Patents by Inventor Joel Rivera
Joel Rivera has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11862539Abstract: A packaged electronic device includes a substrate having a lead. The lead includes an outward facing side surface having a first height, and an inward facing side surface having a second height that is less than the first height. An electronic device is electrically connected to the lead. A package body encapsulates the electronic device and portions of the lead. The outward facing side surface is exposed through a side surface of the package body, and the inward facing side surface is encapsulated by the package body. A conductive layer is disposed on the outward facing side surface to provide the packaged electronic device with an enhanced wettable flank. In one embodiment, the electronic device is electrically connected to a thick terminal portion having the outward facing side surface. In another embodiment, the electronic device is electrically connected to a thin terminal portion having the inward facing side surface.Type: GrantFiled: August 8, 2022Date of Patent: January 2, 2024Assignee: Amkor Technology Singapore Holding Pte. Ltd.Inventor: Pedro Joel Rivera-Marty
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Publication number: 20230026949Abstract: A packaged electronic device includes a substrate having a lead. The lead includes an outward facing side surface having a first height, and an inward facing side surface having a second height that is less than the first height. An electronic device is electrically connected to the lead. A package body encapsulates the electronic device and portions of the lead. The outward facing side surface is exposed through a side surface of the package body, and the inward facing side surface is encapsulated by the package body. A conductive layer is disposed on the outward facing side surface to provide the packaged electronic device with an enhanced wettable flank. In one embodiment, the electronic device is electrically connected to a thick terminal portion having the outward facing side surface. In another embodiment, the electronic device is electrically connected to a thin terminal portion having the inward facing side surface.Type: ApplicationFiled: August 8, 2022Publication date: January 26, 2023Applicant: Amkor Technology Singapore Holding Pte. Ltd.Inventor: Pedro Joel Rivera-Marty
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Patent number: 11410916Abstract: A packaged electronic device includes a substrate having a lead. The lead includes an outward facing side surface having a first height, and an inward facing side surface having a second height that is less than the first height. An electronic device is electrically connected to the lead. A package body encapsulates the electronic device and portions of the lead. The outward facing side surface is exposed through a side surface of the package body, and the inward facing side surface is encapsulated by the package body. A conductive layer is disposed on the outward facing side surface to provide the packaged electronic device with an enhanced wettable flank. In one embodiment, the electronic device is electrically connected to a thick terminal portion having the outward facing side surface. In another embodiment, the electronic device is electrically connected to a thin terminal portion having the inward facing side surface.Type: GrantFiled: October 30, 2020Date of Patent: August 9, 2022Assignee: Amkor Technology Singapore Holding Pte. Ltd.Inventor: Pedro Joel Rivera-Marty
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Publication number: 20210050284Abstract: A packaged electronic device includes a substrate having a lead. The lead includes an outward facing side surface having a first height, and an inward facing side surface having a second height that is less than the first height. An electronic device is electrically connected to the lead. A package body encapsulates the electronic device and portions of the lead. The outward facing side surface is exposed through a side surface of the package body, and the inward facing side surface is encapsulated by the package body. A conductive layer is disposed on the outward facing side surface to provide the packaged electronic device with an enhanced wettable flank. In one embodiment, the electronic device is electrically connected to a thick terminal portion having the outward facing side surface. In another embodiment, the electronic device is electrically connected to a thin terminal portion having the inward facing side surface.Type: ApplicationFiled: October 30, 2020Publication date: February 18, 2021Applicant: Amkor Technology Singapore Holding Pte. Ltd.Inventor: Pedro Joel Rivera-Marty
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Patent number: 10825755Abstract: A packaged electronic device includes a substrate having a lead. The lead includes an outward facing side surface having a first height, and an inward facing side surface having a second height that is less than the first height. An electronic device is electrically connected to the lead. A package body encapsulates the electronic device and portions of the lead. The outward facing side surface is exposed through a side surface of the package body, and the inward facing side surface is encapsulated by the package body. A conductive layer is disposed on the outward facing side surface to provide the packaged electronic device with an enhanced wettable flank. In one embodiment, the electronic device is electrically connected to a thick terminal portion having the outward facing side surface. In another embodiment, the electronic device is electrically connected to a thin terminal portion having the inward facing side surface.Type: GrantFiled: January 4, 2020Date of Patent: November 3, 2020Assignee: Amkor Technology Singapore Holding Pte. Ltd.Inventor: Pedro Joel Rivera-Marty
