Abstract: A flux for use in soldering comprises a first constituent and one or more secondary constituents that is selected from solvents, thickeners, and/or metal oxide reducing agents. The flux has a temperature profile in which the flux is in a non-flowable inactive state at temperatures at and below a maximum storage temperature that is above about 27° C., a liquid active state at an activation temperature, and a flowable inactive state in a deposition temperature range above the maximum storage temperature and below the activation temperature. A solder material comprises solder particles dispersed in the flux.

Abstract: A flux for use in soldering comprises a primary solids constituent present in an amount greater than about 50 wt. % and one or more secondary constituents that is selected from solvents, thickeners, and/or metal oxide reducing agents. The flux has a temperature profile in which the flux is in a non-flowable inactive state at temperatures at and below a maximum storage temperature that is above about 27° C., a liquid active state at an activation temperature, and a flowable inactive state in a deposition temperature range above the maximum storage temperature and below the activation temperature. A solder material comprises solder particles dispersed in the flux.

Abstract: A flux for use in soldering comprises a first constituent and one or more secondary constituents that is selected from solvents, thickeners, and/or metal oxide reducing agents. The flux has a temperature profile in which the flux is in a non-flowable inactive state at temperatures at and below a maximum storage temperature that is above about 27° C., a liquid active state at an activation temperature, and a flowable inactive state in a deposition temperature range above the maximum storage temperature and below the activation temperature. A solder material comprises solder particles dispersed in the flux.

Abstract: A flux for use in soldering comprises a primary solids constituent present in an amount greater than about 50 wt. % and one or more secondary constituents that is selected from solvents, thickeners, and/or metal oxide reducing agents. The flux has a temperature profile in which the flux is in a non-flowable inactive state at temperatures at and below a maximum storage temperature that is above about 27° C., a liquid active state at an activation temperature, and a flowable inactive state in a deposition temperature range above the maximum storage temperature and below the activation temperature. A solder material comprises solder particles dispersed in the flux.

Abstract: A soldering system for melting a solder to form a joint between a first workpiece and a second workpiece is described. The system may comprise an energy generating system, a soldering tip, and a dispenser adapted to dispense controlled amounts of the solder. The soldering tip includes a non-wetting solder contact layer in operative communication with the energy generating system. The energy generating system may include induction, electrical, or heat generating systems in communication with the soldering tip. The non-wetting solder contact layer comprises a material that is not wettable by the molten solder. The system permits control of an amount of the solder in the joint.

Abstract: A soldering system for melting a solder to form a joint between a first workpiece and a second workpiece is described. The system may comprise an energy generating system, a soldering tip, and a dispenser adapted to dispense controlled amounts of the solder. The soldering tip includes a non-wetting solder contact layer in operative communication with the energy generating system. The energy generating system may include induction, electrical, or heat generating systems in communication with the soldering tip. The non-wetting solder contact layer comprises a material that is not wettable by the molten solder. The system permits control of an amount of the solder in the joint.