Abstract: A rotor disk for guiding workpieces in a double-sided processing machine including a fluid feeding apparatus to feed a processing fluid into a working gap between a first working disk and a second working disk is provided. The rotor disk comprises a surface defining at least one workpiece opening configured to receive at least one workpiece to be processed on both sides in the double-sided processing machine in a material-removing manner using the processing fluid. A contact angle of a drop of the processing fluid with the surface is at least 60°.

Abstract: A method for casting a ring-shaped plastic frame comprises providing two mold parts, wherein at least one of the two molds parts includes at least one ring-shaped seat. Positioning a rotor disk between the two mold parts where the rotor disk comprises at least one annular recess. Engaging a mold core with at least a portion of each of the two mold parts. The mold core comprises at least one casting channel configured to attach at one end to a supply of plastified plastic. Inserting at least one mold insert into the at least one ring-shaped seat. A mold volume is defined by the at least one mold insert, the mold core and an edge of the at least one annular recess, wherein the mold volume is configured to fluidly connect with the at least one casting channel to receive plastified plastic to form a plastic frame.

Abstract: A method for measuring the thickness of flat workpieces processed in a double-side processing machine comprises processing the workpieces in a working gap formed between an upper working disk and a lower working disk configured to remove material from the workpieces. Optically measuring the thickness of the workpieces during processing by at least one optical thickness measurement apparatus disposed on at least one of the upper working disk or the lower working disk. The at least one optical thickness measurement apparatus configured to measure the thickness of the workpieces disposed in the working gap through at least one through-hole in a corresponding upper working disk or the lower working disk. Supplying the measurement results of the at least one thickness measurement apparatus to a control apparatus of the double-side processing machine. Terminating the processing of the workpieces once a previously specified target thickness of the workpieces is reached.

Abstract: The invention relates to a method for machining flat workpieces in a double-sided machining tool, which has an upper and a lower work disk, wherein at least one of the work disks is rotatingly driven and the work disks each have an annular work surface, wherein the work surfaces amongst themselves limit an also annular work gap, in which at least one carrier is located, which guides at least one workpiece in the work gap, so that the at least one workpiece is machined in a double-sided manner between the work surfaces. The distance between the work disks is measured at at least two radially spaced measurement locations of the work gap and in that, from the measured distances, a distance between the work disks is determined at a location of the work gap representing the thickness of the at least one workpiece machined in the work gap.

Abstract: The invention relates to a method for machining flat workpieces in a double-sided machining tool, which has an upper and a lower work disk, wherein at least one of the work disks is rotatingly driven and the work disks each have an annular work surface, wherein the work surfaces amongst themselves limit an also annular work gap, in which at least one carrier is located, which guides at least one workpiece in the work gap, so that the at least one workpiece is machined in a double-sided manner between the work surfaces. The distance between the work disks is measured at least two radially spaced measurement locations of the work gap and in that, from the measured distances, a distance between the work disks is determined at a location of the work gap representing the thickness of the at least one workpiece machined in the work gap.

Abstract: The invention relates to a method for measuring the thickness of a discoidal workpiece, which serves as a substrate for electronic components, comprising the steps: infrared radiation is directed at the top side of the workpiece, wherein a first radiation portion is reflected on the top side and a second radiation portion penetrates the workpiece thickness, is reflected on the bottom side of the workpiece and emerges again on the top side of the workpiece, the first and the second radiation portion interfere under formation of an interference pattern and the optical workpiece thickness between the top side of the workpiece and the bottom side of the workpiece is determined using the interference pattern. It is provided according to the invention that the mechanical workpiece thickness is determined from a measurement of the intensity of the infrared radiation reflected and/or transmitted from the workpiece.