Abstract: A projection exposure apparatus includes a projection lens, a wavefront manipulator and a wavefront measuring device for measuring a wavefront in the projection lens. The wavefront measuring device includes a Moiré grating arrangement having an object grating and an image grating which are designed to be arranged in an object plane and an image plane, respectively, of the projection lens. The object grating and the image grating are coordinated with one another in a manner true to scale in such a way as to generate a Moiré superimposition pattern from an imaging of the object grating onto the image plane and the image grating. The Moiré grating arrangement is designed in such a way as to simultaneously generate the Moiré superimposition pattern for a plurality of field points of an object field in the object plane and/or of an image field in the image plane.

Abstract: A lithography apparatus is disclosed, which comprises a mirror having at least two mirror segments which are joined together in such a way that an interspace is formed between the mirror segments, and a sensor for detecting the relative position of the mirror segments, wherein the sensor is arranged in the interspace between the mirror segments.

Abstract: A projection exposure apparatus includes a projection lens, a wavefront manipulator and a wavefront measuring device for measuring a wavefront in the projection lens. The wavefront measuring device includes a Moiré grating arrangement having an object grating and an image grating which are designed to be arranged in an object plane and an image plane, respectively, of the projection lens. The object grating and the image grating are coordinated with one another in a manner true to scale in such a way as to generate a Moiré superimposition pattern from an imaging of the object grating onto the image plane and the image grating. The Moiré grating arrangement is designed in such a way as to simultaneously generate the Moiré superimposition pattern for a plurality of field points of an object field in the object plane and/or of an image field in the image plane.

Abstract: A method for producing an optical element includes: providing a substrate (102), applying a layer system (103), wherein an optically effective surface (101) is formed and wherein the layer system has a layer (104) that is thermally deformable for manipulating the geometric shape of the optically effective surface, and applying a temperature field to the optical element while at least regionally heating the thermally deformable layer to above a specified operating temperature of the optical system. The thermally deformable layer is configured such that a deformation that is induced when the temperature field is applied is at least partially maintained after the optical element has cooled. Also disclosed is an optical element (400) that has an optically effective surface (401), a substrate (402), and a layer system (403) that has a reflection layer system (406), which includes a shape-memory alloy.

Abstract: An optical component for coupling out an individual output beam from a collective output beam includes a plurality of radiation-reflecting regions which are grouped in such a way that regions of the same group serve for guiding different partial beams of the individual output beam to the same scanner.

Abstract: A projection exposure apparatus (10) for microlithography has a plurality of optical components (M1-M6) forming an exposure beam path, as well as a distance measurement system (30, 130, 230) configured to measure a distance between at least one of the optical components and a reference element (40, 140, 240). The distance measurement system comprises a frequency comb generator (32, 132, 232), which is configured to generate electromagnetic radiation (36, 236) having a comb-shaped frequency spectrum.

Abstract: A projection exposure apparatus (10) for microlithography has a plurality of optical components (M1-M6) forming an exposure beam path, as well as a distance measurement system (30, 130, 230) configured to measure a distance between at least one of the optical components and a reference element (40, 140, 240). The distance measurement system comprises a frequency comb generator (32, 132, 232), which is configured to generate electromagnetic radiation (36, 236) having a comb-shaped frequency spectrum.

Abstract: A projection exposure apparatus for microlithography, in particular an EUV projection exposure apparatus, having a beam path along which propagates electromagnetic radiation with which the projection exposure apparatus is operated, and having at least one filter (55) arranged in the beam path, wherein the projection exposure apparatus furthermore comprises at least one sensor device for monitoring the filter, wherein at least one blocking element (60) is provided which is movable between a standby position and a bather position, and wherein the movement of the blocking element can be effected at least in a manner dependent on a signal of the sensor device. An associated method for operating an apparatus of this type is also disclosed.

Abstract: A method for cooling an optical element for EUV applications is disclosed. Heat is transferred from the optical element to a heat sink, and, via a first feed line, a first cooling medium is introduced into a cooling channel in the heat sink, in such a way that the first cooling medium effects laminar flow through the cooling channel and in the process absorbs heat from the heat sink. After flowing through the cooling channel, the first cooling medium is discharged into a discharge line leading away from the optical element. A second cooling medium is introduced into the discharge line via a second feed line, and the first cooling medium and the second cooling medium, downstream of the second feed line at a location that is further away from the optical element than the cooling channel, are subjected to a force field introduced into the discharge line externally.

Abstract: A facet mirror device includes a facet element and a support element which supports the facet element. The facet element includes a curved support section. The support element includes a support section. The support section of the support element forms a support edge which contacts the curved support section of the facet element.

