Abstract: A semiconductor device includes a semiconductor substrate having a first dopant and a second dopant. A covalent atomic radius of a material of the semiconductor substrate is i) larger than a covalent atomic radius of the first dopant and smaller than a covalent atomic radius of the second dopant, or ii) smaller than the covalent atomic radius of the first dopant and larger than the covalent atomic radius of the second dopant. The semiconductor device further includes a semiconductor layer on the semiconductor substrate and semiconductor device elements in the semiconductor layer. A vertical concentration profile of the first dopant decreases along at least 80% of a distance between an interface of the semiconductor substrate and the semiconductor layer to a surface of the semiconductor substrate opposite to the interface.

Abstract: A method of manufacturing a semiconductor device includes providing a semiconductor substrate having opposing first and second main surfaces and first and second dopants. A covalent atomic radius of a material of the substrate is i) larger than a covalent atomic radius of the first dopant and smaller than that of the second dopant, or ii) smaller than the covalent atomic radius of the first dopant and larger than that of the second dopant. A vertical extension of the first dopant into the substrate from the first main surface ends at a bottom of a substrate portion at a first vertical distance to the first main surface. The method further includes forming a semiconductor layer on the first main surface, forming semiconductor device elements in the semiconductor layer, and reducing a thickness of the substrate by removing material from the second main surface at least up to the substrate portion.

Abstract: A method for forming a power semiconductor device is provided. The method includes: providing a semiconductor wafer grown by a Czochralski process and having a first side; forming an n-type substrate doping layer in the semiconductor wafer at the first side, the substrate doping layer having a doping concentration of at least 1017/cm3; and forming an epitaxy layer on the first side of the semiconductor wafer after forming the n-type substrate doping layer.

Abstract: A method of manufacturing a semiconductor device includes providing a semiconductor substrate having opposing first and second main surfaces and first and second dopants. A covalent atomic radius of a material of the substrate is i) larger than a covalent atomic radius of the first dopant and smaller than that of the second dopant, or ii) smaller than the covalent atomic radius of the first dopant and larger than that of the second dopant. A vertical extension of the first dopant into the substrate from the first main surface ends at a bottom of a substrate portion at a first vertical distance to the first main surface. The method further includes forming a semiconductor layer on the first main surface, forming semiconductor device elements in the semiconductor layer, and reducing a thickness of the substrate by removing material from the second main surface at least up to the substrate portion.

Abstract: A conveying device for molten metal in an injection die casting unit, has a storage container for the molten metal and a conveying duct delivering the molten metal to a mold cavity. The conveying duct includes a cylinder bore with a piston disposed in an axially adjustable manner. A collection chamber, from which the molten metal is introduced through an onward line into the mold cavity upon axial displacement of the piston, is provided for the molten metal. An annular space, which is connected via at least one filling bore to the collection chamber, is formed between the outer wall of the piston and the inner wall of the cylinder bore. The filling bore, on an end which opens into the collection chamber, is closable by means of a valve body which is connected to an adjustable valve rod which is displaceably disposed in an axial bore of the piston.

Abstract: A conveying device for molten metal in an injection die casting unit, has a storage container for the molten metal and a conveying duct delivering the molten metal to a mold cavity. The conveying duct includes a cylinder bore with a piston disposed in an axially adjustable manner. A collection chamber, from which the molten metal is introduced through an onward line into the mold cavity upon axial displacement of the piston, is provided for the molten metal. An annular space, which is connected via at least one filling bore to the collection chamber, is formed between the outer wall of the piston and the inner wall of the cylinder bore. The filling bore, on an end which opens into the collection chamber, is closable by means of a valve body which is connected to an adjustable valve rod which is displaceably disposed in an axial bore of the piston.

Abstract: A device for automated pipetting of small volumes of liquid has a pipetting needle, a diluter having a liquid output with a syringe and a valve, the syringe including a piston and a piston drive. Tubing interconnects the needle and the liquid output of the diluter, the tubing and diluter containing a substantially incompressible liquid. An impulse generator is connected in the device and coupled to the incompressible liquid in the tubing for generating and applying directly to the liquid in the tubing a mechanical impulse force of at least 0.01 N.multidot.s for separating liquid from the needle.

Abstract: A method of sensing traffic and detecting traffic situations on roads (AS), preferably freeways. With measuring points (measuring cross sections MQ1, MQ2, . . . ) set up for the purpose for vehicle detection using traffic sensors (VS) and with a traffic data processing arrangement (VDVE) for traffic control, at regular intervals traffic data (VD), such as vehicle speed (v), traffic intensity (Q) and traffic density (K), are determined and traffic parameters determined therefrom are formed in a traffic data processing system (VDA). Two adjacent measuring points. (MQi, MQ(i+1) form a measuring section (MA) of a given length (l).

Abstract: A hospital bed includes a frame assembly having a two-part mattress support comprised of a head mattress support and a foot mattress support, with the head mattress support including a head portion and a horizontal ramp articulated to one another, and with the foot mattress support including an front portion and a rear portion articulated to one another. The head mattress support is movable in a horizontal direction relative to the foot mattress support and tiltable in a vertical direction while the front portion of the foot mattress support is tiltable in a vertical direction, with the rear portion of the foot matress support movable between outer and inner positions to allow formation of an opening when the rear portion of the foot mattress support is moved to inner position. An upwardly open toilet pan which is supported by the frame assembly is movable in position for vertical registry with the opening when the rear portion of the foot mattress support occupies the inner position.