Abstract: Recesses (46) are etched into the finished peripheral boundaries of a structure formed of a generally planar electronic circuit (40) on an upper surface (42) of a wafer (44). Bonding pads (48) are deposited in the recesses (46) and interconnected to the electronic circuit (40). External leads (52) are attached to the bonding pads (48), such that the external leads (52) lie below the plane of the electronic circuit (40).

Abstract: A method and apparatus for protecting metal bumped chips during processing and for providing mechanical support to interconnected chips. A protective adhesive stop is affixed to a metal bumped chip so that the height of the stop is at least as high as the metal bump. The stop protects the metal bump during routine handling. When the chip is interconnected to another bumped chip by cold welding their respective metal bumps, the stop contacts the face of the second chip and provides mechanical support. The stop is preferably a thermoplastic that is heated to adhere it to the second chip. The addition of the protective stop facilitates automated processing of metal bumped chips, and provides stronger, faster, and lower power chips.