Abstract: Anti-CXCR2 antibodies that recognize CXCR2 and inhibit the activity of CXCR2, and the use of the anti-CXCR2 antibodies in the treatment of pancreatic cancer and leukemia.

Abstract: A method for forming semiconductor devices includes providing a substrate with a conductive pad formed thereon; forming a transparent structure over the substrate, wherein the transparent structure includes a plurality of collimating pillars adjacent to the conductive pad; forming a light-shielding structure over the plurality of collimating pillars and the conductive pad; performing a cutting process to remove one or more materials directly above the conductive pad, while leaving remaining material to cover the conductive pad, wherein the material includes a portion of the light-shielding structure; and performing an etching process to remove the remaining material to expose the conductive pad.

Abstract: The disclosure provides a masterbatch, a method for fabricating the same and a film formed from the masterbatch. The masterbatch includes a product prepared from a composition via polymerization and granulation. The composition includes: terephthalic acid; and a silicon dioxide dispersion, wherein the silicon dioxide dispersion includes surface-modified silicon dioxide particles disposed within ethylene glycol, and the surface-modified silicon dioxide particle has first functional groups and second functional groups bonded on the surface of the silicon dioxide particles, wherein the first functional groups have a structure represented by and the second functional groups include a C1-8 haloalkyl functional group, C1-8 alkoxy functional group, C1-8 aminoalkyl functional group, C2-8 alkenyl group, or epoxy group, R1 is hydrogen or a C1-3 alkyl functional group, and n is 1-4.

Abstract: A refrigeration system utilizing natural circulation of heat to carry out defrosting thereof provides a refrigeration cycle path and a defrost cycle path, and is characterized by a heat energy storage device located at an output of a compressor that is common for the two cycle paths. High-temperature high-pressure overheated refrigerant output by the compressor passes through the heat energy storage device and releases part of heat energy thereto for storage. When the refrigeration system is switched from the refrigeration cycle path to the defrost cycle path, the compressor is turned off and three-way valves upstream an evaporator are opened, a pressure difference between the heat energy storage device and the evaporator drives the hot refrigerant to directly flow through the three-way valves into a coil of the evaporator to melt frost on the coil from inner to outer side while the refrigerant keeps circulating along the defrost cycle path.

Abstract: Disclosed herein are UV-resistant gelatin/silica coated viral particles, methods for producing the same, and methods for controlling agricultural insect pests using the UV-resistant gelatin/silica coated viral particles.

Abstract: The disclosure provides a masterbatch, a method for fabricating the same and a film formed from the masterbatch. The masterbatch includes a product prepared from a composition via polymerization and granulation. The composition includes: terephthalic acid; and a silicon dioxide dispersion, wherein the silicon dioxide dispersion includes surface-modified silicon dioxide particles disposed within ethylene glycol, and the surface-modified silicon dioxide particle has first functional groups and second functional groups bonded on the surface of the silicon dioxide particles, wherein the first functional groups have a structure represented by and the second functional groups include a C1-8 haloalkyl functional group, C1-8 alkoxy functional group, C1-8 aminoalkyl functional group, C2-8 alkenyl group, or epoxy group, R1 is hydrogen or a C1-3 alkyl functional group, and n is 1-4.

Abstract: Disclosed is an ink composition used in an electrowetting display device and an electrowetting display device employing the same. The ink composition used in the electrowetting display device includes a non-polar solvent and a modified hydrophobic pigment, wherein the modified hydrophobic pigment has a structure represented by Formula (I), of P-Gn wherein P is a pigment moiety, n is 1-4 and G is wherein R1 is a straight chain or a branched C4-20 alkyl group, or C5-20 cycloalkyl group.

Abstract: Disclosed is an ink composition used in an electrowetting display device and an electrowetting display device employing the same. The ink composition used in the electrowetting display device includes a non-polar solvent and a modified hydrophobic pigment, wherein the modified hydrophobic pigment has a structure represented by Formula (I), of P-Gn wherein P is a pigment moiety, n is 1-4 and G is wherein R1 is a straight chain or a branched C4-20 alkyl group, or C5-20 cycloalkyl group.

Abstract: A visual navigation system and method based on structured light are provided. The visual navigation system at least includes at least one projector for generating a specific path pattern formed by structured light, and a visual server. In addition to facilitating the visual navigation system to detect an obstacle, the pattern formed by the structured light provides a specific path pattern followed by robots during the navigation. In the visual navigation method, when detecting the obstacle, the visual server routes a virtual path and issues a movement-control command to the robots, which in turn follow the virtual path. The present invention is capable of raising the accuracy for the robot navigation and reducing operation burden of the visual server by using the structured light to guide the robots.

