Patents by Inventor Joe Baz

Joe Baz has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11814848
    Abstract: A mounting clip assembly for attaching a girt to a substrate, includes a bracket and isolator pad. The bracket includes a substrate fastening plate for mounting the bracket to a building substrate, and a girt fastening plate protruding orthogonally outward from a first face of the substrate fastening plate. The girt fastening plate has a top edge, and a bottom edge that extends at an upward angle from the substrate fastening plate, such that the vertical fastening plate is substantially trapezoidal. A girt may be fastened to the mounting clip assembly in a first fastening region. A cavity is formed in the girt fastening plate at a location between the substrate fastening plate and the fastening region to reduce thermal conductance between the fastening region and the substrate fastening plate. The cavity is reinforced by thickening material around a periphery of the cavity. The thermal isolator pad is mountable between a second face of the substrate fastening plate and the substrate.
    Type: Grant
    Filed: October 14, 2021
    Date of Patent: November 14, 2023
    Assignee: FLYNN CANADA LTD.
    Inventors: Don Delaney, Joe Baz
  • Publication number: 20230119188
    Abstract: A mounting clip assembly for attaching a girt to a substrate, includes a bracket and isolator pad. The bracket includes a substrate fastening plate for mounting the bracket to a building substrate, and a girt fastening plate protruding orthogonally outward from a first face of the substrate fastening plate. The girt fastening plate has a top edge, and a bottom edge that extends at an upward angle from the substrate fastening plate, such that the vertical fastening plate is substantially trapezoidal. A girt may be fastened to the mounting clip assembly in a first fastening region. A cavity is formed in the girt fastening plate ata location between the substrate fastening plate and the fastening region to reduce thermal conductance between the fastening region and the substrate fastening plate. The cavity is reinforced by thickening material around a periphery of the cavity. The thermal isolator pad is mountable between a second face of the substrate fastening plate and the substrate.
    Type: Application
    Filed: October 14, 2021
    Publication date: April 20, 2023
    Inventors: Don Delaney, Joe Baz