Abstract: A die including a substrate having a surface defined by paired oppositely-oriented edges; and an optical material, in a non-rectangular shape, and on the surface of the substrate; wherein the optical material does not extend an entire length of any one of the paired oppositely-oriented edges is disclosed, A wafer can including a plurality of the dies. Methods of making the wafer and the die are also disclosed.

Abstract: With a sensor and method, it is possible for platinum resistor elements to be used advantageously as heating elements, temperature sensors, printed circuit traces, or as chemically resistant electron beam sensitive layers. To ensure a long-lasting adhesion of the platinum resistance layer to a dielectric substrate, even during exposure to temperatures which are elevated over ambient temperature and under dry and most atmospheric conditions, a thin adhesion layer of platinum silicide, for example, is deposited between the platinum resistance layer and the dielectric substrate. Resistor elements patterned from the platinum layer can advantageously be used in temperature sensors, mass flow sensors, chemical sensors, gas sensors, or humidity sensors.

Abstract: A sensor has a thin film element, the thin film element having a temperature-dependent electrical resistance. The thin film element includes a platinum layer, which is doped with zircon or zircon oxide. The thin film element can be arranged on a membrane to create a mass airflow sensor.