Abstract: A signal transition device such as a coplanar waveguide launch package is disclosed. The coplanar waveguide launch package has a first portion and a second portion. The first portion is adapted to receive electrical signals from a conductive wire. The received signals terminate proximal to a launch at a first surface of the first portion. The second portion, connected to the first portion, has a support surface at a substantially normal angle. The support surface of the second portion is adapted to support a coplanar waveguide. Because the coplanar waveguide launch package of the present invention does not require removing of bottom portions of the coplanar waveguide launch package, it does not require machining of the bottom-side, does not require removal of the bottom-side material, and does not require a bottom lid.

Abstract: A signal transition device such as a coplanar waveguide launch package is disclosed. The coplanar waveguide launch package has a first portion and a second portion. The first portion is adapted to receive electrical signals from a conductive wire. The received signals terminate proximal to a launch at a first surface of the first portion. The second portion, connected to the first portion, has a support surface at a substantially normal angle. The support surface of the second portion is adapted to support a coplanar waveguide. Because the coplanar waveguide launch package of the present invention does not require removing of bottom portions of the coplanar waveguide launch package, it does not require machining of the bottom-side, does not require removal of the bottom-side material, and does not require a bottom lid.

Abstract: A tuning screw with a slotted tip suited for microwave and millimeter wave applications. The slotted tip provides compression upon insertion into the conductive device and the spring character of the screw tip fingers press against the conductor walls ensuring good electrical connection.

Abstract: A low inductance interconnect suitable for microwave frequency interconnect applications. The invention provides a low inductance interconnect structure providing interconnection operable from DC to beyond 100 Ghz. The structure may be in the form of a resilient comb, and can be cut from thin sheet metal with a Wire Electric Discharge Machine (EDM). Other resilient forms include spring structures, resilient canes and conductive fuzz.

Abstract: An electronic circuit tester for measuring the response to electrical signals applied to an electronic circuit under test is provided with a socket for effecting connection between a packaged device or integrated circuit being tested to a device-under-test (DUT) board incorporated into a fixture board of the tester.

Abstract: An electronic circuit test system for measuring the response to electrical signals applied to an electronic circuit under test is provided with a docking system for facilitating mechanical and electrical connections. A docking cone is mounted to a fixture board of the electronic circuit test system. The docking cone enters a tunnel in a test head of the electronic circuit test system as the fixture board is moved toward the test head. The docking cone guides connectors mounted to the fixture board into connection with mating connectors mounted to a load board and a connector support disk comprising the test head. The docking system increases the repeatability and reliability of mechanical and electrical connections and reduces the risk of damage to electrical connectors of the electronic circuit test system.