Abstract: The invention relates to a soldering apparatus comprising: a soldering chamber; transporting means for transporting the objects to be soldered through the soldering chamber; and heating means for heating the objects to be soldered in the soldering chamber, wherein the heating means are formed by means for feeding heated gas to the chamber. A simple device is thus obtained which heats uniformly. Such an apparatus can be embodied in both closed and open form. According to one of the preferred embodiments the means for feeding heated gas are formed by at least one heating unit, wherein the heating units are each formed by a fan and at least one heating device, for instance an electrical heating filament, connected forwardly thereof. Cooling units can also be used.

Abstract: A transport device for carriers (43,45,47) which can be coupled with a follower element (9) displaceable in two orthogonal transport directions (X,Y) by means of centering members (49,51) secured on the follower element, the carrier (43,45,47) is pivotable together with a guide (75,77) about an axis of rotation (71) parallel to one of the transport directions (X,Y) and is thus decoupled from and coupled with the centering members (49,51). The transport device may be used more particularly for plate-shaped carriers, but also for carriers provided with two parallel and straight guiding edges.