Abstract: The invention concerns an arrangement for thermal actuation of a mirror in a microlithographic projection exposure apparatus, wherein the mirror has an optical effective surface and at least one access passage extending from a surface of the mirror, that does not correspond to the optical effective surface, in the direction of the effective surface, wherein the arrangement is designed for thermal actuation of the mirror via electromagnetic radiation which is propagated in the access passage, wherein the arrangement further has at least one heat radiating mechanism which produces the electromagnetic radiation which is propagated in the access passage, and wherein the heat radiating mechanism is actuable along the access passage.

Abstract: An illumination optical system for EUV microlithography is used to direct an illumination light beam from a radiation source to an object field. At least one EUV mirror has a reflective face with a nonplanar mirror topography for forming the illumination light beam. The EUV mirror has at least one EUV attenuator arranged in front of it. The attenuator face which faces the reflective face of the EUV mirror has an attenuator topography which is designed to complement the mirror topography such that at least sections of the attenuator face are arranged at a constant interval from the reflective face. The result is an illumination optical system in which it is possible to correct unwanted variations in illumination parameters, for example an illumination intensity distribution or an illumination angle distribution, over the object field with as few unwanted radiation losses as possible.

Abstract: A facet mirror device includes a facet element, a support device and a clamping device. The facet element includes a first support section, while the support device comprises a second support section contacting the first support section to support the facet element. The clamping device includes a tensioning element, a first end of the tensioning element being connected to the facet element a second end of the tensioning element being connected to a counter unit. The counter unit includes a third support section, the support device including a fourth support section contacting the third support section to support the counter unit.

Abstract: The invention relates to an optical element for a projection exposure apparatus for semiconductor lithography comprising an optically active surface and at least one cooling component for cooling the optical element, wherein the cooling component is connected to at least two separate cooling circuits and embodied in such a way that the optically active surface can be cooled to a greater extent in at least one partial region than in a further partial region. The invention furthermore relates to a projection exposure apparatus comprising an optical element according to the invention.

Abstract: There is provided an optical element unit comprising an optical element, a connector element, and an optical element holder. The optical element has a plane of main extension as well as an outer circumference and defines a radial direction. The connector element connects the optical element and the optical element holder, the connector element having a first connector part connected to the optical element at the outer circumference and a second connector part connected to the optical element holder. The first connector part and the second connector part are connected via at least one coupling part, the coupling part being compliant in the radial direction and substantially preventing rotation between the first connector part and the second connector part in a plane substantially parallel to the plane of main extension.

Abstract: The disclosure concerns an arrangement for mirror temperature measurement and/or thermal actuation of a mirror in a microlithographic projection exposure apparatus. The mirror has an optical effective surface and at least one access passage extending from a surface of the mirror, that does not correspond to the optical effective surface, in the direction of the effective surface. The arrangement is designed for mirror temperature measurement and/or thermal actuation of the mirror via electromagnetic radiation which is propagated along the access passage. The electromagnetic radiation is reflected a plurality of times within the access passage.

Abstract: The invention relates to a projection exposure apparatus for semiconductor lithography, comprising an illumination system for illuminating a mask arranged on a movable mask stage, and comprising a projection lens for imaging the mask onto a semiconductor substrate, wherein at least one means is present for at least partly decoupling at least parts of the illumination system and/or of the projection lens from the influence of pressure fluctuations in the medium surrounding the projection lens or the illuminated system, the pressure fluctuations being attributed to movements of the mask stage during the operation of the apparatus.

Abstract: There is provided an optical element unit comprising an optical element, a connector element, and an optical element holder. The optical element has a plane of main extension as well as an outer circumference and defines a radial direction. The connector element connects the optical element and the optical element holder, the connector element having a first connector part connected to the optical element at the outer circumference and a second connector part connected to the optical element holder. The first connector part and the second connector part are connected via at least one coupling part, the coupling part being compliant in the radial direction and substantially preventing rotation between the first connector part and the second connector part in a plane substantially parallel to the plane of main extension.

Abstract: A projection exposure apparatus (10) for microlithography has a plurality of optical components (M1-M6) forming an exposure beam path, as well as a distance measurement system (30, 130, 230) configured to measure a distance between at least one of the optical components and a reference element (40, 140, 240). The distance measurement system comprises a frequency comb generator (32, 132, 232), which is configured to generate electromagnetic radiation (36, 236) having a comb-shaped frequency spectrum.

Abstract: A projection exposure apparatus for microlithography, in particular an EUV projection exposure apparatus, having a beam path along which propagates electromagnetic radiation with which the projection exposure apparatus is operated, and having at least one filter (55) arranged in the beam path, wherein the projection exposure apparatus furthermore comprises at least one sensor device for monitoring the filter, wherein at least one blocking element (60) is provided which is movable between a standby position and a bather position, and wherein the movement of the blocking element can be effected at least in a manner dependent on a signal of the sensor device. An associated method for operating an apparatus of this type is also disclosed.