Patents by Inventor Joerg Schepers

Joerg Schepers has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10061729
    Abstract: A system for a multiple chip architecture that enables different system on-chip (SoC) systems with varying compatibilities to interact as one SoC via a transparent interface. The system address maps of the single SoCs are configured so that each provide a system address map of the two SoCs without overlap or address re-mapping when connected to one another via the transparent interface. The transparent interface enables components related to safety/security and interrupt communication of a first and second SoC within the multiple chip system to transparently communicate and interact. The transparent interface can enable sources of both SoCs to be flexibly mapped to interrupt services providers on the first/second SoC within the multiple chip system.
    Type: Grant
    Filed: March 19, 2018
    Date of Patent: August 28, 2018
    Assignee: Ifineon Technologies AG
    Inventors: Albrecht Mayer, Joerg Schepers, Frank Hellwig
  • Publication number: 20180210852
    Abstract: A system for a multiple chip architecture that enables different system on-chip (SoC) systems with varying compatibilities to interact as one SoC via a transparent interface. The system address maps of the single SoCs are configured so that each provide a system address map of the two SoCs without overlap or address re-mapping when connected to one another via the transparent interface. The transparent interface enables components related to safety/security and interrupt communication of a first and second SoC within the multiple chip system to transparently communicate and interact. The transparent interface can enable sources of both SoCs to be flexibly mapped to interrupt services providers on the first/second SoC within the multiple chip system.
    Type: Application
    Filed: March 19, 2018
    Publication date: July 26, 2018
    Inventors: Albrecht Mayer, Joerg Schepers, Frank Hellwig
  • Patent number: 9946674
    Abstract: A system for a multiple chip architecture that enables different system on-chip (SoC) systems with varying compatibilities to interact as one SoC via a transparent interface. The system address maps of the single SoCs are configured so that each provide a system address map of the two SoCs without overlap or address re-mapping when connected to one another via the transparent interface. The transparent interface enables components related to safety/security and interrupt communication of a first and second SoC within the multiple chip system to transparently communicate and interact. The transparent interface can enable sources of both SoCs to be flexibly mapped to interrupt services providers on the first/second SoC within the multiple chip system.
    Type: Grant
    Filed: April 28, 2016
    Date of Patent: April 17, 2018
    Assignee: Infineon Technologies AG
    Inventors: Albrecht Mayer, Joerg Schepers, Frank Hellwig
  • Publication number: 20170315944
    Abstract: A system for a multiple chip architecture that enables different system on-chip (SoC) systems with varying compatibilities to interact as one SoC via a transparent interface. The system address maps of the single SoCs are configured so that each provide a system address map of the two SoCs without overlap or address re-mapping when connected to one another via the transparent interface. The transparent interface enables components related to safety/security and interrupt communication of a first and second SoC within the multiple chip system to transparently communicate and interact. The transparent interface can enable sources of both SoCs to be flexibly mapped to interrupt services providers on the first/second SoC within the multiple chip system.
    Type: Application
    Filed: April 28, 2016
    Publication date: November 2, 2017
    Inventors: Albrecht Mayer, Joerg Schepers, Frank Hellwig
  • Publication number: 20080128872
    Abstract: The disclosure relates to a semiconductor device and a method for producing a semiconductor device, in particular a semiconductor device having a circuit region having at least one active component for processing a high-frequency electromagnetic signal.
    Type: Application
    Filed: November 30, 2007
    Publication date: June 5, 2008
    Applicant: INFINEON TECHNOLOGIES AG
    Inventor: Joerg Schepers
  • Patent number: 7025278
    Abstract: In order to detect attempted interventions in the vicinity of a smart card, a sensor hierarchy is used. Abnormal operating states are first detected by less sensitive sensors that are connected upstream and which then activate sensors which are connected downstream and have a relatively high degree of sensitivity, or increase the sensitivity of sensors connected downstream.
    Type: Grant
    Filed: November 21, 2001
    Date of Patent: April 11, 2006
    Assignee: Infineon Technologies AG
    Inventor: Jörg Schepers
  • Patent number: 6397333
    Abstract: The copy protection system is a combination of a signature method and a coding or encryption method that uses a variable key. The data set is written only onto a predetermined device and it is released to a host for reading and deciphering only upon proper authorization. Copying of the encrypted data set is entirely useless, because the dataset is signed with a unique identification (e.g. the serial number) of the device.
    Type: Grant
    Filed: October 7, 1998
    Date of Patent: May 28, 2002
    Assignee: Infineon Technologies AG
    Inventors: Peter Söhne, Jörg Schepers, Dietmar Zaig, Michael Smola