Abstract: A method for shielding one or more circuits (21, 21?) of a printed circuit board includes depositing a layer of dielectric material (43) over a printed circuit board substrate (22) and the printed circuits (21, 21?), creating a trench-like opening (44) in the dielectric layer (43) such that the trench-like opening (44) surrounds the one or more circuits (21, 21?) to be shielded, depositing a layer of metal (27) over the layer of dielectric material (43) and within the trench-like openings (44), creating a solder pad (24) at each location where an electrical connection is to be made to the printed circuits (21, 21?) by removing a border of the metal layer (27) surrounding each connection location, and providing a microvia (25) through each solder pad (24) penetrating the dielectric layer (43) and terminating at the metal of the printed circuit (21, 21?).

Abstract: A method for shielding one or more circuits (21, 21?) of a printed circuit board includes depositing a layer of dielectric material (43) over a printed circuit board substrate (22) and the printed circuits (21, 21?), creating a trench-like opening (44) in the dielectric layer (43) such that the trench-like opening (44) surrounds the one or more circuits (21, 21?) to be shielded, depositing a layer of metal (27) over the layer of dielectric material (43) and within the trench-like openings (44), creating a solder pad (24) at each location where an electrical connection is to be made to the printed circuits (21, 21?) by removing a border of the metal layer (27) surrounding each connection location, and providing a microvia (25) through each solder pad (24) penetrating the dielectric layer (43) and terminating at the metal of the printed circuit (21, 21?).

Abstract: Methods for forming a metal shield on a printed circuit board (10) include depositing a first layer of metal (41) on a substrate (22) of the printed circuit board (10), depositing a first layer of dielectric material (42) on the first layer of metal (41), printing one or more circuits (21, 21?) on the first dielectric layer (42), depositing a second layer of dielectric material (43) over the one or more printed circuits (21, 21?), forming a trench-like opening (44) in the two layers of dielectric material (42, 43) surrounding the one or more printed circuits (21, 21?) so that the metal of the first layer (41) is exposed by the trench-like opening (44), depositing a second layer of metal (27) on the second layer of dielectric material (43) such that the second layer of metal (27) plates the trench-like opening (44) and makes electrical contact with the first metal layer (41).

Abstract: A method of forming a coaxial transmission line on a high density PCB. A metal layer (102) on the PCB (104) forms the bottom part of the shield, and is covered by a first dielectric (112). Two parallel trenches (122) are formed in the first dielectric to reveal part (123) of the metal strip. The signal conductor (132) is then formed on the first dielectric. A second dielectric (142) covers the signal conductor and the first dielectric. A second set of two parallel trenches (172) are formed in the second dielectric immediately above the first two trenches. Metal deposit (182) is plated in the parallel trenches to contact the metal strip, and also covers a portion of the second dielectric that lies between the trenches, to create a shield. The resulting coaxial transmission line has a center conductor insulated from the shield by the dielectrics.

Abstract: Methods and apparatus for forming a metal shield on a printed circuit board (10) include a layer of dielectric material (23) one or more printed circuits (21) on the layer of dielectric material (23), a layer of metal (27) on the layer of dielectric material (23), a metal-clad trench or opening surrounding the printed circuit (44) and electrically connected to the layer of metal(27), a solder pad (24) on the layer of dielectric material (23), a microvia (25) through the solder pad (24) and the layer of dielectric material (23), and electrical components (11) soldered to the solder pads (24) and to the printed circuit (21).

Abstract: Methods and apparatus for forming a metal shield on a printed circuit board (10) include a layer of dielectric material (23) one or more printed circuits (21) on the layer of dielectric material (23), a layer of metal (27) on the layer of dielectric material (23), a metal-clad trench or opening surrounding the printed circuit (44) and electrically connected to the layer of metal(27), a solder pad (24) on the layer of dielectric material (23), a microvia (25) through the solder pad (24) and the layer of dielectric material (23), and electrical components (11) soldered to the solder pads (24) and to the printed circuit (21).

Abstract: An electrostatic discharge protection device for a high-density printed circuit board consists of a layered structure starting at the bottom layer with a ground conductor. A dielectric layer covers the ground conductor to electrically isolate it from a circuit trace that is on top of the dielectric layer. A via is formed in the dielectric layer such that a portion of the ground conductor is exposed, and the via is strategically located such that the edge of the via is tangent to an edge portion of the circuit trace. The via forms a spark gap between the edge portion of the circuit trace and the underlying ground conductor, using air as the dielectric medium.