Abstract: A semiconductor device package and a method of fabricating the same are provided. The semiconductor device package includes a substrate, a first chip, a jumper chip, a plurality of first bonding wires and a plurality of second bonding wires. The substrate has a plurality of contact pads. The first chip is disposed and electrically connected to the substrate via the first bonding wires. The jumper chip is disposed on the first chip and has a plurality of metal pads. Each of the metal pads is electrically connected to two contact pads of the substrate via two second bonding wires, respectively.

Abstract: A semiconductor device package and a method of fabricating the same are disclosed. The semiconductor device package includes a substrate, a first chip, a jumper chip, a plurality of first bonding wires and a plurality of second bonding wires. The substrate has a plurality of contact pads. The first chip is disposed and electrically connected to the substrate via the first bonding wires. The jumper chip is disposed on the first chip and has a plurality of metal pads. Each of the metal pads is electrically connected to two contact pads of the substrate via two second bonding wires, respectively.

Abstract: A testing method for a network device includes the steps of communicating with the network device through a network protocol by a testing host; and transmitting at least one first network protocol packet to the network device so as to enable a command line interface (CLI) of the network device through a first testing command by the testing host.

Abstract: A high-resolution remote sensing image is processed through a true ortho-rectification. A totally new idea of H-buffer is provided to store heights of objects on the ground. The ortho-rectification includes a hidden analysis, a hidden detection and a hidden compensation. The process uses polygon patch of a building or a roadway as process unit. In the end, seam lines after hidden compensation are smoothed. The whole process time is reduced in calculations, assures quality of the orthoimage, and meets a requirement of a high-accuracy and high-resolution digital mapping.

Abstract: The present invention provides coefficient for a strip-based image taken by a satellite. By using the coefficient, the absolute error of the image can be made smaller than two pixels. Therefore, the accuracy of the image is high. The present invention can be applied to any pushbroom scanning satellite.

Abstract: A recyclable stamp device and a recyclable stamp process for wafer bond are provided. The recyclable stamp device includes a substrate, a protective layer, a stack film structure and a cap. The protective layer is disposed on the substrate. An opening is positioned at the substrate and the protective layer to expose the substrate. The stack film structure includes an adhesion layer, a stress control layer and a wafer bond alignment mark layer. The adhesion layer is disposed on the protective layer and the exposed substrate. The stress control layer is disposed on the adhesion layer. The wafer bond alignment mark layer is disposed on the stress control layer. The wafer bond alignment mark layer includes an alignment mark at a side of the opening. The cap has a capping portion disposed on the wafer bond alignment mark layer corresponding to the opening.

Abstract: This invention relates to macrocyclic compounds of formula (I) or (II) shown in the specification. These compounds can be used to treat hepatitis C virus infection.

Abstract: A visual navigation system and method based on structured light are provided. The visual navigation system at least includes at least one projector for generating a specific path pattern formed by structured light, and a visual server. In addition to facilitating the visual navigation system to detect an obstacle, the pattern formed by the structured light provides a specific path pattern followed by robots during the navigation. In the visual navigation method, when detecting the obstacle, the visual server routes a virtual path and issues a movement-control command to the robots, which in turn follow the virtual path. The present invention is capable of raising the accuracy for the robot navigation and reducing operation burden of the visual server by using the structured light to guide the robots.

Abstract: A wafer structure including a semiconductor substrate, a number of UBM layers and a number of bumps is provided. The semiconductor substrate has an active surface, a number of bonding pads and a passivation layer. The bonding pads are positioned on the active surface of the semiconductor substrate. The passivation layer covers the active surface of the semiconductor substrate and exposes the bonding pads. The UBM layers are respectively arranged on the bonding pads, and each UBM layer includes an adhesive layer, a super-lattice barrier layer and a wetting layer. The adhesion layer is disposed on bonding pads. The super-lattice barrier layer is disposed on the adhesion layer and includes a number of alternately stacked sub-barrier layers and sub-wetting layers. The wetting layer is disposed on the super-lattice barrier layer, and the bump is disposed on the wetting layer.

Abstract: A testing method for a network device includes the steps of communicating with the network device through a network protocol by a testing host; and transmitting at least one first network protocol packet to the network device so as to enable a command line interface (CLI) of the network device through a first testing command by the testing host.

Abstract: An identifying method includes the following steps. First, a network device automatically retrieves a network address as the address thereof. Then, a testing host transmits at least one network protocol package to the network device. The network protocol package includes a network protocol header and the network protocol data, which defines the address of the network device. Accordingly, the testing host can identify the network device according to the address of the network device.