Abstract: A machine for separative machining of a plate-shaped workpiece by a processing beam. The machine has a first movement unit for moving the workpiece in a first direction, a second movement unit for moving a processing head in a second direction, two workpiece bearing supports for bearing the workpiece, and a parts chute. The two workpiece bearing supports are separated from each other by a gap that extends along the second direction. The parts chute is movable between a first chute position and a second chute position so as to move a cut-free workpiece part that has dropped into the gap, laterally away from the gap. The machine includes a receiving unit movable in the second direction, to receive the cut-free workpiece part at a transfer position and transport the workpiece part to one or more discharging positions of the machine along the second direction.

Abstract: A machine for separative machining of a plate-shaped workpiece by a processing beam. The machine has a first movement unit for moving the workpiece in a first direction, a second movement unit for moving a processing head in a second direction, two workpiece bearing supports for bearing the workpiece, and a parts chute. The two workpeice bearing supports are separated from each other by a gap that extends along the second direction. The parts chute is movable between a first chute position and a second chute position so as to move a cut-free workpiece part that has dropped into the gap, laterally away from the gap. The machine includes a receiving unit movable in the second direction, to receive the cut-free workpiece part at a transfer position and transport the workpiece part to one or more discharging positions of the machine along the second direction.

Abstract: The invention relates to machines and methods for separative machining of a plate-shaped workpiece by a processing beam. The machines include a first movement unit configured to move the workpiece in a first direction and a second movement unit configured to move a machining head configured to emit the processing beam. The second movement unit is configured to move the machining head in a second direction perpendicular to the first direction to direct the processing beam onto the workpiece. The machines include a first workpiece support unit including a first workpiece-bearing face and a second workpiece support unit including a second workpiece-bearing face spaced apart by a gap from the first workpiece support unit and the first workpiece-bearing face. The gap extends along the second direction. The machines include at least two support slides configured to move in the gap in the second direction mutually independent of one another.

Abstract: The invention relates to machines and methods for separative machining of a plate-shaped workpiece by a processing beam. The machines include a first movement unit configured to move the workpiece in a first direction and a second movement unit configured to move a machining head configured to emit the processing beam. The second movement unit is configured to move the machining head in a second direction perpendicular to the first direction to direct the processing beam onto the workpiece. The machines include a first workpiece support unit including a first workpiece-bearing face and a second workpiece support unit including a second workpiece-bearing face spaced apart by a gap from the first workpiece support unit and the first workpiece-bearing face. The gap extends along the second direction. The machines include at least two support slides configured to move in the gap in the second direction mutually independent of one another.