Patents by Inventor John C. Milliken

John C. Milliken has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Surface mount chip package having an array of solder ball contacts arranged in a circle and conductive pin contacts arranged outside the circular array
    Patent number: 5490040
    Abstract: An electrical device for logic circuits having a package comprising a combination of controlled collapse electrical interconnections, such as solder balls and pin through-hole conductors, wherein the conductors are disposed outside the perimeter of an inter-array of solder balls, which when a maximum number of solder balls are disposed, the array is circular in shape, so as to provide an increased footprint for the electrical device beyond that, otherwise maximum footprint for solder balls alone, which footprint is otherwise limited in size due to failures which occur in solder balls when solder balls are exposed to thermal and mechanical stress levels at extended distances from the neutral or zero stress point of the array.
    Type: Grant
    Filed: December 22, 1993
    Date of Patent: February 6, 1996
    Assignee: International Business Machines Corporation
    Inventors: Gene J. Gaudenzi, Joseph M. Mosley, Vito J. Tuozzolo, John C. Milliken
  • Interconnection structure and test method
    Patent number: 5147084
    Abstract: Disclosed is a connector structure on a substrate which includes at least one first solder portion on the surface of the substrate; at least one second solder portion connected to each of the at least one first solder portions; and an epoxy layer disposed about the at least one first and second solder portions in such a manner as to cover the first solder portion and contact, but not cover, the second solder portion. Also disclosed is a connector structure on a substrate which includes at least one first solder portion on the surface of said substrate; at least one second solder ball portion connected to the at least one first solder portions; wherein the melting point of the second solder ball portion is relatively higher than that of the first solder portion. Finally, disclosed is a method of testing the solderability of the above structures.
    Type: Grant
    Filed: August 9, 1991
    Date of Patent: September 15, 1992
    Assignee: International Business Machines Corporation
    Inventors: John R. Behun, Anson J. Call, Francis F. Cappo, Marie S. Cole, Karl G. Hoebener, Bruno T. Klingel, John C. Milliken
  • Interconnection structure and test method
    Patent number: 5060844
    Abstract: Disclosed is a connector structure on a substrate which includes at least one first solder portion on the surface of the substrate; at least one second solder portion connected to each of the at least one first solder portions; and an epoxy layer disposed about the at least one first and second solder portions in such a manner as to cover the first solder portion and contact, but not cover, the second solder portion.Also disclosed is a connector structure on a substrate which includes at least one first solder portion on the surface of said substrate; at least one second solder ball portion connected to the at least one first solder portions; wherein the melting point of the second solder ball portion is relatively higher than that of the first solder portion.Finally, disclosed is a method of testing the solderability of the above structures.
    Type: Grant
    Filed: July 18, 1990
    Date of Patent: October 29, 1991
    Assignee: International Business Machines Corporation
    Inventors: John R. Behun, Anson J. Call, Francis F. Cappo, Marie S. Cole, Karl G. Hoebener, Bruno T. Klingel, John C. Milliken