Abstract: Certain aspects of the present disclosure can be implemented in an electroacoustic device. The electroacoustic device generally includes: a substrate; a bottom electrode layer disposed above the substrate; an acoustic mirror stack having a dielectric layer disposed above the bottom electrode layer and a conductive layer disposed above the dielectric layer; a piezoelectric layer disposed above the acoustic mirror stack; and one or more vias disposed between the bottom electrode layer and the conductive layer, the one or more vias electrically coupling the bottom electrode layer and the conductive layer.

Abstract: A computer-implemented method is provided for creating a packaging production dataset for a consumer product packaging, including the steps of: providing a database of pre-approved packaging features in different categories, each having assigned metadata; receiving a selection of pre-approved packaging features; receiving a selection of at least one production machine for the packaging; evaluating the selection of pre-approved packaging features based on its metadata, the evaluating including evaluating its compatibility with the received selection of at least one production machine, the evaluating being based on a comparison of a production machine dataset with a packaging feature, including the metadata thereof; and creating the packaging production dataset defining a packaging according to the pre-approved packaging features. A method for producing a packaging, and a computer system including a graphical user interface, are also provided.

Abstract: Certain aspects of the present disclosure can be implemented in an electroacoustic device. The electroacoustic device generally includes: a substrate; a bottom electrode layer disposed above the substrate; an acoustic mirror stack having a dielectric layer disposed above the bottom electrode layer and a conductive layer disposed above the dielectric layer; a piezoelectric layer disposed above the acoustic mirror stack; and one or more vias disposed between the bottom electrode layer and the conductive layer, the one or more vias electrically coupling the bottom electrode layer and the conductive layer.

Abstract: A seed layer (210) of a noble metal is formed by electrochemical deposition on a metal electrode (111) disposed on a dielectric layer (110,310). The noble metal seed layer allows the deposition of a highly textured piezoelectric layer (320) on the metal electrode.