Abstract: A circuit includes a voltage divider circuit configured to generate a feedback voltage according to an output voltage, an operational amplifier configured to output a driving signal according to the feedback voltage and a reference voltage and a pass gate circuit including multiple current paths. The current paths are controlled by the driving signal and connected in parallel between the voltage divider circuit and a power reference node.

Abstract: A head-mounted device may include optical assemblies for presenting images to a user. Motors may be used to adjust the spacing between the optical assemblies to accommodate different interpupillary distances. The head-mounted device may have a housing that receives a custom-fit removable light seal with vision correction lenses. A sensor or wireless transceiver in the housing may receive interpupillary distance information from the light seal. Based on this information, the motors may adjust the optical assemblies so that the optical assemblies are spaced apart by an amount that matches the interpupillary distance associated with the user of the custom-fit removable light seal.

Abstract: A device includes a molding compound, a plurality of through vias, a seal ring structure, and a protection layer. The plurality of through vias are embedded in the molding compound. The seal ring structure is over the molding compound and surrounds the through vias in a top view. The protection layer covers the seal ring and extends toward the molding compound in a cross-sectional view.

Abstract: A device includes a semiconductor chip, a molding compound, an insulating structure, an under-bump-metallurgy (UBM), a conductive ball, and a protection layer. The molding compound laterally surrounds the semiconductor chip. The insulating structure is over the semiconductor chip and the molding compound. The UBM is over the insulating structure and is electrically connected to the semiconductor chip. The conductive ball is in contact with the UBM. The protection layer extends from the UBM to the molding compound.

Abstract: A semiconductor device and method that comprise a first dielectric layer over a encapsulant that encapsulates a via and a semiconductor die is provided. A redistribution layer is over the first dielectric layer, and a second dielectric layer is over the redistribution layer, and the second dielectric layer comprises a low-temperature polyimide material.

Abstract: A semiconductor device and method that comprise a first dielectric layer over a encapsulant that encapsulates a via and a semiconductor die is provided. A redistribution layer is over the first dielectric layer, and a second dielectric layer is over the redistribution layer, and the second dielectric layer comprises a low-temperature polyimide material.

Abstract: Provided herein is an engagement and care support platform (“ECSP”) computer system including at least one processor in communication with at least one memory device for facilitating senior user engagement. The processor is programmed to: (i) register a user through an application, (ii) register a caregiver associated with the user through the application, (iii) generate a senior profile based upon user personal and scheduling data, (iv) build a daily interactive user interface that reflects the senior profile, (v) display the daily interactive user interface at a first client device associated with the user, (vi) cause the first client device to initiate a daily interaction prompt to the user, (vii) determine whether any user interaction was received in response to the daily interaction prompt, and (viii) transmit a daily update message to a second client device associated with the caregiver, including an indication of whether any user interaction was received.

Abstract: Provided herein is an engagement and care support platform (“ECSP”) computer system including at least one processor in communication with at least one memory device for facilitating senior user engagement. The processor is programmed to: (i) register a user through an application, (ii) register a caregiver associated with the user through the application, (iii) generate a senior profile based upon user personal and scheduling data, (iv) build a daily interactive user interface that reflects the senior profile, (v) display the daily interactive user interface at a first client device associated with the user, (vi) cause the first client device to initiate a daily interaction prompt to the user, (vii) determine whether any user interaction was received in response to the daily interaction prompt, and (viii) transmit a daily update message to a second client device associated with the caregiver, including an indication of whether any user interaction was received.

Abstract: A device includes a semiconductor chip, a molding compound, an insulating structure, an under-bump-metallurgy (UBM), a conductive ball, and a protection layer. The molding compound laterally surrounds the semiconductor chip. The insulating structure is over the semiconductor chip and the molding compound. The UBM is over the insulating structure and is electrically connected to the semiconductor chip. The conductive ball is in contact with the UBM. The protection layer extends from the UBM to the molding compound.

Abstract: A method includes forming an insulating film over a semiconductor structure, forming a sealing ring over a sidewall of the insulating film, and forming a protective layer over an exposed sidewall of the sealing ring. The semiconductor structure includes a semiconductor chip and a molding compound disposed around the semiconductor chip. The exposed sidewall of the sealing ring faces away from the sidewall of the insulating film.

Abstract: A semiconductor device and method that comprise a first dielectric layer over a encapsulant that encapsulates a via and a semiconductor die is provided. A redistribution layer is over the first dielectric layer, and a second dielectric layer is over the redistribution layer, and the second dielectric layer comprises a low-temperature polyimide material.

