Patents by Inventor Jochem Sebastiaan Wildenberg
Jochem Sebastiaan Wildenberg has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
-
Publication number: 20190317412Abstract: A method for improving the yield of a lithographic process, the method including: determining a parameter fingerprint of a performance parameter across a substrate, the parameter fingerprint including information relating to uncertainty in the performance parameter; determining a process window fingerprint of the performance parameter across the substrate, the process window being associated with an allowable range of the performance parameter; and determining a probability metric associated with the probability of the performance parameter being outside an allowable range. Optionally a correction to the lithographic process is determined based on the probability metric.Type: ApplicationFiled: October 16, 2017Publication date: October 17, 2019Applicant: ASML NETHERLANDS B.V.Inventors: Everhardus Cornelis MOS, Jochem Sebastiaan WILDENBERG, Erik Johannes Maria WALLERBOS, Maurits VAN DER SCHAAR, Frank STAALS, Franciscus Hendricus Arnoldus ELICH
-
Publication number: 20190311921Abstract: A substrate processing apparatus includes a substrate loading device configured to load a substrate in a predetermined orientation relative to a grid, having a X-axis and an orthogonal Y-axis, associated with a layout of fields on the substrate; and corrective elements configured to enable local correction of a characteristic of a process performed on a substrate, wherein the corrective elements are arranged along at least one axis having a direction other than parallel to the X-axis or the Y-axis of the grid.Type: ApplicationFiled: September 21, 2017Publication date: October 10, 2019Applicant: ASML NETHERLANDS B.V.Inventors: Everhardus Cornelis MOS, Jochem Sebastiaan WILDENBERG
-
Publication number: 20190285992Abstract: A method to change an etch parameter of a substrate etching process, the method including: making a first measurement of a first metric associated with a structure on a substrate before being etched; making a second measurement of a second metric associated with a structure on a substrate after being etched; and changing the etch parameter based on a difference between the first measurement and the second measurement.Type: ApplicationFiled: November 6, 2017Publication date: September 19, 2019Applicant: ASML NETHERLANDS B.V.Inventors: Richard Johannes Franciscus VAN HAREN, Victor Emanuel CALADO, Leon Paul VAN DIJK, Roy WERKMAN, Everhardus Cornelis MOS, Jochem Sebastiaan WILDENBERG, Marinus JOCHEMSEN, Bijoy RAJASEKHARAN, Erik JENSEN, Adam Jan URBANCZYK
-
Publication number: 20190278188Abstract: In a lithographic process, product units such as semiconductor wafers are subjected to lithographic patterning operations and chemical and physical processing operations. Alignment data or other measurements are made at stages during the performance of the process to obtain object data representing positional deviation or other parameters measured at points spatially distributed across each unit. This object data is used to obtain diagnostic information by performing a multivariate analysis to decompose a set of vectors representing the units in the multidimensional space into one or more component vectors. Diagnostic information about the industrial process is extracted using the component vectors. The performance of the industrial process for subsequent product units can be controlled based on the extracted diagnostic information.Type: ApplicationFiled: March 13, 2019Publication date: September 12, 2019Applicant: ASML Netherlands B.V.Inventors: Alexander YPMA, Jasper MENGER, David DECKERS, David HAN, Adrianus Cornelis Matheus KOOPMAN, Irina LYULINA, Scott Anderson MIDDLEBROOKS, Richard Johannes Franciscus VAN HAREN, Jochem Sebastiaan WILDENBERG
-
Publication number: 20190243252Abstract: A method for selecting an optimal set of locations for a measurement or feature on a substrate, the method includes: defining a first candidate solution of locations, defining a second candidate solution with locations based on modification of a coordinate in a solution domain of the first candidate solution, and selecting the first and/or second candidate solution as the optimal solution according to a constraint associated with the substrate.Type: ApplicationFiled: September 21, 2017Publication date: August 8, 2019Applicant: ASML NETHERLANDS B.V.Inventors: Pierluigi FRISCO, Svetla Petrova MATOVA, Jochem Sebastiaan WILDENBERG
-
