Abstract: The present invention relates to a method of preventing, treating or inhibiting the development of tumors or metastases in a subject and to an immunomodulator for use in such therapy, in combination with a chemotherapeutic agent. An aspect the present invention is a method of preventing, treating, reducing, inhibiting and/or controlling the formation or establishment of metastasis of a primary neoplasia, tumor or cancer at one or more sites distinct from a primary neoplasia, tumor or cancer, in a subject intended to undergo chemotherapy, wherein the method comprises administering to the subject, a therapeutically effective amount of an antimetabolite pyrimidine analogue and an immunomodulator.

Abstract: The present invention relates to a method of preventing, treating or inhibiting the development of tumors or metastases in a subject and to an immunomodulator for use in such therapy, in combination with a chemotherapeutic agent. An aspect the present invention is a method of preventing, treating, reducing, inhibiting and/or controlling the formation or establishment of metastasis of a primary neoplasia, tumor or cancer at one or more sites distinct from a primary neoplasia, tumor or cancer, in a subject intended to undergo chemotherapy, wherein the method comprises administering to the subject, a therapeutically effective amount of an antimetabolite pyrimidine analogue and an immunomodulator.

Abstract: Metal leads are formed on a copper conductive layer by applying a first resist and a main resist over the first resist, and forming aligned openings in these resist. A bottom layer of cover metal such as gold is plated onto the copper conductive layer in these openings, followed by a principal metal such as copper. The main resist is then removed so as to expose edges of the principal metal layer. A jacket of cover metal is plated onto the exposed edges and surfaces of the principal metal layer. During this stage, the first resist prevents deposition of the cover metal except on the leads. The jacket merges with the bottom layer of cover material, so as to form a continuous coating extending around the perimeters of the leads. The first resist is removed, and the conductive layer is etched away. The cover metal protects the principal metal during the etching stage.

Abstract: A method of connecting a semiconductor chip assembly having at least first and second contacts to a connection component including at least first and second connection leads by means of a tool consisting of the steps of juxtaposing moving and connecting the leads to the corresponding contacts. The connection component is juxtaposed with the semiconductor chip assembly so that the first and second connection leads are aligned with the first and second contacts in such a manner that the first connection lead is offset from the first contact in the first direction and the second connection lead is offset from the second contact in the same first direction.

Abstract: A method of connecting a semiconductor chip assembly having at least first and second contacts to a connection component including at least first and second connection leads by means of a tool consisting of the steps of juxtaposing moving and connecting the leads to the corresponding contacts. The connection component is juxtaposed with the semiconductor chip assembly so that the first and second connection leads are aligned with the first and second contacts in such a manner that the first connection lead is offset from the first contact in the first direction and the second connection lead is offset from the second contact in the same first direction.

Abstract: In a semiconductor inner lead bonding process, a connection component having leads is disposed on the chip surface so that the leads lie above the contacts. A bond region of each lead is forced downwardly by a tool into engagement with a contact on the chip while a first or proximal end of the lead remains attached to a dielectric support structure. The lead is deformed into an S-shaped configuration by moving the bonding tool horizontally towards the proximal or first end of the lead, thereby forcing the bonding region towards the first end and bending or buckling the lead. Alternatively, the lead is bent downwardly by a tool and the tool may then be disengaged from the lead, shifted away from the proximal end of the lead and again advanced downwardly to secure the lead to the chip contact.

Abstract: A bonding tool for bonding inner leads to semiconductor chips is arranged to capture and align elongated lead sections extending in any one of plural directions, and preferably, in any one of two mutually orthogonal directions. Thus, the tool can be applied to align and bond all of the leads to a chip without turning the tool or the chip even where the leads extend in multiple directions.

Abstract: A flexible transfer line for delivering coolant from a storage dewar to cool superconducting circuitry is provided with a delivery capillary coupled to the storage dewar, this capillary being thermally isolated from ambient temperatures. The transfer line has an outer flexible support coaxial with the delivery capillary, and an inner flexible shield between the delivery capillary and the outer flexible support. Heat in the shield is continuously removed to thereby provide the thermal isolation of the delivery capillary. The thermal isolation allows a low-flow rate of coolant through the delivery capillary since inefficiences due to thermal conduction and radiation are substantially eliminated.

Abstract: A system for delivering a cryogenic fluid to cool devices, such as electronic devices, in an open-cycle environment. The system comprises a dewar which stores a cold fluid, a cryogenic module for holding a device to be cooled and a cold fluid transfer line which delivers the cold fluid from the dewar to the device within the cryogenic module. The system further comprises an interlock mechanism to hold the transfer line and the dewar securely together and a coupling mechanism to allow the transfer line to securely engage the cryogenic module. The system also comprises a control subsystem which monitors and controls the flow of cold fluid from the dewar and through the transfer line.

Abstract: An improved open-cycle cooling apparatus in which a cooling chamber holding a device to be cooled is coupled with a cold fluid delivery system and, in which the cold fluid delivery system includes a delivery tube which directs a stream of cold fluid to strike the device and a return which vents the expended cold fluid from the cooling chamber. The improvement comprises a rigid enclosure formed within the chamber and configured to adaptively engage one end of the cold fluid delivery tube. The device to be cooled is disposed within the enclosure. The enclosure also includes a return to remove expended cold fluid from the cooling chamber to the return of the cold fluid delivery stystem. The improvement further comprises an alignment guide disposed within the enclosure between the device to be cooled and the one end of the cold fluid delivery tube engaged to the enclosure.