Abstract: Methods and apparatus for forming a metal shield on a printed circuit board (10) include a layer of dielectric material (23) one or more printed circuits (21) on the layer of dielectric material (23), a layer of metal (27) on the layer of dielectric material (23), a metal-clad trench or opening surrounding the printed circuit (44) and electrically connected to the layer of metal (27), a solder pad (24) on the layer of dielectric material (23), a microvia (25) through the solder pad (24) and the layer of dielectric material (23), and electrical components (11) soldered to the solder pads (24) and to the printed circuit (21).

Abstract: A high density multi-layer printed circuit board (100) is formed by building additional dielectric and metallization layers over a central core (110) of conventional PCB laminate construction. The central core has a metallization pattern (113, 114) on at least one surface. A photoimaged dielectric layer (130) is deposited on one side of the central core and overlies the metallization pattern. Vias (136) are formed in this dielectric layer by a photoimaging process, and an additional metallization pattern (133) on this layer is electrically connected to the underlying metallization pattern through these vias. A non-photoimageable dielectric layer (120) is deposited on the other side of the central core. Vias (126) are formed in this dielectric layer by a laser drilling process, and an additional metallization pattern (123) on this layer is electrically connected to an underlying metallization pattern through these laser drilled vias.

Abstract: A method of forming a coaxial transmission line on a high density PCB. A metal strip (102) on the PCB (104) forms the bottom part of the shield, and is covered by a first dielectric (112). Two parallel trenches (122) are formed in the first dielectric to reveal part (123) of the metal strip. The signal conductor (132) is then formed on the first dielectric. A second dielectric (142) covers the signal conductor and the first dielectric. A second set of two parallel trenches (172) are formed in the second dielectric immediately above the first two trenches. Metal (182) is plated in the parallel trenches to contact the metal strip, and also covers a portion of the second dielectric that lies between the trenches, to create a shield. The resulting coaxial transmission line has a center conductor insulated from the shield by the dielectrics.

Abstract: A method of forming a high resolution metal pattern on a substrate. A temporary polyvinyl alcohol (10) layer underneath the photoresist layer (20) aids in removing the photoresist layer after plating. The photoresist is photodelineated in conventional manner to form a pattern (40). During photodelineation, the developing process for the resist does not completely remove the PVA (45) that lies directly under the removed resist, but instead reveals those portions of the polyvinyl alcohol layer. The substrate is then rinsed in a hot aqueous solution to effect removal of the revealed PVA portions, now exposing portions (40) of the substrate (15). Metal (50) is then electroplated to build up a metal circuitry pattern. The remaining portions of the photoresist and the PVA are then removed by a hot aqueous solution.

Abstract: A color filter for a liquid crystal display is made by depositing a layer (22) of colored dye in a pattern on a transparent substrate (20). The pattern is in pixel format, covering most of the substrate surface and leaving portions (23) of the surface between the pixels uncovered. A layer of silver halide (25) covers both the colored dye pixels and the exposed portions of the substrate surface. The silver halide layer is treated by exposing it to light so that those portions of the silver halide layer that lie directly over the colored dye pattern become transparent and those portions of the silver halide layer that lie between the pixels become black, blocking any transmitted light.

Abstract: A touch sensitive liquid crystal display device (70) having first, second, and third substrates, (40), (76) and (90) and a plurality of raised ribs members (46), (48), (50), (42) and (44) to maintain appropriate spacing between said substrates. Electrically conductive material is disposed on one or more surfaces of the substrates in order to effect a change in the optical characteristics of a liquid crystal material (100) disposed between said second and third substrates.

Abstract: A method of manufacturing high aspect ratio plated through holes in a circuit carrying substrate. High aspect ratio apertures or holes (16) are formed in a substrate (10). A thin film of copper (20) is sputtered onto the substrate and in the apertures that a macroscopically discontinuous copper film (26) is formed on part of the aperture walls. The macroscopically discontinuous copper film is substantially thinner than the copper film that is deposited on the surface. A catalytic copper coating (30) is plated directly on the vacuum deposited thin film of copper by electroless copper plating in a manner sufficient to form a macroscopically continuous copper layer on the aperture walls.

Abstract: An electronic package, comprising a circuit carrying substrate (30) and a semiconductor device (35). The substrate (30) has two opposing surfaces, the first or bottom surface having a plurality of solder pads (31) and the second or top surface having a circuitry pattern defined on it. A semiconductor device (35) is attached to the top surface of the circuit carrying substrate (30). A molded body (33) is formed completely around the semiconductor device (35) in order to encapsulate it, the molded body also substantially covering the top surface of the circuit carrying substrate (30). A layer of metal deposited directly on the molded body and the top surface of the circuit carrying substrate is delineated into another conductive circuitry pattern (38), with part of the pattern (36) connected to the circuitry pattern on the circuit carrying substrate. An electronic component (32) is mounted on the molded body (33) and electrically connected to the conductive circuitry pattern (38).