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Publication number: 20200144164Abstract: A packaged electronic device includes a substrate having a lead. The lead includes an outward facing side surface having a first height, and an inward facing side surface having a second height that is less than the first height. An electronic device is electrically connected to the lead. A package body encapsulates the electronic device and portions of the lead. The outward facing side surface is exposed through a side surface of the package body, and the inward facing side surface is encapsulated by the package body. A conductive layer is disposed on the outward facing side surface to provide the packaged electronic device with an enhanced wettable flank. In one embodiment, the electronic device is electrically connected to a thick terminal portion having the outward facing side surface. In another embodiment, the electronic device is electrically connected to a thin terminal portion having the inward facing side surface.Type: ApplicationFiled: January 4, 2020Publication date: May 7, 2020Applicant: Amkor Technology, Inc.Inventor: Pedro Joel Rivera-Marty
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Patent number: 10529655Abstract: A packaged electronic device includes a substrate having a lead. The lead includes an outward facing side surface having a first height, and an inward facing side surface having a second height that is less than the first height. An electronic device is electrically connected to the lead. A package body encapsulates the electronic device and portions of the lead. The outward facing side surface is exposed through a side surface of the package body, and the inward facing side surface is encapsulated by the package body. A conductive layer is disposed on the outward facing side surface to provide the packaged electronic device with an enhanced wettable flank. In one embodiment, the electronic device is electrically connected to a thick terminal portion having the outward facing side surface. In another embodiment, the electronic device is electrically connected to a thin terminal portion having the inward facing side surface.Type: GrantFiled: December 21, 2018Date of Patent: January 7, 2020Assignee: Amkor Technology, Inc.Inventor: Pedro Joel Rivera-Marty
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Publication number: 20190148270Abstract: A packaged electronic device includes a substrate having a lead. The lead includes an outward facing side surface having a first height, and an inward facing side surface having a second height that is less than the first height. An electronic device is electrically connected to the lead. A package body encapsulates the electronic device and portions of the lead. The outward facing side surface is exposed through a side surface of the package body, and the inward facing side surface is encapsulated by the package body. A conductive layer is disposed on the outward facing side surface to provide the packaged electronic device with an enhanced wettable flank. In one embodiment, the electronic device is electrically connected to a thick terminal portion having the outward facing side surface. In another embodiment, the electronic device is electrically connected to a thin terminal portion having the inward facing side surface.Type: ApplicationFiled: December 21, 2018Publication date: May 16, 2019Applicant: Amkor Technology, Inc.Inventor: Pedro Joel Rivera-Marty
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Patent number: 10199312Abstract: A packaged electronic device includes a substrate having a lead. The lead includes an outward facing side surface having a first height, and an inward facing side surface having a second height that is less than the first height. An electronic device is electrically connected to the lead. A package body encapsulates the electronic device and portions of the lead. The outward facing side surface is exposed through a side surface of the package body, and the inward facing side surface is encapsulated by the package body. A conductive layer is disposed on the outward facing side surface to provide the packaged electronic device with an enhanced wettable flank. In one embodiment, the electronic device is electrically connected to a thick terminal portion having the outward facing side surface. In another embodiment, the electronic device is electrically connected to a thin terminal portion having the inward facing side surface.Type: GrantFiled: September 9, 2017Date of Patent: February 5, 2019Assignee: AMKOR TECHNOLOGY, INC.Inventor: Pedro Joel Rivera-Marty
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Patent number: 6227981Abstract: The present invention contemplates an improved ball ramp assembly that enables even the most severely handicapped bowler to guide and accelerate a bowling ball toward the intended bowling pins. The bowling ramp assembly includes a ramp having a ball guide defining a ball path along the ramp, a base coupled to a proximal end of the ramp for supporting the ramp, a ball release coupled to the ramp for selectively controlling travel of the ball along the ramp, and a positioning assembly coupled to the ramp for adjusting the orientation of the ramp. The ball release includes a ball stopping member that moves between a ball blocking position and a ball releasing position. The positioning assembly includes at least one motor coupled to the ramp and a wheel located at the distal end of the ramp. The ball release and positioning assembly are both controlled by switches which may be located remotely from the ramp.Type: GrantFiled: February 17, 1999Date of Patent: May 8, 2001Assignee: University of Puerto RicoInventors: Mauricio Anibal Lizama Troncoso, David Serrano, Joel Rivera, José Soto, Raul Jordan, Lorenzo Detres