Patents by Inventor Joan Mach

Joan Mach has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11964433
    Abstract: A build material conveyor is disclosed. Such conveyor comprising an auger to transport build material in a substantially vertical direction wherein the conveyor further comprises a set of wall elements selectively positioned to, in a first position occupy part of the volume of the auger.
    Type: Grant
    Filed: January 23, 2023
    Date of Patent: April 23, 2024
    Assignee: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
    Inventors: Stan Markwell, Andre Garcia, Bernardo A Gutierrez, Joan Mach Beneyto
  • Publication number: 20230158746
    Abstract: A build material conveyor is disclosed. Such conveyor comprising an auger to transport build material in a substantially vertical direction wherein the conveyor further comprises a set of wall elements selectively positioned to, in a first position occupy part of the volume of the auger.
    Type: Application
    Filed: January 23, 2023
    Publication date: May 25, 2023
    Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
    Inventors: Stan MARKWELL, Andre GARCIA, Bernardo A. GUTIERREZ, Joan MACH BENEYTO
  • Patent number: 11642847
    Abstract: In example implementations, an apparatus includes a build platform and a cap. The build platform has an opening on a top surface to fill a build material storage unit. The cap is inserted into the opening to seal the opening. A top surface of the cap and the top surface of the build platform have a uniform thermal conductivity when the cap is inserted into the opening.
    Type: Grant
    Filed: February 25, 2022
    Date of Patent: May 9, 2023
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Marius Valles, Pau Martin Vidal, Rafel Texido, Joan Mach
  • Patent number: 11559947
    Abstract: A build material conveyor is disclosed. Such conveyor comprising an auger to transport build material in a substantially vertical direction wherein the conveyor further comprises a set of wall elements selectively positioned to, in a first position occupy part of the volume of the auger.
    Type: Grant
    Filed: March 30, 2017
    Date of Patent: January 24, 2023
    Assignee: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
    Inventors: Stan Markwell, Andre Garcia, Bernardo A Gutierrez, Joan Mach Beneyto
  • Patent number: 11377302
    Abstract: In one example, an article for distributing powder includes a plate having holes therein through which a powder may pass from a first side of the plate to a second side of the plate opposite the first side and multiple ramps each intersecting the plate at one or multiple holes and sloping away from the first side of the plate in a first direction at an angle less than 90°.
    Type: Grant
    Filed: May 12, 2016
    Date of Patent: July 5, 2022
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Gerard Mosquera, Albert Iglesias Millan, Joan Mach
  • Publication number: 20220176629
    Abstract: In example implementations, an apparatus includes a build platform and a cap. The build platform has an opening on a top surface to fill a build material storage unit. The cap is inserted into the opening to seal the opening. A top surface of the cap and the top surface of the build platform have a uniform thermal conductivity when the cap is inserted into the opening.
    Type: Application
    Filed: February 25, 2022
    Publication date: June 9, 2022
    Inventors: Marius Valles, Pau Martin Vidal, Rafel Texido, Joan Mach
  • Patent number: 11285668
    Abstract: In example implementations, an apparatus includes a build platform and a cap. The build platform has an opening on a top surface to fill a build material storage unit. The cap is inserted into the opening to seal the opening. A top surface of the cap and the top surface of the build platform have a uniform thermal conductivity when the cap is inserted into the opening.
    Type: Grant
    Filed: May 12, 2016
    Date of Patent: March 29, 2022
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Marius Valles, Pau Martin Vidal, Rafel Texido, Joan Mach
  • Publication number: 20210362414
    Abstract: In one example, a rotatable delivery module is controlled to rotate in a first direction to a supply position to enable material to be supplied to an additive manufacturing platform. During such rotation to the supply position the rotatable delivery module contacts and collects respective portions of said material contained by the material supply module. An amount of material within the material supply module is determined based on a resistive force exerted on the rotatable delivery module as the rotatable delivery module collects said respective portions of material.
    Type: Application
    Filed: August 7, 2018
    Publication date: November 25, 2021
    Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
    Inventors: Luis Vega Lastra, Pau Martin Vidal, Joan Mach Beneyto, Gerard Mosquera Donate
  • Publication number: 20210214167
    Abstract: In one example, an article for distributing powder includes a plate having holes therein through which a powder may pass from a first side of the plate to a second side of the plate opposite the first side and multiple ramps each intersecting the plate at one or multiple holes and sloping away from the first side of the plate in a first direction at an angle less than 90°.
    Type: Application
    Filed: May 12, 2016
    Publication date: July 15, 2021
    Inventors: Gerard Mosquera, Albert Iglesias Millan, Joan Mach
  • Publication number: 20210206084
    Abstract: A build material conveyor is disclosed. Such conveyor comprising an auger to transport build material in a substantially vertical direction wherein the conveyor further comprises a set of wall elements selectively positioned to, in a first position occupy part of the volume of the auger.
    Type: Application
    Filed: March 30, 2017
    Publication date: July 8, 2021
    Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
    Inventors: Stan MARKWELL, Andre GARCIA, Bernardo A GUTIERREZ, Joan MACH BENEYTO
  • Publication number: 20200290274
    Abstract: In example implementations, an apparatus includes a build platform and a cap. The build platform has an opening on a top surface to fill a build material storage unit. The cap is inserted into the opening to seal the opening. A top surface of the cap and the top surface of the build platform have a uniform thermal conductivity when the cap is inserted into the opening.
    Type: Application
    Filed: May 12, 2016
    Publication date: September 17, 2020
    Inventors: Marius Valles, Pau Martin Vidal, Rafel Texido, Joan Mach
  • Publication number: 20190126544
    Abstract: According to one example, there is provided an accessory for a three-dimensional (3D) printer. The accessory comprises an upper structure to connect to a 3D printer build unit, the build unit defining a build chamber and having a movable support platform, the upper structure defining a build chamber smaller than the build chamber of the build unit, the upper structure being connectable to the build unit such that the accessory build chamber becomes the usable build chamber of the build unit, and an accessory support platform movable within the accessory build chamber, the accessory support platform having a base portion extending below the accessory build chamber to connect to the build unit support platform, such that movement of the build unit support platform causes corresponding movement of the accessory support platform.
    Type: Application
    Filed: November 29, 2016
    Publication date: May 2, 2019
    Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
    Inventors: Pau MARTIN VIDAL, Lluis HIERRO DOMENECH, Gerard MOSQUERA, Marius VALLES, Joan MACH BENEYTO