional block, and at least one thermal control circuit. At least one temperature sensor is coupled with the first functional block to detect temperature and to generate at least one temperature sensing result of the first functional block.

Abstract: A semiconductor package includes a substrate; a die mounted on a top surface of the substrate in a flip-chip fashion; and a lid mounted on the die and on a perimeter of the substrate. The lid includes a cover plate and four walls formed integral with the cover plate. A liquid-cooling channel is situated between the cover plate of the lid and a rear surface of the die for circulating a coolant relative to the semiconductor package.

Abstract: A semiconductor assembly package is provided. The semiconductor package assembly includes a system-on-chip (SOC) package, a memory package and a heat spreader. The SOC package includes a logic die and a first substrate. The logic die has pads on it. The first substrate is electrically connected to the logic die by the pads. The memory package includes a second substrate and a memory die. The second substrate has a top surface and a bottom surface. The memory die is mounted on the top surface of the second substrate and is electrically connected to the second substrate using bonding wires. The heat spreader is disposed between the SOC package and the memory package, wherein the heat spreader is in contact with a back surface of the logic die away from the pads.

Abstract: A MIMO symbol detection and search method, a decoding circuit and a receiving antenna system are provided. The signal detection and search method includes the following steps. A symbol search tree is obtained, and a plurality of candidate symbols at each layer of the symbol search tree are sorted. The candidate symbols are traversed in sequence at each layer of the symbol search tree. At each layer of the symbol search tree, if a cumulative partial Euclidean distance is greater than or equal to a threshold, un-scanned candidate symbols are excluded. If the cumulative partial Euclidean distance is less than the threshold, the threshold is updated by the cumulative partial Euclidean distance. When all of the candidate symbols have been calculated, an estimated symbol combination is outputted, and the scan of the symbol search tree is terminated.

Abstract: An image processing apparatus and an image-based test strip identification method are provided. In the method, multiple representative values on a first axis of a test strip image are determined. The test strip image is obtained by capturing a test strip. A second axis parallel to a test line or a control line of the test strip is perpendicular to the first axis. A test result of the test strip is determined according to a difference between a first representative value and a second representative value of the representative values. The test result includes a positive result and a negative result.

Abstract: A semiconductor device includes a substrate, an electronic component, a cover and a liquid metal. The electronic component is disposed on the substrate. The cover is disposed on the substrate and covers the electronic component. The liquid metal is formed between the cover and the electronic component.

Abstract: A data compression method, a data compression system and an operation method of a deep learning acceleration chip are provided. The data compression method includes the following steps. A filter coefficient tensor matrix of a deep learning model is obtained. A matrix decomposition procedure is performed according to the filter coefficient tensor matrix to obtain a sparse tensor matrix and a transformation matrix, which is an orthonormal matrix. The product of the transformation matrix and the filter coefficient tensor matrix is the sparse tensor matrix. The sparse tensor matrix is compressed. The sparse tensor matrix and the transformation matrix, or the sparse tensor matrix and a restoration matrix, are stored in a memory. A convolution operation result is obtained by the deep learning acceleration chip using the sparse tensor matrix. The convolution operation result is restored by the deep learning acceleration chip using the restoration matrix.

Abstract: A semiconductor device includes a bottom package, a top package stacked on the bottom package, and an interposer disposed between the bottom package and the top package. The top package is electrically connected to the interposer through a plurality of peripheral solder balls. At least a dummy thermal feature is disposed on the interposer and surrounded by the plurality of peripheral solder balls.

Abstract: A semiconductor package includes a substrate; a die mounted on a top surface of the substrate in a flip-chip fashion; and a lid mounted on the die and on a perimeter of the substrate. The lid includes a cover plate and four walls formed integral with the cover plate. A liquid-cooling channel is situated between the cover plate of the lid and a rear surface of the die for circulating a coolant relative to the semiconductor package.

Abstract: A multi-configuration input device is described. In one or more examples, an input device comprises a connection portion configured to be secured to a mobile computing device using a magnetic connection, an input portion having one or more sensors configured to generate inputs responsive to user interaction, a support portion rotationally secured to the input portion and the connection portion and effective to assume a cover configuration in which the support portion and the input portion are positioned to cover a display device of the mobile computing device, and further effective to assume a stand configuration in which the support portion and the input portion are position at an acute angle with respect to one another, and an operating system selection key operable to select from a plurality of operating systems.

Abstract: A method, a computer program product, and a computer system for exchanging cloud resources between tenants. A mediator system receives from a user a request for a cloud resource, aggregates the cloud resource from one or more of the tenants, and replies the request for a cloud resource with a description of the cloud resource. The mediator system receives from the user a request for resource delegation, initiates a transaction of the cloud resource, retrieves the cloud resource from a resource pool, and determines whether the cloud resource complies with an access control list (ACL) policy. The mediator system enforces a resource acquisition, in response to determining that the cloud resource complies with the ACL policy. The mediator system the request for resource delegation with a resource delegation result.