Abstract: A multilayer circuit board system or laminated circuit board system for use in a motor controller includes a motherboard, at least one power substrate circuit board, and a capacitor circuit board. The power substrate module includes a mounting area provided in a recess, window or portion of the circuit board where the circuit board is only a single layer thick. The single circuit board layer at the mounting area provides a heat conductive yet highly electrically insulated mounting area for receiving a heat sink. The heat sink can be mounted on a side opposite the electrical device. The capacitor circuit board, power substrate circuit board, and mother circuit board are interconnected without the use of external connectors or wires. A flexible circuit board layer or SCM.TM. interconnect interface allows the circuit boards to be connected solely by printed circuit (PC) wires.

Abstract: A solder resist pattern for a single in-line package (SIP) finger connector, or other interface member includes small solder resist features spaced closely together. The features can be circular, square, diamond-shaped, star-shaped, or other geometry and preferably are placed on finger connectors in a photo-imaging process. The pattern includes meniscus channels which are narrow enough to prevent solder from adhering to the finger connectors. The surface area of the features is small enough so that the pattern can be easily removed by a low impact or non-contact operation. Preferably, the pattern is removed by a hot air solder knife after the board is subjected to a solder wave.

Abstract: A multilayer circuit board or laminated circuit board for use in a motor controller is described. The multilayer circuit board is preferably utilized as a power substrate module. The power substrate module includes a mounting area provided in a recess, window or portion of the circuit board where the circuit board is only a single layer thick. The insulated mounting area is provided in a blind via in the multilayer circuit board. The single circuit board layer at the mounting area provides a heat conductive yet highly electrically insulated mounting area for receiving a heat sink. The heat sink can be mounted on a side opposite the electrical device. The heat sink may be standard heat sink or a copper coil directly soldered to the circuit board. The multilayer circuit board includes an enhanced conductive layer for receiving the surface mount device. The enhanced conductive layer preferably includes an insulative frame which holds copper slugs.

Abstract: A rigid-flex multilayer circuit board or laminated circuit board includes an insulated mounting area for a surface mount package. The mounting area is provided in a recess or portion of the circuit board where the circuit board is only a single flexible circuit board layer thick. The insulated mounting area is provided in a blind via in the multilayer circuit board. The insulating medium associated with the single flexible circuit board layer is less than 2.0 mils thick and includes polyimide. The single flexible circuit board layer provides a heat conductive yet highly electrically insulative mounting area for receiving a heat sink. The heat sink can be mounted on a side opposite the electrical device. The heat sink may be a standard heat sink or a copper coil directly soldered to the circuit board. The heat sink mounting area eliminates the need for bolts, nuts, brackets, and an additional insulating layer necessary to insulate power semiconductor components.

Abstract: A mounting for a single in-line package (SIP) module includes an elongated slot aperture for receiving an edge of the module. The module may be a circuit board or other electrical device and preferably includes edge finger connectors. The elongated slot aperture preferably includes hemicylinders located about the periphery. The hemicylinders provide plated through conductors for connecting to the finger connectors of the module. The aperture is made according to an advantageous method in which the aperture is etched in order to remove barbs or extra copper material caused by milling the aperture. Preferably, the module fits into the aperture with an interference or size-on-size fit. The aperture may include strain relief areas.

Abstract: A package for enclosing and mounting a multichip module to a printed wiring board including a ceramic base with an elevated peripheral ledge constructed of a material, having a coefficient of thermal expansion differing substantially from the coefficient of thermal expansion of the material of a serpentine sidewall mounted to the base, and having a lid mounted to the top of the sidewall. The package includes electrical contacts extending through the ledge for connecting the multichip module to the circuit board. The sidewall is a series of interconnected short segments having acute angles at their interconnection forming a pleated shape.

Abstract: A package for enclosing and mounting a multichip module in which separate mechanisms are provided for mechanically attaching the package to a circuit board and for electrically connecting the package to the circuit board to which it is attached. The package includes a ceramic base on which the multichip module is supported, a frame-like retaining ring which enables the attachment of the package to the circuit board and a lid for covering the top of the package and sealing it off from environmental influences. The package also includes a set of electrical leads extending from the interior to the exterior of the package for providing multiple separate connections between the multichip module and the circuit board on which it is mounted.

Abstract: Printed wiring boards using surface mount and other components are manufactured using a double-sided tape assembly. The tape assembly is composed of a soluble base layer coated on each side with an adhesive layer, and these layers are sandwiched between top and bottom protective release paper layers. Holes are formed in the tape assembly corresponding to the location of solder pads on the printed wiring board, and the tape assembly is adhered to the printed wiring board after removal of the bottom adhesive layer. Solder paste is applied to the top release layer, filling the holes in the tape assembly. The top release layer is removed, exposing the top adhesive layer, and the component is pressed onto the adhesive layer with its terminations in registry with the solder-filled holes. The board assembly is then soldered, and the remaining base and adhesive layers of the tape assembly are removed by action of a solvent during cleaning.