Patents by Inventor John C. Selby

John C. Selby has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Flexible microchannel heat exchanger
    Patent number: 6904966
    Abstract: A flexible mesoscopic heat exchanger is provided by the invention. The heat exchanger of the invention includes uniform microchannels for fluid flow. Separate header and channel layers include microchannels for fluid flow and heat exchange. A layered structure with channels aligned in multiple orientations in the layers permits the use of a flexible material without channel sagging and provides uniform flows. In a preferred embodiment, layers are heat sealed, e.g., by a preferred lamination fabrication process.
    Type: Grant
    Filed: October 16, 2003
    Date of Patent: June 14, 2005
    Assignee: The Board of Trustees of the University of Illinois
    Inventors: Michael I. Philpott, Mark A. Shannon, John C. Selby
  • Flexible microchannel heat exchanger
    Patent number: 6827128
    Abstract: A flexible mesoscopic heat exchanger is provided by the invention. The heat exchanger of the invention includes uniform microchannels for fluid flow. Separate header and channel layers include microchannels for fluid flow and heat exchange. A layered structure with channels aligned in multiple orientations in the layers permits the use of a flexible material without channel sagging and provides uniform flows. In a preferred embodiment, layers are heat sealed, e.g., by a preferred lamination fabrication process.
    Type: Grant
    Filed: May 20, 2002
    Date of Patent: December 7, 2004
    Assignee: The Board of Trustees of the University of Illinois
    Inventors: Michael I. Philpott, Mark A. Shannon, John C. Selby
  • FLEXIBLE MICROCHANNEL HEAT EXCHANGER
    Publication number: 20030213580
    Abstract: A flexible mesoscopic heat exchanger is provided by the invention. The heat exchanger of the invention includes uniform microchannels for fluid flow. Separate header and channel layers include microchannels for fluid flow and heat exchange. A layered structure with channels aligned in multiple orientations in the layers permits the use of a flexible material without channel sagging and provides uniform flows. In a preferred embodiment, layers are heat sealed, e.g., by a preferred lamination fabrication process.
    Type: Application
    Filed: May 20, 2002
    Publication date: November 20, 2003
    Applicant: The Board of Trustees of the University of Illinoi s
    Inventors: Michael I. Philpott, Mark A. Shannon, John C. Selby