Abstract: The invention relates to a method for producing drill holes (12, 13a, 13b) in a sandwich component (6). The sandwich component has several interconnected layers of which at least one layer (9) is electrically conducting and the directly adjacent layers (10) are not electrically conducting. Further, the invention relates to a drilling machine (1) having at least one drill (5), a measuring device that is connected to the drill (5) that measures a difference in potential between a component (6) and a reference potential, a depth measuring device that can measure the position of the drill (5) relative to a reference point, and a computer unit that is equipped to execute the method automatically.

Abstract: The invention relates to a device and to a method for machining, in particular, drilling printed circuit boards (PCB) having several conductive layers (Ln). The device has a drilling spindle (2) bearing an interchangeable drilling tool (1). The drilling tool (1) has a lateral surface that has a non-conducting layer (9) at least in sections, and a core (8) that is conductive at least in sections.