Abstract: A light projector and method of aligning the light projector is provided. A light projector steers an outgoing beam of light onto an object, passing light returned from the object through a focusing lens onto an optical detector. The light projector may generate a light pattern or template by rapidly moving the outgoing beam of light along a path on a surface. To place the light pattern/template in a desired location, the light projector may be aligned with an electronic model.

Abstract: A multichip package may include at least a package substrate, a main die mounted on the package substrate, a transceiver die mounted on the package substrate, and an optical engine die mounted on the package substrate. The main die may communicate with the transceiver die via a first high-bandwidth interconnect bridge embedded in the package substrate. The transceiver die may communicate with the optical engine die via a second high-bandwidth interconnect bridge embedded in the package substrate. The transceiver die has physical-layer circuits that directly drive the optical engine. An optical cable can be connected directly to the optical engine of the multichip package.

Abstract: A multichip package may include at least a package substrate, a main die mounted on the package substrate, a transceiver die mounted on the package substrate, and an optical engine die mounted on the package substrate. The main die may communicate with the transceiver die via a first high-bandwidth interconnect bridge embedded in the package substrate. The transceiver die may communicate with the optical engine die via a second high-bandwidth interconnect bridge embedded in the package substrate. The transceiver die has physical-layer circuits that directly drive the optical engine. An optical cable can be connected directly to the optical engine of the multichip package.

Abstract: The present disclosure relates to modular transceiver-based network circuitries that may include internal configurable interfaces or gaskets. The configurable gaskets may facilitate integration of the network circuitries in electronic devices by providing a transparent interface to processing circuitries coupled to the network circuitries. Moreover, the configurable gaskets may also have a floorplan layout (e.g., a chiplet layout) that may facilitate coupling of multiple network circuitries to a single processing circuitry, in a modular manner.

Abstract: Systems and methods are provided to improve flexibility of optical signal transmission between integrated circuit devices, and more specifically data utilization circuits. More specifically, the integrated circuit devices may include a data utilization circuit communicatively coupled to a field programmable optical array (FPOA). In some embodiments, the FPOA may convert an electrical signal received from the data utilization to an optical signal, route the optical signal to an optical channel, and multiplex the optical signal with other optical signals routed to the optical channel. Additionally or alternatively, the FPOA may de-multiplex a multiplexed optical signal based on wavelength, route an optical signal included in the multiplexed optical signal to an electrical channel, convert the optical signal into an electrical signal, and output the electrical signal to the data utilization circuit via an electrical channel.

Abstract: A multichip package may include at least a package substrate, a main die mounted on the package substrate, a transceiver die mounted on the package substrate, and an optical engine die mounted on the package substrate. The main die may communicate with the transceiver die via a first high-bandwidth interconnect bridge embedded in the package substrate. The transceiver die may communicate with the optical engine die via a second high-bandwidth interconnect bridge embedded in the package substrate. The transceiver die has physical-layer circuits that directly drive the optical engine. An optical cable can be connected directly to the optical engine of the multichip package.

Abstract: The present disclosure relates to modular transceiver-based network circuitries that may include internal configurable interfaces or gaskets. The configurable gaskets may facilitate integration of the network circuitries in electronic devices by providing a transparent interface to processing circuitries coupled to the network circuitries. Moreover, the configurable gaskets may also have a floorplan layout (e.g., a chiplet layout) that may facilitate coupling of multiple network circuitries to a single processing circuitry, in a modular manner.

Abstract: Systems and methods are provided to improve flexibility of optical signal transmission between integrated circuit devices, and more specifically data utilization circuits. More specifically, the integrated circuit devices may include a data utilization circuit communicatively coupled to a field programmable optical array (FPOA). In some embodiments, the FPOA may convert an electrical signal received from the data utilization to an optical signal, route the optical signal to an optical channel, and multiplex the optical signal with other optical signals routed to the optical channel. Additionally or alternatively, the FPOA may de-multiplex a multiplexed optical signal based on wavelength, route an optical signal included in the multiplexed optical signal to an electrical channel, convert the optical signal into an electrical signal, and output the electrical signal to the data utilization circuit via an electrical channel.

Abstract: A method for removing tritium from liquid lithium includes mixing the liquid lithium containing trace amounts of tritium with a molten salt and forming a salt of lithium and tritium. The method also includes separating the liquid lithium from the salt of lithium and tritium and circulating the molten salt in an electrolyzer to form molecular tritium. The method further includes bubbling an inert gas through the electrolyzer to remove the molecular tritium and circulating the argon and removed molecular tritium in a titanium getter to recover the tritium.

Abstract: An internal combustion engine. The engine includes at least one cylinder having a bore diameter, a piston for traveling within each cylinder between a first position and a second position, wherein the distance between the first position and the second position defines a stroke length, and thermal barriers on the surfaces of the combustion chamber near top dead center. In one embodiment, the engine utilizes asymmetric effective compression and expansion strokes. To maximize efficiency of the engine, a ratio of the bore diameter to stroke length of the internal combustion engine comprises a range between 0.5 to 1.0.