Patents by Inventor Johannes Geradus Willms

Johannes Geradus Willms has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 9048232
    Abstract: A package is connected at a first side to a printed circuit board and with a die fixed to it on a second side opposite to the first side. The package has an integrated pre-match circuit to provide an impedance match for a signal to be sent to a circuit external to the package. The signal has a predetermined main frequency component. The pre-match circuit has a pair of transmission lines and a pair of stubs on a predetermined layer of the package and connected to the pair of transmission lines. The pair of stubs have a length such as to form a short circuit for an harmonic frequency of the main frequency component in the signal.
    Type: Grant
    Filed: April 30, 2012
    Date of Patent: June 2, 2015
    Assignee: Dialog Semiconductor B.V.
    Inventors: Laurentius Cornelis Colussi, Johannes Geradus Willms
  • Publication number: 20130286620
    Abstract: A package is connected at a first side to a printed circuit board and with a die fixed to it on a second side opposite to the first side. The package has an integrated pre-match circuit to provide an impedance match for a signal to be sent to a circuit external to the package. The signal has a predetermined main frequency component. The pre-match circuit has a pair of transmission lines and a pair of stubs on a predetermined layer of the package and connected to the pair of transmission lines. The pair of stubs have a length such as to form a short circuit for an harmonic frequency of the main frequency component in the signal.
    Type: Application
    Filed: April 30, 2012
    Publication date: October 31, 2013
    Applicant: DIALOG SEMICONDUCTOR B.V.
    Inventors: Laurentius Cornelis Colussi, Johannes Geradus Willms