Patents by Inventor Joe P. Mousseau

Joe P. Mousseau has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Substrate assembly including a compartmental dam for use in the manufacturing of an enclosed electrical circuit using an encapsulant
    Patent number: 5907477
    Abstract: An enclosed electrical circuit and method for manufacturing the electrical circuit are provided. Initially a flexible substrate is formed with a plurality of electrical circuits. By way of example, each circuit can contain a conductive trace, a battery and a die, all in electrical communication. During the manufacturing process, a barrier is placed on the substrate and a curable encapsulant is poured into a cavity formed by the barrier and the substrate to encapsulate each circuit. The barrier can be formed as a compartmentalized dam having a separate cavity for each circuit, as a perimeter dam having a single cavity, or as a spacer sheet having a separate cavity for each circuit formed by a pattern of cut outs. Following the encapsulation step, the electrical circuits can be singulated into separate encapsulated circuits.
    Type: Grant
    Filed: March 11, 1997
    Date of Patent: May 25, 1999
    Assignee: Micron Communications, Inc.
    Inventors: Mark E. Tuttle, Rickie C. Lake, Joe P. Mousseau, Clay L. Cirino
  • Article and method of manufacturing an enclosed electrical circuit using an encapsulant
    Patent number: 5612513
    Abstract: An enclosed electrical circuit and method for manufacturing the electrical circuit are provided. Initially a flexible substrate is formed with a plurality of electrical circuits. By way of example, each circuit can contain a conductive trace, a battery and a die, all in electrical communication. During the manufacturing process, a barrier is placed on the substrate and a curable encapsulant is poured into a cavity formed by the barrier and the substrate to encapsulate each circuit. The barrier can be formed as a compartmentalized dam having a separate cavity for each circuit, as a perimeter dam having a single cavity, or as a spacer sheet having a separate cavity for each circuit formed by a pattern of cut outs. Following the encapsulation step, the electrical circuits can be singulated into separate encapsulated circuits.
    Type: Grant
    Filed: September 19, 1995
    Date of Patent: March 18, 1997
    Assignee: Micron Communications, Inc.
    Inventors: Mark E. Tuttle, Rickie C. Lake, Joe P. Mousseau, Clay L. Cirino