Abstract: A semiconductor device and method that comprise a first dielectric layer over a encapsulant that encapsulates a via and a semiconductor die is provided. A redistribution layer is over the first dielectric layer, and a second dielectric layer is over the redistribution layer, and the second dielectric layer comprises a low-temperature polyimide material.

Abstract: A method includes forming an insulating film over a semiconductor structure, forming a sealing ring over a sidewall of the insulating film, and forming a protective layer over an exposed sidewall of the sealing ring. The semiconductor structure includes a semiconductor chip and a molding compound disposed around the semiconductor chip. The exposed sidewall of the sealing ring faces away from the sidewall of the insulating film.

Abstract: A semiconductor device and method that comprise a first dielectric layer over a encapsulant that encapsulates a via and a semiconductor die is provided. A redistribution layer is over the first dielectric layer, and a second dielectric layer is over the redistribution layer, and the second dielectric layer comprises a low-temperature polyimide material.

Abstract: A method of manufacturing a semiconductor device includes: receiving a semiconductor structure having a chip region, a seal ring region surrounding the chip region, and a scribe region surroundingly defined around the seal ring region, the semiconductor structure including: a semiconductor chip in the chip region; and a molding compound disposed around the semiconductor chip and distributed in the chip region, the seal ring region and the scribe region; forming an insulating film over the chip region of the semiconductor structure and the seal ring region of the semiconductor structure; forming a seal ring over the seal ring region of the semiconductor structure and laterally adjacent to the insulating film, in which the seal ring has an exposed lateral surface facing away from the insulating film; and forming a protective layer that defines a substantially smooth and inclined lateral surface over the exposed lateral surface of the seal ring.

Abstract: A semiconductor device and method that comprise a first dielectric layer over a encapsulant that encapsulates a via and a semiconductor die is provided. A redistribution layer is over the first dielectric layer, and a second dielectric layer is over the redistribution layer, and the second dielectric layer comprises a low-temperature polyimide material.

Abstract: A method of manufacturing a semiconductor device includes: receiving a semiconductor structure having a chip region, a seal ring region surrounding the chip region, and a scribe region surroundingly defined around the seal ring region, the semiconductor structure including: a semiconductor chip in the chip region; and a molding compound disposed around the semiconductor chip and distributed in the chip region, the seal ring region and the scribe region; forming an insulating film over the chip region of the semiconductor structure and the seal ring region of the semiconductor structure; forming a seal ring over the seal ring region of the semiconductor structure and laterally adjacent to the insulating film, in which the seal ring has an exposed lateral surface facing away from the insulating film; and forming a protective layer that defines a substantially smooth and inclined lateral surface over the exposed lateral surface of the seal ring.

Abstract: A semiconductor device and method that comprise a first dielectric layer over a encapsulant that encapsulates a via and a semiconductor die is provided. A redistribution layer is over the first dielectric layer, and a second dielectric layer is over the redistribution layer, and the second dielectric layer comprises a low-temperature polyimide material.

Abstract: Techniques for detecting and addressing performance issues related to a mobile application are provided. Examples of performance issues include a backend service (to which the mobile application is configured to transmit requests) becoming unavailable or overloaded, a third-party service that the mobile application relies on for data pertaining to the backend service becoming unavailable, and security vulnerabilities or code irregularities in the code of the mobile application. A fallback service that is separate from the backend service detects the performance issues and sends fallback data to the mobile application. The fallback data may cause the mobile application to operate in an offline mode, where the mobile application requests locally stored data instead of transmitting data requests to the backend service. The fallback data may reference page views that the mobile application downloads and displays instead of other page views that are based on data from the backend service.

Abstract: Techniques for detecting and addressing performance issues related to a mobile application are provided. Examples of performance issues include a backend service (to which the mobile application is configured to transmit requests) becoming unavailable or overloaded, a third-party service that the mobile application relies on for data pertaining to the backend service becoming unavailable, and security vulnerabilities or code irregularities in the code of the mobile application. A fallback service that is separate from the backend service detects the performance issues and sends fallback data to the mobile application. The fallback data may cause the mobile application to operate in an offline mode, where the mobile application requests locally stored data instead of transmitting data requests to the backend service. The fallback data may reference page views that the mobile application downloads and displays instead of other page views that are based on data from the backend service.