Patents by Inventor Joel Patrick Baldwin
Joel Patrick Baldwin has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 10216237Abstract: The present disclosure describes one or more systems, methods, routines and/or techniques for thermal management. One or more systems, methods, routines and/or techniques may provide advice or guidance (e.g., to a repair technician) regarding how to perform a hot bond repair, for example, on an aircraft component that has been damaged. The thermal management advisor may provide advice or guidance regarding how to prepare a repair field prior to running a thermal survey. For example, thermal management advisor may recommend a particular heat blanket, a configuration of the heat blanket, placement of various temperature sensors and other preparation guidance. The thermal management advisor may provide advice or guidance regarding how to alter or manage the repair setup during a thermal survey and during the actual curing process. For example, thermal management advisor may recommend particular temperature sensors or areas of the repair field that should be insulated.Type: GrantFiled: October 2, 2017Date of Patent: February 26, 2019Assignee: The Boeing CompanyInventors: Michael W. Evens, Joseph Lawrence Hafenrichter, Joel Patrick Baldwin, Ronald G. Turner, Megan N. Watson
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Patent number: 10173371Abstract: A method and apparatus for forming a bonded joint on a composite structure is presented. An apparatus carrying a first workpiece is positioned relative to a second workpiece. A vacuum is applied to the first workpiece and a portion of the second workpiece. A bladder on a first surface of a housing of the apparatus is deflated. Deflating the bladder positions the first workpiece such that adhesive having a desired thickness is positioned between the first workpiece and the second workpiece. The adhesive positioned between the first workpiece and the second workpiece is cured.Type: GrantFiled: August 29, 2016Date of Patent: January 8, 2019Assignee: The Boeing CompanyInventors: Michael Walter Evens, John F. Spalding, Megan Nicole Watson, Allan Joshua Slocum, Joel Patrick Baldwin
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Publication number: 20180024601Abstract: The present disclosure describes one or more systems, methods, routines and/or techniques for thermal management. One or more systems, methods, routines and/or techniques may provide advice or guidance (e.g., to a repair technician) regarding how to perform a hot bond repair, for example, on an aircraft component that has been damaged. The thermal management advisor may provide advice or guidance regarding how to prepare a repair field prior to running a thermal survey. For example, thermal management advisor may recommend a particular heat blanket, a configuration of the heat blanket, placement of various temperature sensors and other preparation guidance. The thermal management advisor may provide advice or guidance regarding how to alter or manage the repair setup during a thermal survey and during the actual curing process. For example, thermal management advisor may recommend particular temperature sensors or areas of the repair field that should be insulated.Type: ApplicationFiled: October 2, 2017Publication date: January 25, 2018Inventors: Michael W. Evens, Joseph Lawrence Hafenrichter, Joel Patrick Baldwin, Ronald G. Turner, Megan N. Watson
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Patent number: 9817452Abstract: The present disclosure describes one or more systems, methods, routines and/or techniques for thermal management. One or more systems, methods, routines and/or techniques may provide advice or guidance (e.g., to a repair technician) regarding how to perform a hot bond repair, for example, on an aircraft component that has been damaged. The thermal management advisor may provide advice or guidance regarding how to prepare a repair field prior to running a thermal survey. For example, thermal management advisor may recommend a particular heat blanket, a configuration of the heat blanket, placement of various temperature sensors and other preparation guidance. The thermal management advisor may provide advice or guidance regarding how to alter or manage the repair setup during a thermal survey and during the actual curing process. For example, thermal management advisor may recommend particular temperature sensors or areas of the repair field that should be insulated.Type: GrantFiled: January 11, 2013Date of Patent: November 14, 2017Assignee: The Boeing CompanyInventors: Michael W. Evens, Joseph Lawrence Hafenrichter, Joel Patrick Baldwin, Ronald G. Turner, Megan N. Watson
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Patent number: 9427911Abstract: A method and apparatus for forming a bonded joint on a composite structure is presented. An apparatus carrying a first workpiece is positioned relative to a second workpiece. A vacuum is applied to the first workpiece and a portion of the second workpiece. A bladder on a first surface of a housing of the apparatus is deflated. Deflating the bladder positions the first workpiece such that adhesive having a desired thickness is positioned between the first workpiece and the second workpiece. The adhesive positioned between the first workpiece and the second workpiece is cured.Type: GrantFiled: September 30, 2013Date of Patent: August 30, 2016Assignee: THE BOEING COMPANYInventors: Michael Walter Evens, John F. Spalding, Jr., Megan Nicole Watson, Allan Joshua Slocum, Joel Patrick Baldwin
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Patent number: 9372148Abstract: A bond surface testing apparatus and method are presented. The bond surface testing apparatus comprises a solution chamber; a plurality of solution containers located in the solution chamber; a plurality of microfluidic pipettes; and an information capture module. Each solution container in the plurality of solution containers includes a microfluidic pipette in the plurality of microfluidic pipettes. A number of the plurality of microfluidic pipettes has a non-circular cross-section. The information capture module is physically associated with the solution chamber and is configured to capture information relating to bonding surface properties of the bonding surface.Type: GrantFiled: October 30, 2013Date of Patent: June 21, 2016Assignee: THE BOEING COMPANYInventors: Eugene A. Dan-Jumbo, Joel Patrick Baldwin
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Publication number: 20140200731Abstract: The present disclosure describes one or more systems, methods, routines and/or techniques for thermal management. One or more systems, methods, routines and/or techniques may provide advice or guidance (e.g., to a repair technician) regarding how to perform a hot bond repair, for example, on an aircraft component that has been damaged. The thermal management advisor may provide advice or guidance regarding how to prepare a repair field prior to running a thermal survey. For example, thermal management advisor may recommend a particular heat blanket, a configuration of the heat blanket, placement of various temperature sensors and other preparation guidance. The thermal management advisor may provide advice or guidance regarding how to alter or manage the repair setup during a thermal survey and during the actual curing process. For example, thermal management advisor may recommend particular temperature sensors or areas of the repair field that should be insulated.Type: ApplicationFiled: January 11, 2013Publication date: July 17, 2014Inventors: Michael W. Evens, Joseph Lawrence Hafenrichter, Joel Patrick Baldwin, Ronald G. Turner, Megan N. Watson
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Publication number: 20140053643Abstract: A bond surface testing apparatus and method are presented. The bond surface testing apparatus comprises a solution chamber; a plurality of solution containers located in the solution chamber; a plurality of microfluidic pipettes; and an information capture module. Each solution container in the plurality of solution containers includes a microfluidic pipette in the plurality of microfluidic pipettes. A number of the plurality of microfluidic pipettes has a non-circular cross-section. The information capture module is physically associated with the solution chamber and is configured to capture information relating to bonding surface properties of the bonding surface.Type: ApplicationFiled: October 30, 2013Publication date: February 27, 2014Applicant: THE BOEING COMPANYInventors: Eugene A. Dan-Jumbo, Joel Patrick Baldwin