Patents by Inventor Johan F. Ploeg

Johan F. Ploeg has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Thermal device with ionized air flow
    Publication number: 20100149719
    Abstract: In some embodiments a thermal device such as a heat sink cools an electronic device. An electrokinetic airflow generating device uses a positively charged source and also uses at least a portion of the thermal device as a negatively charged or grounded probe to provide electrokinetically driven airflow. Other embodiments are described and claimed.
    Type: Application
    Filed: December 31, 2009
    Publication date: June 17, 2010
    Inventors: Johan F. Ploeg, Seri Lee
  • THERMAL DEVICE WITH ELECTROKINETIC AIR FLOW
    Publication number: 20090168344
    Abstract: In some embodiments a thermal device such as a heat sink cools an electronic device. An electrokinetic airflow generating device uses a positively charged source and also uses at least a portion of the thermal device as a negatively charged or grounded probe to provide electrokinetically driven airflow. Other embodiments are described and claimed.
    Type: Application
    Filed: December 31, 2007
    Publication date: July 2, 2009
    Inventors: Johan F. Ploeg, Seri Lee
  • Spring loaded heat sink retention mechanism
    Patent number: 7495922
    Abstract: Methods and apparatus to provide a spring loaded heat dissipative device retention mechanism are described. In one embodiment, one or more pins with spring portions are used to maintain a spring force between a heat dissipative device and a printed circuit board. Other embodiments are also described.
    Type: Grant
    Filed: March 29, 2007
    Date of Patent: February 24, 2009
    Assignee: Intel Corporation
    Inventors: Johan F. Ploeg, Seri Lee
  • SPRING LOADED HEAT SINK RETENTION MECHANISM
    Publication number: 20080239678
    Abstract: Methods and apparatus to provide a spring loaded heat dissipative device retention mechanism are described. In one embodiment, one or more pins with spring portions are used to maintain a spring force between a heat dissipative device and a printed circuit board. Other embodiments are also described.
    Type: Application
    Filed: March 29, 2007
    Publication date: October 2, 2008
    Inventors: Johan F. Ploeg, Seri Lee
  • Permanent thermal packer method
    Patent number: 4444263
    Abstract: A permanent thermal packer is disclosed for sealing the annulus between an injection tubing string and a well casing. The packer is thermal cement and is placed from within the injection tubing string to seal a substantial portion of the annulus above the injection zone. The packer provides a means for sealing the annulus above the injection zone thus permitting insulating material to be placed in the annulus above the packer with the expectation that it will not be damaged by well bore fluids.
    Type: Grant
    Filed: April 22, 1983
    Date of Patent: April 24, 1984
    Assignee: Chevron Research Company
    Inventors: Johan F. Ploeg, Arlo L. Oden
  • Permanent thermal packer
    Patent number: 4403656
    Abstract: A permanent thermal packer is disclosed for sealing the annulus between an injection tubing string and a well casing. The packer is thermal cement and is placed from within the injection tubing string to seal a substantial portion of the annulus above the injection zone. The packer provides a means for sealing the annulus above the injection zone thus permitting insulating material to be placed in the annulus above the packer with the expectation that it will not be damaged by well bore fluids.
    Type: Grant
    Filed: July 29, 1981
    Date of Patent: September 13, 1983
    Assignee: Chevron Research Company
    Inventors: Johan F. Ploeg, Arlo L. Oden