Abstract: A method and an electronic device for translating a speech signal between a first language and a second language with minimized translation delay by translating fewer than all words of the speech signal according to a level of understanding of the second language by a user that receives the translation.

Abstract: The inventive concept provides a substrate treating apparatus. The substrate treating apparatus includes a support unit configured to support a substrate; and a cleaning unit configured to clean a bottom surface of the substrate supported on the support unit, and wherein the cleaning unit comprises: a body; and a protrusion formed to be upwardly protruding from the body, and the protrusion is positioned to be spaced apart from the bottom surface.

Abstract: A method and an electronic device for translating a speech signal between a first language and a second language with minimized translation delay by translating fewer than all words of the speech signal according to a level of understanding of the second language by a user that receives the translation.

Abstract: A semiconductor device includes a lower electrode structure, an upper electrode structure, and a dielectric layer between the lower and upper electrode structures and on side surfaces and an upper surface of the lower electrode structure. The lower electrode structure includes a first lower electrode pattern having a cylindrical shape, a barrier layer on the first lower electrode pattern, and a second lower electrode pattern in a space defined by the barrier layer.

Abstract: A deposition equipment is provided. The deposition equipment includes: a reaction chamber including an upper plate and a container body, the upper plate including a gas supplier for injecting a processing gas; a wafer chuck including an upper surface on which a wafer is loaded, in the reaction chamber, with the upper surface of the wafer chuck facing the upper plate; and a processing gas shielding section which prevents the processing gas from being adsorbed to the upper surface of the wafer chuck and is disposed between the upper plate and the wafer chuck in a state in which the wafer is removed from the wafer chuck. The processing gas shielding section includes a shutter which is plate-like, and the shutter includes a region including a gas discharge section for jetting a purging gas toward the wafer chuck.

Abstract: A semiconductor device includes a lower electrode structure, an upper electrode structure, and a dielectric layer between the lower and upper electrode structures and on side surfaces and an upper surface of the lower electrode structure. The lower electrode structure includes a first lower electrode pattern having a cylindrical shape, a barrier layer on the first lower electrode pattern, and a second lower electrode pattern in a space defined by the barrier layer.

Abstract: A tool changing system of a machining center for machining a workpiece of a vehicle includes a machining unit including a jig portion for loading the workpiece and a tool loading device for loading a tool for machining the workpiece, a first magazine for storing a plurality of first tools, a second magazine for storing a plurality of second tools, and a controller configured to manage changing of the first tool between the machining unit and the first magazine and changing of the second tool between the machining unit.

Abstract: A semiconductor device includes a lower electrode structure, an upper electrode structure, and a dielectric layer between the lower and upper electrode structures and on side surfaces and an upper surface of the lower electrode structure. The lower electrode structure includes a first lower electrode pattern having a cylindrical shape, a barrier layer on the first lower electrode pattern, and a second lower electrode pattern in a space defined by the barrier layer.

Abstract: An apparatus for activating a membrane electrode assembly (MEA) for fuel cells includes: a frame. A plurality of separation plates are disposed on an upper side of a base plate, which is disposed on a top portion of the frame, to move straightly in a length direction. The plurality of separation plates are spaced apart from each other with the MEA interposed therebetween in the direction in which the separation plates move. A tilt unit, which is connected to the frame and the base plate, upwardly tilt the base plate with respect to the frame and remove a coolant generated when the MEA is activated.

Abstract: A deposition equipment is provided. The deposition equipment includes: a reaction chamber including an upper plate and a container body, the upper plate including a gas supplier for injecting a processing gas; a wafer chuck including an upper surface on which a wafer is loaded, in the reaction chamber, with the upper surface of the wafer chuck facing the upper plate; and a processing gas shielding section which prevents the processing gas from being adsorbed to the upper surface of the wafer chuck and is disposed between the upper plate and the wafer chuck in a state in which the wafer is removed from the wafer chuck. The processing gas shielding section includes a shutter which is plate-like, and the shutter includes a region including a gas discharge section for jetting a purging gas toward the wafer chuck.

Abstract: A semiconductor device includes a lower electrode structure, an upper electrode structure, and a dielectric layer between the lower and upper electrode structures and on side surfaces and an upper surface of the lower electrode structure. The lower electrode structure includes a first lower electrode pattern having a cylindrical shape, a barrier layer on the first lower electrode pattern, and a second lower electrode pattern in a space defined by the barrier layer.

