Patents by Inventor John C. Crumpton

John C. Crumpton has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20180289082
    Abstract: This invention provides improved printed heaters for use in wearable garments. The improvement comprises replacing the single large area resistive material layer with a number of small patches of resistive material, i.e., replacing the single large area heater with a number of smaller individual heaters. Printing of the resistive material is facilitated since the area of each resistive material patch is greatly reduced. In addition, some embodiments enable the opportunity to provide a breathable heater.
    Type: Application
    Filed: March 26, 2018
    Publication date: October 11, 2018
    Inventors: MICHAEL ZANONI BURROWS, JOHN C. CRUMPTON, JEFFREY J. G. DEE, DANIEL ANEURIN INNS, MARK ALLAN LAMONTIA, MEHRDAD MEHDIZADEH
  • Patent number: 8986579
    Abstract: This invention provides a method for using a polymer thick film conductor composition to form an electrical conductor in an electrical circuit, the method subjecting the deposited thick film conductor composition to lamination. The invention also provides a method for reducing the resistance of an electrical conductor formed from a polymer thick film conductor composition, the method comprising the step of subjecting the electrical conductor to lamination. The invention further provides devices containing electrical conductors made by these methods.
    Type: Grant
    Filed: February 24, 2014
    Date of Patent: March 24, 2015
    Assignee: E I du Pont de Nemours and Company
    Inventors: Larry Alan Bidwell, Michael J. Champ, John C. Crumpton, Jay Robert Dorfman
  • Publication number: 20140170411
    Abstract: This invention provides a method for using a polymer thick film conductor composition to form an electrical conductor in an electrical circuit, the method subjecting the deposited thick film conductor composition to lamination. The invention also provides a method for reducing the resistance of an electrical conductor formed from a polymer thick film conductor composition, the method comprising the step of subjecting the electrical conductor to lamination. The invention further provides devices containing electrical conductors made by these methods.
    Type: Application
    Filed: February 24, 2014
    Publication date: June 19, 2014
    Applicant: E I DU PONT DE NEMOURS AND COMPANY
    Inventors: LARRY ALAN BIDWELL, Michael J. Champ, John C. Crumpton, Jay Robert Dorfman
  • Patent number: 8696860
    Abstract: This invention provides a method for using a polymer thick film conductor composition to form an electrical conductor in an electrical circuit, the method subjecting the deposited thick film conductor composition to lamination. The invention also provides a method for reducing the resistance of an electrical conductor formed from a polymer thick film conductor composition, the method comprising the step of subjecting the electrical conductor to lamination. The invention further provides devices containing electrical conductors made by these methods.
    Type: Grant
    Filed: October 10, 2012
    Date of Patent: April 15, 2014
    Assignee: E I du Pont de Nemours and Company
    Inventors: Larry Alan Bidwell, Michael James Champ, John C. Crumpton, Jay Robert Dorfman
  • Publication number: 20140099499
    Abstract: This invention provides a method for using a polymer thick film conductor composition to form an electrical conductor in an electrical circuit, the method subjecting the deposited thick film conductor composition to lamination. The invention also provides a method for reducing the resistance of an electrical conductor formed from a polymer thick film conductor composition, the method comprising the step of subjecting the electrical conductor to lamination. The invention further provides devices containing electrical conductors made by these methods.
    Type: Application
    Filed: October 10, 2012
    Publication date: April 10, 2014
    Applicant: E I DU PONT DE NEMOURS AND COMPANY
    Inventors: LARRY Alan BIDWELL, Michael J. Champ, John C. Crumpton, Jay Robert Dorfman
  • Patent number: 8562808
    Abstract: The invention is directed to a polymer thick film silver composition comprising: (a) conductive silver flakes and (b) an organic medium consisting of (1) acrylic organic polymeric binder; and (2) organic solvent. The composition may be processed at a time and energy sufficient to remove all solvent. The invention is further directed to novel method(s) of circuitry formation on printed wiring board constructions.
    Type: Grant
    Filed: September 17, 2010
    Date of Patent: October 22, 2013
    Assignee: E I du Pont de Nemours and Company
    Inventors: John C. Crumpton, Jay Robert Dorfman
  • Publication number: 20110281024
    Abstract: Disclosed is the use of carbon layers as barriers to prevent silver migration in circuitry crossovers, either over a bottom circuitry layer and/or beneath subsequent circuit layers.
    Type: Application
    Filed: November 11, 2010
    Publication date: November 17, 2011
    Applicant: E. I. DU PONT DE NEMOURS AND COMPANY
    Inventors: John C. Crumpton, Robert Paul Waldrop
  • Publication number: 20110068011
    Abstract: The invention is directed to a polymer thick film silver composition comprising: (a) conductive silver flakes and (b) an organic medium comprising (1) acrylic organic polymeric binder; and (2) organic solvent. The composition may be processed at a time and energy sufficient to remove all solvent. The invention is further directed to novel method(s) of circuitry formation on printed wiring board constructions.
    Type: Application
    Filed: September 17, 2010
    Publication date: March 24, 2011
    Applicant: E.I. DU PONT DE NEMOURS AND COMPANY
    Inventors: John C. Crumpton, Jay Robert Dorfman