Patent number: 10274834Abstract: In a lithographic process, product units such as semiconductor wafers are subjected to lithographic patterning operations and chemical and physical processing operations. Alignment data or other measurements are made at stages during the performance of the process to obtain object data representing positional deviation or other parameters measured at points spatially distributed across each unit. This object data is used to obtain diagnostic information by performing a multivariate analysis to decompose a set of vectors representing the units in said multidimensional space into one or more component vectors. Diagnostic information about the industrial process is extracted using the component vectors. The performance of the industrial process for subsequent product units can be controlled based on the extracted diagnostic information.Type: GrantFiled: March 8, 2018Date of Patent: April 30, 2019Assignee: ASML Netherlands B.V.Inventors: Alexander Ypma, Jasper Menger, David Deckers, David Han, Adrianus Cornelis Matheus Koopman, Irina Lyulina, Scott Anderson Middlebrooks, Richard Johannes Franciscus Van Haren, Jochem Sebastiaan Wildenberg
-
Publication number: 20190011842Abstract: A method of characterizing distortions in a lithographic process, and associated apparatuses. The method includes obtaining measurement data corresponding to a plurality of measurement locations on a substrate, the measurement data comprising measurements performed on a plurality of substrates, and comprising one or more measurements performed on one or more of the substrates for each of the measurement locations. For each of the measurement locations, a first quality value representing a quality metric and a noise value representing a noise metric is determined from the measurements performed at that measurement location. A plurality of distortion parameters is determined, each distortion parameter configured to characterize a systematic distortion in the quality metric and a statistical significance of the distortion parameters from the first quality value and from the noise value is determined. Systematic distortion is parameterized from the distortion parameters determined to be statistically significant.Type: ApplicationFiled: February 22, 2017Publication date: January 10, 2019Applicant: ASML NETHERLANDS B.V.Inventors: Everhardus Cornelis MOS, Jochem Sebastiaan WILDENBERG, Roy WERKMAN, Erik Johannes Maria WALLERBOS
-
Publication number: 20180307145Abstract: A method of monitoring a device manufacturing process, the method including; obtaining an estimated time variation of a process parameter; determining, on the basis of the estimated time variation, a sampling plan for measurements to be performed on a plurality of substrates to obtain information about the process parameter; measuring substrates in accordance with the sampling plan to obtain a plurality of measurements; and determining an actual time variation of the process parameter on the basis of the measurements.Type: ApplicationFiled: April 12, 2018Publication date: October 25, 2018Applicant: ASML NETHERLANDS B.V.Inventors: Everhardus Cornelis MOS, Jochem Sebastiaan Wildenberg, Marcel Hendrikus Maria Beems, Erik Johannes Maria Wallerbos
-
Publication number: 20180253015Abstract: In a lithographic process, product units such as semiconductor wafers are subjected to lithographic patterning operations and chemical and physical processing operations. Alignment data or other measurements are made at stages during the performance of the process to obtain object data representing positional deviation or other parameters measured at points spatially distributed across each unit. This object data is used to obtain diagnostic information by performing a multivariate analysis to decompose a set of vectors representing the units in said multidimensional space into one or more component vectors. Diagnostic information about the industrial process is extracted using the component vectors. The performance of the industrial process for subsequent product units can be controlled based on the extracted diagnostic information.Type: ApplicationFiled: March 8, 2018Publication date: September 6, 2018Applicant: ASML Netherlands B.V.Inventors: Alexander Ypma, Jasper Menger, David Deckers, David Han, Adrianus Cornelis Matheus Koopman, Irina Lyulina, Scott Anderson Middlebrooks, Richard Johannes Franciscus Van Haren, Jochem Sebastiaan Wildenberg
-
Patent number: 9946165Abstract: In a lithographic process, product units such as semiconductor wafers are subjected to lithographic patterning operations and chemical and physical processing operations. Alignment data or other measurements are made at stages during the performance of the process to obtain object data representing positional deviation or other parameters measured at points spatially distributed across each unit. This object data is used to obtain diagnostic information by performing a multivariate analysis to decompose a set of vectors representing the units in said multidimensional space into one or more component vectors. Diagnostic information about the industrial process is extracted using the component vectors. The performance of the industrial process for subsequent product units can be controlled based on the extracted diagnostic information.Type: GrantFiled: September 5, 2014Date of Patent: April 17, 2018Assignee: ASML NETHERLANDS B.V.Inventors: Alexander Ypma, Jasper Menger, David Deckers, David Han, Adrianus Cornelis Matheus Koopman, Irina Lyulina, Scott Anderson Middlebrooks, Richard Johannes Franciscus Van Haren, Jochem Sebastiaan Wildenberg
-
