Abstract: A vending machine adapted for dispensing at least one pre-packaged food product includes a microwave oven. The microwave oven includes a magnetron that emits microwave electromagnetic radiation, a housing that defines a microwave cavity for receiving the food product. The housing defines a first opening to allow passage of the pre-packaged food product between outside of the microwave cavity and inside of the microwave cavity. The microwave oven also includes a first chain door that selectively covers the first opening so as to prevent the microwave electromagnetic radiation from escaping the housing through the first opening.

Abstract: A radio frequency (RF) mixing device wherein RF core circuit elements requiring signal splitting are provided with one or more signal splitting element(s) (“balun(s)”) integrated on-chip with the core RF circuit elements. The RF mixing device comprises one or more RF circuit element(s) integrated on a common substrate with one or more balun(s), wherein the common substrate is an insulating substrate further provided with associated silicon-based CMOS circuitry formed in a thin, highly crystalline silicon layer formed on the insulating substrate. The insulating substrate is selected from transparent crystalline materials such as sapphire, spinel, etc. The common substrate is preferably ultrathin silicon-on-sapphire.

Abstract: A radio frequency (RF) mixing device wherein RF core circuit elements requiring signal splitting are provided with one or more signal splitting element(s) (“balun(s)”) integrated on-chip with the core RF circuit elements. The RF mixing device comprises one or more RF circuit element(s) integrated on a common substrate with one or more balun(s), wherein the common substrate is an insulating substrate further provided with associated silicon-based CMOS circuitry formed in a thin, highly crystalline silicon layer formed on the insulating substrate. The insulating substrate is selected from transparent crystalline materials such as sapphire, spinel, etc. The common substrate is preferably ultrathin silicon-on-sapphire.