Abstract: Disclosed is a chip scale gas discharge protective device whose metal coupled electrodes are fabricated through processes of yellow light, image formation, and electro casting of metal electrode, and the two electrodes are facing each other in arch lines with the distance of a gap controlled within the range of 0.5˜10 ?m, wherein the entire structure is performed by a bridge process without an extra gas filling procedure in the gap. Due to the fact that the gap is as small as only several ?m, a relevant potential difference existing across there is sufficient to ionize the air thereby suppressing the electro-static discharge (ESD) through the protected electronic device, whereas the fabrication method is disclosed.

Abstract: Disclosed is a chip scale gas discharge protective device whose metal coupled electrodes are fabricated through processes of yellow light, image formation, and electro-casting of metal electrode, and the two electrodes are facing each other in arch lines with the distance of a gap controlled within the range of 0.5˜10 ?m, wherein the entire structure is performed by a bridge process without an extra gas filling procedure in the gap. Due to the fact that the gap is as small as only several ?m, a relevant potential difference existing across there is sufficient to ionize the air thereby suppressing the electro-static discharge (ESD) through the protected electronic device, whereas the fabrication method is disclosed.