Abstract: A method of manufacturing a semiconductor device, the method including supplying a first reactant to inside a processing chamber into which a substrate has been introduced; controlling a flow of a first purge gas and storing the first purge gas, of which flow has been controlled, in a first storage for a given time period; supplying the first purge gas from the first storage to the inside of the processing chamber after supplying the first reactant; and supplying a second reactant to the inside of the processing chamber after supplying the first purge gas.

Abstract: A semiconductor device includes a lower electrode structure, an upper electrode structure, and a dielectric layer between the lower and upper electrode structures and on side surfaces and an upper surface of the lower electrode structure. The lower electrode structure includes a first lower electrode pattern having a cylindrical shape, a barrier layer on the first lower electrode pattern, and a second lower electrode pattern in a space defined by the barrier layer.

Abstract: A slab scarfing apparatus comprises: an upper nozzle unit having an upper surface nozzle for scarfing an edge portion of the upper surface of a slab and having a first side nozzle scarfing an upper edge portion of the side surface of the slab and moving together with the upper surface nozzle; a lower nozzle unit having a lower nozzle for scarfing an edge portion of the lower surface of the slab and having a second side nozzle scarfing a lower edge portion of the side surface of the slab and moving together with the lower nozzle; and a moving apparatus for moving the upper nozzle unit and the lower nozzle unit to allow the upper nozzle unit and the lower nozzle unit to be adjacent to or to be spaced apart from an edge portion of the slab. A method of controlling the apparatus is provided.

Abstract: An apparatus for activating a membrane electrode assembly (MEA) for fuel cells includes: a frame. A plurality of separation plates are disposed on an upper side of a base plate, which is disposed on a top portion of the frame, to move straightly in a length direction. The plurality of separation plates are spaced apart from each other with the MEA interposed therebetween in the direction in which the separation plates move. A tilt unit, which is connected to the frame and the base plate, upwardly tilt the base plate with respect to the frame and remove a coolant generated when the MEA is activated.

Abstract: An apparatus for activating a membrane electrode assembly (MEA) for fuel cells includes: a frame. A plurality of separation plates are disposed on an upper side of a base plate, which is disposed on a top portion of the frame, to move straightly in a length direction. The plurality of separation plates are spaced apart from each other with the MEA interposed therebetween in the direction in which the separation plates move. A tilt unit, which is connected to the frame and the base plate, upwardly tilt the base plate with respect to the frame and remove a coolant generated when the MEA is activated.

Abstract: A semiconductor device includes a lower electrode structure, an upper electrode structure, and a dielectric layer between the lower and upper electrode structures and on side surfaces and an upper surface of the lower electrode structure. The lower electrode structure includes a first lower electrode pattern having a cylindrical shape, a barrier layer on the first lower electrode pattern, and a second lower electrode pattern in a space defined by the barrier layer.

Abstract: A method of manufacturing a semiconductor device, the method including supplying a first reactant to inside a processing chamber into which a substrate has been introduced; controlling a flow of a first purge gas and storing the first purge gas, of which flow has been controlled, in a first storage for a given time period; supplying the first purge gas from the first storage to the inside of the processing chamber after supplying the first reactant; and supplying a second reactant to the inside of the processing chamber after supplying the first purge gas.

Abstract: A slab scarfing apparatus comprises: an upper nozzle unit having an upper surface nozzle for scarfing an edge portion of the upper surface of a slab and having a first side nozzle scarfing an upper edge portion of the side surface of the slab and moving together with the upper surface nozzle; a lower nozzle unit having a lower nozzle for scarfing an edge portion of the lower surface of the slab and having a second side nozzle scarfing a lower edge portion of the side surface of the slab and moving together with the lower nozzle; and a moving apparatus for moving the upper nozzle unit and the lower nozzle unit to allow the upper nozzle unit and the lower nozzle unit to be adjacent to or to be spaced apart from an edge portion of the slab. A method of controlling the apparatus is provided.

Abstract: An apparatus and method are provided for fastening a fuel cell stack capable of significantly enhancing assembly characteristics and productivity of a stack by preventing insulating plates, when assembled, from being interfered or hampered by other components, while maintaining the stack pressed with appropriate pressure applied thereto. The apparatus includes a loading jig into which a stack is loaded and a press block that is configured to press the stack. Additionally, a pressing maintaining unit is configured to maintain the stack in a pressed state by the press block.