Abstract: A mechanical strain reduction system include a flexible circuit section of a printed circuit board configured with a meandering shape while in a static state, and a compressible material having a cavity such that the meandering flexible circuit section is positioned within the cavity while the flexible circuit section is in the static state. The flexible circuit section can be part of a rigid-flexible printed circuit board or a flexible printed circuit board. The cavity can be shaped with the same meandering shape as the flexible circuit section in the static state. In general, the cavity is sufficiently shaped to allow positioning of the meandering flexible circuit section within the cavity. Support structures of the same, or different, compressible material can be interspersed within the meander of the flexible circuit section.

Abstract: The luggage lighting system includes a piece of luggage and a lighting module coupled to the luggage. In some embodiments, the lighting module is a fiber-optic lighting module. The luggage includes an outer surface, and the lighting module includes a light diffuser coupled to the outer surface. In some embodiments, the light diffuser is a fiber-optic light diffuser. The lighting module also includes a light source, such as a laser or a light emitting diode (LED). When the light source is powered on, the output light is directed through the light diffuser. The light diffuser is configured to output single or multiple colors of light, easily observed by someone looking at the luggage. The luggage lighting system is particularly useful for identifying one's luggage from surrounding pieces of luggage lacking the luggage lighting system.

Abstract: Solder bump structures, which comprise a solder bump on a UBM structure, are provided for operation at temperatures of 250° C. and above. According to a first embodiment, the UBM structure comprises layers of Ni—P, Pd—P, and gold, wherein the Ni—P and Pd—P layers act as barrier and/or solderable/bondable layers. The gold layer acts as a protective layer. According to second embodiment, the UBM structure comprises layers of Ni—P and gold, wherein the Ni—P layer acts as a diffusion barrier as well as a solderable/bondable layer, and the gold acts as a protective layer. According to a third embodiment, the UBM structure comprises: (i) a thin layer of metal, such as titanium or aluminum or Ti/W alloy; (ii) a metal, such as NiV, W, Ti, Pt, TiW alloy or Ti/W/N alloy; and (iii) a metal alloy such as Pd—P, Ni—P, NiV, or TiW, followed by a layer of gold. Alternatively, a gold, silver, or palladium bump may be used instead of a solder bump in the UBM structure.

Abstract: A capacitor design, which incorporates a material set that is adaptable to standard substrate or electronic packaging fabrication methods, uses copper as a base and electrode, mesoporous nanocomposite materials or other adhesion promoting materials combined with a high dielectric material specific to the application's capacitance requirements. This capacitor is then used as a basis for forming a capacitor in substrate or package or wafer level package or die or wafer.