Patents by Inventor Johannes Vandenbroeke

Johannes Vandenbroeke has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Automated assembly of semiconductor devices using a pair of lead frames
    Patent number: 5614759
    Abstract: Semiconductor rectifier devices having oppositely extending terminals lying in a common plane are fabricated using upper and lower lead frames each comprising a pair of parallel side rails and spaced apart cross bars extending between the side rails. Cantilevered terminals are mounted along the cross bars. The cross bars of the upper frame lie in a plane downwardly off-set from the plane of the upper frame, and the cross bars of the lower frame lie in a plane upwardly off-set from the plane of the lower frame. Free ends of the terminals of the upper frame lie in a plane upwardly off-set from the plane of the upper frame cross bars, and free ends of the terminals of the lower frame are off-set downwardly from the plane of the lower frame cross bars. Semiconductor chips are mounted on the terminal free ends of the lower frame, and the upper frame is disposed on top of the lower frame with the upper frame terminals contacting the chips.
    Type: Grant
    Filed: December 28, 1995
    Date of Patent: March 25, 1997
    Assignee: General Instrument Corp.
    Inventors: William Vandenheuvel, Johannes Vandenbroeke
  • Automated assembly of semiconductor devices using a pair of lead frames
    Patent number: 5506174
    Abstract: Semiconductor rectifier devices having oppositely extending terminals lying in a common plane are fabricated using upper and lower lead frames each comprising a pair of parallel side rails and spaced apart cross bars extending between the side rails. Cantilevered terminals are mounted along the cross bars. The cross bars of the upper frame lie in a plane downwardly off-set from the plane of the upper frame, and the cross bars of the lower frame lie in a plane upwardly off-set from the plane of the lower frame. Free ends of the terminals of the upper frame lie in a plane upwardly off-set from the plane of the upper frame cross bars, and free ends of the terminals of the lower frame are off-set downwardly from the plane of the lower frame cross bars. Semiconductor chips are mounted on the terminal free ends of the lower frame, and the upper frame is disposed on top of the lower frame with the upper frame terminals contacting the chips.
    Type: Grant
    Filed: July 12, 1994
    Date of Patent: April 9, 1996
    Assignee: General Instrument Corp.
    Inventors: William Vandenheuvel, Johannes Vandenbroeke