Publication number: 20180067900Abstract: A method including evaluating, with respect to a parameter representing remaining uncertainty of a mathematical model fitting measured data, one or more mathematical models for fitting measured data and one or more measurement sampling schemes for measuring data, against measurement data across a substrate, and identifying one or more mathematical models and/or one or more measurement sampling schemes, for which the parameter crosses a threshold.Type: ApplicationFiled: March 25, 2016Publication date: March 8, 2018Applicant: ASML Netherlands B.V.Inventors: Everhardus Cornelis MOS, Velislava IGNATOVA, Erik JENSEN, Michael KUBIS, Hubertus Johannes Gertrudus SIMONS, Peter TEN BERGE, Erik Johannes Maria WALLERBOS, Jochem Sebastiaan WILDENBERG
-
Publication number: 20180011398Abstract: A method includes determining topographic information of a substrate for use in a lithographic imaging system, determining or estimating, based on the topographic information, imaging error information for a plurality of points in an image field of the lithographic imaging system, adapting a design for a patterning device based on the imaging error information. In an embodiment, a plurality of locations for metrology targets is optimized based on imaging error information for a plurality of points in an image field of a lithographic imaging system, wherein the optimizing involves minimizing a cost function that describes the imaging error information. In an embodiment, locations are weighted based on differences in imaging requirements across the image field.Type: ApplicationFiled: January 20, 2016Publication date: January 11, 2018Applicant: ASML Netherlands B.V.Inventors: Wim Tjibbo TEL, Marinus JOCHEMSEN, Frank STAALS, Christopher PRENTICE, Laurent Michel Marcel DEPRE, Johannes Marcus Maria BELTMAN, Roy WERKMAN, Jochem Sebastiaan WILDENBERG, Everhardus Cornelis MOS
-
Patent number: 9811006Abstract: A method of determining a measurement subset of metrology point locations which includes a subset of potential metrology point locations on a substrate. The method including identifying a plurality of candidate metrology point locations from the potential metrology point locations. A change in the level of informativity imparted by the measurement subset of metrology point locations which is attributable to the inclusion of that candidate metrology point location into the measurement subset of metrology point locations is evaluated for each of the candidate metrology point locations. The candidate metrology point locations which have the greatest increase in the level of informativity attributed thereto are selected for inclusion into the measurement subset of metrology point locations.Type: GrantFiled: November 4, 2014Date of Patent: November 7, 2017Assignee: ASML NETHERLANDS B.V.Inventors: Jochem Sebastiaan Wildenberg, Everhardus Cornelis Mos
-
Publication number: 20160334717Abstract: A method of determining a measurement subset of metrology point locations which includes a subset of potential metrology point locations on a substrate. The method including identifying a plurality of candidate metrology point locations from the potential metrology point locations. A change in the level of informativity imparted by the measurement subset of metrology point locations which is attributable to the inclusion of that candidate metrology point location into the measurement subset of metrology point locations is evaluated for each of the candidate metrology point locations. The candidate metrology point locations which have the greatest increase in the level of informativity attributed thereto are selected for inclusion into the measurement subset of metrology point locations.Type: ApplicationFiled: November 4, 2014Publication date: November 17, 2016Applicant: ASML Netherlands B.V.Inventors: Jochem Sebastiaan WILDENBERG, Everhardus Cornelis MOS
-
Publication number: 20160246185Abstract: In a lithographic process, product units such as semiconductor wafers are subjected to lithographic patterning operations and chemical and physical processing operations. Alignment data or other measurements are made at stages during the performance of the process to obtain object data representing positional deviation or other parameters measured at points spatially distributed across each unit. This object data is used to obtain diagnostic information by performing a multivariate analysis to decompose a set of vectors representing the units in said multidimensional space into one or more component vectors. Diagnostic information about the industrial process is extracted using the component vectors. The performance of the industrial process for subsequent product units can be controlled based on the extracted diagnostic information.Type: ApplicationFiled: September 5, 2014Publication date: August 25, 2016Applicant: ASML Netherlands B.V.Inventors: Alexander Ypma, Jasper Menger, David Deckers, David Han, Adrianus Cornelis Matheus Koopman, Irina Lyulina, Scott Anderson Middlebrooks, Richard Johannes Franciscus Van Haren, Jochem Sebastiaan Wildenberg